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Citation styles for 18428245. SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

APA style

18428245. SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.). (2024, July 20). WikiPatents, . Retrieved 05:39, September 17, 2024 from http://wikipatents.org/index.php?title=18428245._SEMICONDUCTOR_DEVICE_PACKAGE_WITH_STRESS_REDUCTION_DESIGN_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=178085.

MLA style

"18428245. SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)." WikiPatents, . 20 Jul 2024, 06:48 UTC. 17 Sep 2024, 05:39 <http://wikipatents.org/index.php?title=18428245._SEMICONDUCTOR_DEVICE_PACKAGE_WITH_STRESS_REDUCTION_DESIGN_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=178085>.

MHRA style

WikiPatents contributors, '18428245. SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)', WikiPatents, , 20 July 2024, 06:48 UTC, <http://wikipatents.org/index.php?title=18428245._SEMICONDUCTOR_DEVICE_PACKAGE_WITH_STRESS_REDUCTION_DESIGN_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=178085> [accessed 17 September 2024]

Chicago style

WikiPatents contributors, "18428245. SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18428245._SEMICONDUCTOR_DEVICE_PACKAGE_WITH_STRESS_REDUCTION_DESIGN_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=178085 (accessed September 17, 2024).

CBE/CSE style

WikiPatents contributors. 18428245. SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) [Internet]. WikiPatents, ; 2024 Jul 20, 06:48 UTC [cited 2024 Sep 17]. Available from: http://wikipatents.org/index.php?title=18428245._SEMICONDUCTOR_DEVICE_PACKAGE_WITH_STRESS_REDUCTION_DESIGN_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=178085.

Bluebook style

18428245. SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.), http://wikipatents.org/index.php?title=18428245._SEMICONDUCTOR_DEVICE_PACKAGE_WITH_STRESS_REDUCTION_DESIGN_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=178085 (last visited September 17, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18428245. SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18428245._SEMICONDUCTOR_DEVICE_PACKAGE_WITH_STRESS_REDUCTION_DESIGN_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=178085",
   note = "[Online; accessed 17-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18428245. SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18428245._SEMICONDUCTOR_DEVICE_PACKAGE_WITH_STRESS_REDUCTION_DESIGN_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=178085}",
   note = "[Online; accessed 17-September-2024]"
 }