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Citation styles for 18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, July 26). WikiPatents, . Retrieved 17:39, September 19, 2024 from http://wikipatents.org/index.php?title=18598250._MULTI-DIE_PACKAGE_STRUCTURES_INCLUDING_REDISTRIBUTION_LAYERS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=203538.

MLA style

"18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 26 Jul 2024, 02:17 UTC. 19 Sep 2024, 17:39 <http://wikipatents.org/index.php?title=18598250._MULTI-DIE_PACKAGE_STRUCTURES_INCLUDING_REDISTRIBUTION_LAYERS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=203538>.

MHRA style

WikiPatents contributors, '18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 26 July 2024, 02:17 UTC, <http://wikipatents.org/index.php?title=18598250._MULTI-DIE_PACKAGE_STRUCTURES_INCLUDING_REDISTRIBUTION_LAYERS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=203538> [accessed 19 September 2024]

Chicago style

WikiPatents contributors, "18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18598250._MULTI-DIE_PACKAGE_STRUCTURES_INCLUDING_REDISTRIBUTION_LAYERS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=203538 (accessed September 19, 2024).

CBE/CSE style

WikiPatents contributors. 18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jul 26, 02:17 UTC [cited 2024 Sep 19]. Available from: http://wikipatents.org/index.php?title=18598250._MULTI-DIE_PACKAGE_STRUCTURES_INCLUDING_REDISTRIBUTION_LAYERS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=203538.

Bluebook style

18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18598250._MULTI-DIE_PACKAGE_STRUCTURES_INCLUDING_REDISTRIBUTION_LAYERS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=203538 (last visited September 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18598250._MULTI-DIE_PACKAGE_STRUCTURES_INCLUDING_REDISTRIBUTION_LAYERS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=203538",
   note = "[Online; accessed 19-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18598250._MULTI-DIE_PACKAGE_STRUCTURES_INCLUDING_REDISTRIBUTION_LAYERS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=203538}",
   note = "[Online; accessed 19-September-2024]"
 }