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Bibliographic details for 17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- Page name: 17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 2 January 2024 02:54 UTC
- Date retrieved: 20 June 2024 18:33 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485
- Page Version ID: 19485
Citation styles for 17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
APA style
17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.). (2024, January 2). WikiPatents, . Retrieved 18:33, June 20, 2024 from http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485.
MLA style
"17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)." WikiPatents, . 2 Jan 2024, 02:54 UTC. 20 Jun 2024, 18:33 <http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485>.
MHRA style
WikiPatents contributors, '17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)', WikiPatents, , 2 January 2024, 02:54 UTC, <http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485> [accessed 20 June 2024]
Chicago style
WikiPatents contributors, "17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485 (accessed June 20, 2024).
CBE/CSE style
WikiPatents contributors. 17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) [Internet]. WikiPatents, ; 2024 Jan 2, 02:54 UTC [cited 2024 Jun 20]. Available from: http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485.
Bluebook style
17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.), http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485 (last visited June 20, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485", note = "[Online; accessed 20-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485}", note = "[Online; accessed 20-June-2024]" }