Cite This Page
Bibliographic details for 17848844. THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING simplified abstract (Samsung Electronics Co., Ltd.)
- Page name: 17848844. THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING simplified abstract (Samsung Electronics Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 2 January 2024 04:26 UTC
- Date retrieved: 22 September 2024 18:07 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17848844._THREE-DIMENSIONAL_STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20196
- Page Version ID: 20196
Citation styles for 17848844. THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING simplified abstract (Samsung Electronics Co., Ltd.)
APA style
17848844. THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING simplified abstract (Samsung Electronics Co., Ltd.). (2024, January 2). WikiPatents, . Retrieved 18:07, September 22, 2024 from http://wikipatents.org/index.php?title=17848844._THREE-DIMENSIONAL_STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20196.
MLA style
"17848844. THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 2 Jan 2024, 04:26 UTC. 22 Sep 2024, 18:07 <http://wikipatents.org/index.php?title=17848844._THREE-DIMENSIONAL_STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20196>.
MHRA style
WikiPatents contributors, '17848844. THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 2 January 2024, 04:26 UTC, <http://wikipatents.org/index.php?title=17848844._THREE-DIMENSIONAL_STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20196> [accessed 22 September 2024]
Chicago style
WikiPatents contributors, "17848844. THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17848844._THREE-DIMENSIONAL_STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20196 (accessed September 22, 2024).
CBE/CSE style
WikiPatents contributors. 17848844. THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jan 2, 04:26 UTC [cited 2024 Sep 22]. Available from: http://wikipatents.org/index.php?title=17848844._THREE-DIMENSIONAL_STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20196.
Bluebook style
17848844. THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=17848844._THREE-DIMENSIONAL_STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20196 (last visited September 22, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "17848844. THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=17848844._THREE-DIMENSIONAL_STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20196", note = "[Online; accessed 22-September-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "17848844. THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=17848844._THREE-DIMENSIONAL_STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20196}", note = "[Online; accessed 22-September-2024]" }