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Bibliographic details for 17719622. METHOD OF FORMING A WIRING AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

Citation styles for 17719622. METHOD OF FORMING A WIRING AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

APA style

17719622. METHOD OF FORMING A WIRING AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.). (2024, January 2). WikiPatents, . Retrieved 09:43, June 20, 2024 from http://wikipatents.org/index.php?title=17719622._METHOD_OF_FORMING_A_WIRING_AND_METHOD_OF_MANUFACTURING_A_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=19779.

MLA style

"17719622. METHOD OF FORMING A WIRING AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 2 Jan 2024, 03:28 UTC. 20 Jun 2024, 09:43 <http://wikipatents.org/index.php?title=17719622._METHOD_OF_FORMING_A_WIRING_AND_METHOD_OF_MANUFACTURING_A_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=19779>.

MHRA style

WikiPatents contributors, '17719622. METHOD OF FORMING A WIRING AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 2 January 2024, 03:28 UTC, <http://wikipatents.org/index.php?title=17719622._METHOD_OF_FORMING_A_WIRING_AND_METHOD_OF_MANUFACTURING_A_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=19779> [accessed 20 June 2024]

Chicago style

WikiPatents contributors, "17719622. METHOD OF FORMING A WIRING AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17719622._METHOD_OF_FORMING_A_WIRING_AND_METHOD_OF_MANUFACTURING_A_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=19779 (accessed June 20, 2024).

CBE/CSE style

WikiPatents contributors. 17719622. METHOD OF FORMING A WIRING AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jan 2, 03:28 UTC [cited 2024 Jun 20]. Available from: http://wikipatents.org/index.php?title=17719622._METHOD_OF_FORMING_A_WIRING_AND_METHOD_OF_MANUFACTURING_A_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=19779.

Bluebook style

17719622. METHOD OF FORMING A WIRING AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=17719622._METHOD_OF_FORMING_A_WIRING_AND_METHOD_OF_MANUFACTURING_A_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=19779 (last visited June 20, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17719622. METHOD OF FORMING A WIRING AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17719622._METHOD_OF_FORMING_A_WIRING_AND_METHOD_OF_MANUFACTURING_A_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=19779",
   note = "[Online; accessed 20-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17719622. METHOD OF FORMING A WIRING AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17719622._METHOD_OF_FORMING_A_WIRING_AND_METHOD_OF_MANUFACTURING_A_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=19779}",
   note = "[Online; accessed 20-June-2024]"
 }


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