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Bibliographic details for 17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation)
- Page name: 17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 1 January 2024 05:53 UTC
- Date retrieved: 27 June 2024 10:10 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17848615._ORGANIC_ADHESION_PROMOTOR_FOR_DIELECTRIC_ADHESION_TO_A_COPPER_TRACE_simplified_abstract_(Intel_Corporation)&oldid=16647
- Page Version ID: 16647
Citation styles for 17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation)
APA style
17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation). (2024, January 1). WikiPatents, . Retrieved 10:10, June 27, 2024 from http://wikipatents.org/index.php?title=17848615._ORGANIC_ADHESION_PROMOTOR_FOR_DIELECTRIC_ADHESION_TO_A_COPPER_TRACE_simplified_abstract_(Intel_Corporation)&oldid=16647.
MLA style
"17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation)." WikiPatents, . 1 Jan 2024, 05:53 UTC. 27 Jun 2024, 10:10 <http://wikipatents.org/index.php?title=17848615._ORGANIC_ADHESION_PROMOTOR_FOR_DIELECTRIC_ADHESION_TO_A_COPPER_TRACE_simplified_abstract_(Intel_Corporation)&oldid=16647>.
MHRA style
WikiPatents contributors, '17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation)', WikiPatents, , 1 January 2024, 05:53 UTC, <http://wikipatents.org/index.php?title=17848615._ORGANIC_ADHESION_PROMOTOR_FOR_DIELECTRIC_ADHESION_TO_A_COPPER_TRACE_simplified_abstract_(Intel_Corporation)&oldid=16647> [accessed 27 June 2024]
Chicago style
WikiPatents contributors, "17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=17848615._ORGANIC_ADHESION_PROMOTOR_FOR_DIELECTRIC_ADHESION_TO_A_COPPER_TRACE_simplified_abstract_(Intel_Corporation)&oldid=16647 (accessed June 27, 2024).
CBE/CSE style
WikiPatents contributors. 17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jan 1, 05:53 UTC [cited 2024 Jun 27]. Available from: http://wikipatents.org/index.php?title=17848615._ORGANIC_ADHESION_PROMOTOR_FOR_DIELECTRIC_ADHESION_TO_A_COPPER_TRACE_simplified_abstract_(Intel_Corporation)&oldid=16647.
Bluebook style
17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=17848615._ORGANIC_ADHESION_PROMOTOR_FOR_DIELECTRIC_ADHESION_TO_A_COPPER_TRACE_simplified_abstract_(Intel_Corporation)&oldid=16647 (last visited June 27, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=17848615._ORGANIC_ADHESION_PROMOTOR_FOR_DIELECTRIC_ADHESION_TO_A_COPPER_TRACE_simplified_abstract_(Intel_Corporation)&oldid=16647",
note = "[Online; accessed 27-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=17848615._ORGANIC_ADHESION_PROMOTOR_FOR_DIELECTRIC_ADHESION_TO_A_COPPER_TRACE_simplified_abstract_(Intel_Corporation)&oldid=16647}",
note = "[Online; accessed 27-June-2024]"
}
