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Bibliographic details for 17806660. 3D Embedded Redistribution Layers for IC Substrate Packaging simplified abstract (APPLE INC.)
- Page name: 17806660. 3D Embedded Redistribution Layers for IC Substrate Packaging simplified abstract (APPLE INC.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 1 January 2024 16:52 UTC
- Date retrieved: 16 June 2024 03:39 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17806660._3D_Embedded_Redistribution_Layers_for_IC_Substrate_Packaging_simplified_abstract_(APPLE_INC.)&oldid=17226
- Page Version ID: 17226
Citation styles for 17806660. 3D Embedded Redistribution Layers for IC Substrate Packaging simplified abstract (APPLE INC.)
APA style
17806660. 3D Embedded Redistribution Layers for IC Substrate Packaging simplified abstract (APPLE INC.). (2024, January 1). WikiPatents, . Retrieved 03:39, June 16, 2024 from http://wikipatents.org/index.php?title=17806660._3D_Embedded_Redistribution_Layers_for_IC_Substrate_Packaging_simplified_abstract_(APPLE_INC.)&oldid=17226.
MLA style
"17806660. 3D Embedded Redistribution Layers for IC Substrate Packaging simplified abstract (APPLE INC.)." WikiPatents, . 1 Jan 2024, 16:52 UTC. 16 Jun 2024, 03:39 <http://wikipatents.org/index.php?title=17806660._3D_Embedded_Redistribution_Layers_for_IC_Substrate_Packaging_simplified_abstract_(APPLE_INC.)&oldid=17226>.
MHRA style
WikiPatents contributors, '17806660. 3D Embedded Redistribution Layers for IC Substrate Packaging simplified abstract (APPLE INC.)', WikiPatents, , 1 January 2024, 16:52 UTC, <http://wikipatents.org/index.php?title=17806660._3D_Embedded_Redistribution_Layers_for_IC_Substrate_Packaging_simplified_abstract_(APPLE_INC.)&oldid=17226> [accessed 16 June 2024]
Chicago style
WikiPatents contributors, "17806660. 3D Embedded Redistribution Layers for IC Substrate Packaging simplified abstract (APPLE INC.)," WikiPatents, , http://wikipatents.org/index.php?title=17806660._3D_Embedded_Redistribution_Layers_for_IC_Substrate_Packaging_simplified_abstract_(APPLE_INC.)&oldid=17226 (accessed June 16, 2024).
CBE/CSE style
WikiPatents contributors. 17806660. 3D Embedded Redistribution Layers for IC Substrate Packaging simplified abstract (APPLE INC.) [Internet]. WikiPatents, ; 2024 Jan 1, 16:52 UTC [cited 2024 Jun 16]. Available from: http://wikipatents.org/index.php?title=17806660._3D_Embedded_Redistribution_Layers_for_IC_Substrate_Packaging_simplified_abstract_(APPLE_INC.)&oldid=17226.
Bluebook style
17806660. 3D Embedded Redistribution Layers for IC Substrate Packaging simplified abstract (APPLE INC.), http://wikipatents.org/index.php?title=17806660._3D_Embedded_Redistribution_Layers_for_IC_Substrate_Packaging_simplified_abstract_(APPLE_INC.)&oldid=17226 (last visited June 16, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17806660. 3D Embedded Redistribution Layers for IC Substrate Packaging simplified abstract (APPLE INC.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=17806660._3D_Embedded_Redistribution_Layers_for_IC_Substrate_Packaging_simplified_abstract_(APPLE_INC.)&oldid=17226",
note = "[Online; accessed 16-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17806660. 3D Embedded Redistribution Layers for IC Substrate Packaging simplified abstract (APPLE INC.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=17806660._3D_Embedded_Redistribution_Layers_for_IC_Substrate_Packaging_simplified_abstract_(APPLE_INC.)&oldid=17226}",
note = "[Online; accessed 16-June-2024]"
}
