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Bibliographic details for 17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- Page name: 17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 2 January 2024 02:56 UTC
- Date retrieved: 28 June 2024 15:10 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17698611._Semiconductor_Packages_with_Thermal_Lid_and_Methods_of_Forming_the_Same_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19504
- Page Version ID: 19504
Citation styles for 17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
APA style
17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.). (2024, January 2). WikiPatents, . Retrieved 15:10, June 28, 2024 from http://wikipatents.org/index.php?title=17698611._Semiconductor_Packages_with_Thermal_Lid_and_Methods_of_Forming_the_Same_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19504.
MLA style
"17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)." WikiPatents, . 2 Jan 2024, 02:56 UTC. 28 Jun 2024, 15:10 <http://wikipatents.org/index.php?title=17698611._Semiconductor_Packages_with_Thermal_Lid_and_Methods_of_Forming_the_Same_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19504>.
MHRA style
WikiPatents contributors, '17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)', WikiPatents, , 2 January 2024, 02:56 UTC, <http://wikipatents.org/index.php?title=17698611._Semiconductor_Packages_with_Thermal_Lid_and_Methods_of_Forming_the_Same_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19504> [accessed 28 June 2024]
Chicago style
WikiPatents contributors, "17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=17698611._Semiconductor_Packages_with_Thermal_Lid_and_Methods_of_Forming_the_Same_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19504 (accessed June 28, 2024).
CBE/CSE style
WikiPatents contributors. 17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) [Internet]. WikiPatents, ; 2024 Jan 2, 02:56 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=17698611._Semiconductor_Packages_with_Thermal_Lid_and_Methods_of_Forming_the_Same_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19504.
Bluebook style
17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.), http://wikipatents.org/index.php?title=17698611._Semiconductor_Packages_with_Thermal_Lid_and_Methods_of_Forming_the_Same_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19504 (last visited June 28, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=17698611._Semiconductor_Packages_with_Thermal_Lid_and_Methods_of_Forming_the_Same_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19504", note = "[Online; accessed 28-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=17698611._Semiconductor_Packages_with_Thermal_Lid_and_Methods_of_Forming_the_Same_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19504}", note = "[Online; accessed 28-June-2024]" }