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Bibliographic details for 18362196. 3D MEMORY MULTI-STACK CONNECTION METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

Citation styles for 18362196. 3D MEMORY MULTI-STACK CONNECTION METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

APA style

18362196. 3D MEMORY MULTI-STACK CONNECTION METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.). (2024, January 1). WikiPatents, . Retrieved 21:04, June 20, 2024 from http://wikipatents.org/index.php?title=18362196._3D_MEMORY_MULTI-STACK_CONNECTION_METHOD_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=17970.

MLA style

"18362196. 3D MEMORY MULTI-STACK CONNECTION METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)." WikiPatents, . 1 Jan 2024, 17:38 UTC. 20 Jun 2024, 21:04 <http://wikipatents.org/index.php?title=18362196._3D_MEMORY_MULTI-STACK_CONNECTION_METHOD_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=17970>.

MHRA style

WikiPatents contributors, '18362196. 3D MEMORY MULTI-STACK CONNECTION METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)', WikiPatents, , 1 January 2024, 17:38 UTC, <http://wikipatents.org/index.php?title=18362196._3D_MEMORY_MULTI-STACK_CONNECTION_METHOD_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=17970> [accessed 20 June 2024]

Chicago style

WikiPatents contributors, "18362196. 3D MEMORY MULTI-STACK CONNECTION METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18362196._3D_MEMORY_MULTI-STACK_CONNECTION_METHOD_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=17970 (accessed June 20, 2024).

CBE/CSE style

WikiPatents contributors. 18362196. 3D MEMORY MULTI-STACK CONNECTION METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) [Internet]. WikiPatents, ; 2024 Jan 1, 17:38 UTC [cited 2024 Jun 20]. Available from: http://wikipatents.org/index.php?title=18362196._3D_MEMORY_MULTI-STACK_CONNECTION_METHOD_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=17970.

Bluebook style

18362196. 3D MEMORY MULTI-STACK CONNECTION METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.), http://wikipatents.org/index.php?title=18362196._3D_MEMORY_MULTI-STACK_CONNECTION_METHOD_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=17970 (last visited June 20, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18362196. 3D MEMORY MULTI-STACK CONNECTION METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18362196._3D_MEMORY_MULTI-STACK_CONNECTION_METHOD_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=17970",
   note = "[Online; accessed 20-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18362196. 3D MEMORY MULTI-STACK CONNECTION METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18362196._3D_MEMORY_MULTI-STACK_CONNECTION_METHOD_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=17970}",
   note = "[Online; accessed 20-June-2024]"
 }


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