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Bibliographic details for 18415798. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- Page name: 18415798. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 19 July 2024 09:06 UTC
- Date retrieved: 17 September 2024 05:42 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18415798._SUBSTRATE_BONDING_APPARATUS_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=166645
- Page Version ID: 166645
Citation styles for 18415798. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
APA style
18415798. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.). (2024, July 19). WikiPatents, . Retrieved 05:42, September 17, 2024 from http://wikipatents.org/index.php?title=18415798._SUBSTRATE_BONDING_APPARATUS_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=166645.
MLA style
"18415798. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 19 Jul 2024, 09:06 UTC. 17 Sep 2024, 05:42 <http://wikipatents.org/index.php?title=18415798._SUBSTRATE_BONDING_APPARATUS_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=166645>.
MHRA style
WikiPatents contributors, '18415798. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 19 July 2024, 09:06 UTC, <http://wikipatents.org/index.php?title=18415798._SUBSTRATE_BONDING_APPARATUS_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=166645> [accessed 17 September 2024]
Chicago style
WikiPatents contributors, "18415798. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18415798._SUBSTRATE_BONDING_APPARATUS_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=166645 (accessed September 17, 2024).
CBE/CSE style
WikiPatents contributors. 18415798. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jul 19, 09:06 UTC [cited 2024 Sep 17]. Available from: http://wikipatents.org/index.php?title=18415798._SUBSTRATE_BONDING_APPARATUS_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=166645.
Bluebook style
18415798. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=18415798._SUBSTRATE_BONDING_APPARATUS_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=166645 (last visited September 17, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18415798. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18415798._SUBSTRATE_BONDING_APPARATUS_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=166645", note = "[Online; accessed 17-September-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18415798. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18415798._SUBSTRATE_BONDING_APPARATUS_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_DEVICE_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=166645}", note = "[Online; accessed 17-September-2024]" }