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Bibliographic details for 18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)

Citation styles for 18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)

APA style

18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated). (2024, July 26). WikiPatents, . Retrieved 05:39, September 17, 2024 from http://wikipatents.org/index.php?title=18158225._EMBEDDED_TRACE_SUBSTRATES_(ETSs)_WITH_T-SHAPED_INTERCONNECTS_WITH_REDUCED-WIDTH_EMBEDDED_METAL_TRACES,_AND_RELATED_INTEGRATED_CIRCUIT_(IC)_PACKAGES_AND_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=203613.

MLA style

"18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)." WikiPatents, . 26 Jul 2024, 02:22 UTC. 17 Sep 2024, 05:39 <http://wikipatents.org/index.php?title=18158225._EMBEDDED_TRACE_SUBSTRATES_(ETSs)_WITH_T-SHAPED_INTERCONNECTS_WITH_REDUCED-WIDTH_EMBEDDED_METAL_TRACES,_AND_RELATED_INTEGRATED_CIRCUIT_(IC)_PACKAGES_AND_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=203613>.

MHRA style

WikiPatents contributors, '18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)', WikiPatents, , 26 July 2024, 02:22 UTC, <http://wikipatents.org/index.php?title=18158225._EMBEDDED_TRACE_SUBSTRATES_(ETSs)_WITH_T-SHAPED_INTERCONNECTS_WITH_REDUCED-WIDTH_EMBEDDED_METAL_TRACES,_AND_RELATED_INTEGRATED_CIRCUIT_(IC)_PACKAGES_AND_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=203613> [accessed 17 September 2024]

Chicago style

WikiPatents contributors, "18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)," WikiPatents, , http://wikipatents.org/index.php?title=18158225._EMBEDDED_TRACE_SUBSTRATES_(ETSs)_WITH_T-SHAPED_INTERCONNECTS_WITH_REDUCED-WIDTH_EMBEDDED_METAL_TRACES,_AND_RELATED_INTEGRATED_CIRCUIT_(IC)_PACKAGES_AND_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=203613 (accessed September 17, 2024).

CBE/CSE style

WikiPatents contributors. 18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated) [Internet]. WikiPatents, ; 2024 Jul 26, 02:22 UTC [cited 2024 Sep 17]. Available from: http://wikipatents.org/index.php?title=18158225._EMBEDDED_TRACE_SUBSTRATES_(ETSs)_WITH_T-SHAPED_INTERCONNECTS_WITH_REDUCED-WIDTH_EMBEDDED_METAL_TRACES,_AND_RELATED_INTEGRATED_CIRCUIT_(IC)_PACKAGES_AND_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=203613.

Bluebook style

18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated), http://wikipatents.org/index.php?title=18158225._EMBEDDED_TRACE_SUBSTRATES_(ETSs)_WITH_T-SHAPED_INTERCONNECTS_WITH_REDUCED-WIDTH_EMBEDDED_METAL_TRACES,_AND_RELATED_INTEGRATED_CIRCUIT_(IC)_PACKAGES_AND_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=203613 (last visited September 17, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18158225._EMBEDDED_TRACE_SUBSTRATES_(ETSs)_WITH_T-SHAPED_INTERCONNECTS_WITH_REDUCED-WIDTH_EMBEDDED_METAL_TRACES,_AND_RELATED_INTEGRATED_CIRCUIT_(IC)_PACKAGES_AND_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=203613",
   note = "[Online; accessed 17-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18158225._EMBEDDED_TRACE_SUBSTRATES_(ETSs)_WITH_T-SHAPED_INTERCONNECTS_WITH_REDUCED-WIDTH_EMBEDDED_METAL_TRACES,_AND_RELATED_INTEGRATED_CIRCUIT_(IC)_PACKAGES_AND_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=203613}",
   note = "[Online; accessed 17-September-2024]"
 }


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