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Bibliographic details for 17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)
- Page name: 17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 1 January 2024 05:54 UTC
- Date retrieved: 26 September 2024 04:59 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653
- Page Version ID: 16653
Citation styles for 17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)
APA style
17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation). (2024, January 1). WikiPatents, . Retrieved 04:59, September 26, 2024 from http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653.
MLA style
"17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)." WikiPatents, . 1 Jan 2024, 05:54 UTC. 26 Sep 2024, 04:59 <http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653>.
MHRA style
WikiPatents contributors, '17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)', WikiPatents, , 1 January 2024, 05:54 UTC, <http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653> [accessed 26 September 2024]
Chicago style
WikiPatents contributors, "17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653 (accessed September 26, 2024).
CBE/CSE style
WikiPatents contributors. 17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jan 1, 05:54 UTC [cited 2024 Sep 26]. Available from: http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653.
Bluebook style
17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653 (last visited September 26, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653", note = "[Online; accessed 26-September-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653}", note = "[Online; accessed 26-September-2024]" }