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Bibliographic details for 18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation)

Citation styles for 18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation)

APA style

18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation). (2024, January 1). WikiPatents, . Retrieved 07:18, June 27, 2024 from http://wikipatents.org/index.php?title=18456970._UNDERFILL_COMPOSITION,_COATING_FILM,_CURED_FILM,_MULTILAYER_INTERCONNECTION_BOARD,_AND_MANUFACTURING_METHOD_OF_MULTILAYER_INTERCONNECTION_BOARD_simplified_abstract_(FUJIFILM_Corporation)&oldid=18723.

MLA style

"18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation)." WikiPatents, . 1 Jan 2024, 18:23 UTC. 27 Jun 2024, 07:18 <http://wikipatents.org/index.php?title=18456970._UNDERFILL_COMPOSITION,_COATING_FILM,_CURED_FILM,_MULTILAYER_INTERCONNECTION_BOARD,_AND_MANUFACTURING_METHOD_OF_MULTILAYER_INTERCONNECTION_BOARD_simplified_abstract_(FUJIFILM_Corporation)&oldid=18723>.

MHRA style

WikiPatents contributors, '18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation)', WikiPatents, , 1 January 2024, 18:23 UTC, <http://wikipatents.org/index.php?title=18456970._UNDERFILL_COMPOSITION,_COATING_FILM,_CURED_FILM,_MULTILAYER_INTERCONNECTION_BOARD,_AND_MANUFACTURING_METHOD_OF_MULTILAYER_INTERCONNECTION_BOARD_simplified_abstract_(FUJIFILM_Corporation)&oldid=18723> [accessed 27 June 2024]

Chicago style

WikiPatents contributors, "18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18456970._UNDERFILL_COMPOSITION,_COATING_FILM,_CURED_FILM,_MULTILAYER_INTERCONNECTION_BOARD,_AND_MANUFACTURING_METHOD_OF_MULTILAYER_INTERCONNECTION_BOARD_simplified_abstract_(FUJIFILM_Corporation)&oldid=18723 (accessed June 27, 2024).

CBE/CSE style

WikiPatents contributors. 18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation) [Internet]. WikiPatents, ; 2024 Jan 1, 18:23 UTC [cited 2024 Jun 27]. Available from: http://wikipatents.org/index.php?title=18456970._UNDERFILL_COMPOSITION,_COATING_FILM,_CURED_FILM,_MULTILAYER_INTERCONNECTION_BOARD,_AND_MANUFACTURING_METHOD_OF_MULTILAYER_INTERCONNECTION_BOARD_simplified_abstract_(FUJIFILM_Corporation)&oldid=18723.

Bluebook style

18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation), http://wikipatents.org/index.php?title=18456970._UNDERFILL_COMPOSITION,_COATING_FILM,_CURED_FILM,_MULTILAYER_INTERCONNECTION_BOARD,_AND_MANUFACTURING_METHOD_OF_MULTILAYER_INTERCONNECTION_BOARD_simplified_abstract_(FUJIFILM_Corporation)&oldid=18723 (last visited June 27, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18456970._UNDERFILL_COMPOSITION,_COATING_FILM,_CURED_FILM,_MULTILAYER_INTERCONNECTION_BOARD,_AND_MANUFACTURING_METHOD_OF_MULTILAYER_INTERCONNECTION_BOARD_simplified_abstract_(FUJIFILM_Corporation)&oldid=18723",
   note = "[Online; accessed 27-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18456970._UNDERFILL_COMPOSITION,_COATING_FILM,_CURED_FILM,_MULTILAYER_INTERCONNECTION_BOARD,_AND_MANUFACTURING_METHOD_OF_MULTILAYER_INTERCONNECTION_BOARD_simplified_abstract_(FUJIFILM_Corporation)&oldid=18723}",
   note = "[Online; accessed 27-June-2024]"
 }


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