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Bibliographic details for 17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2023, December 14). WikiPatents, . Retrieved 18:55, June 23, 2024 from http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160.

MLA style

"17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 14 Dec 2023, 12:41 UTC. 23 Jun 2024, 18:55 <http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160>.

MHRA style

WikiPatents contributors, '17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 14 December 2023, 12:41 UTC, <http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160> [accessed 23 June 2024]

Chicago style

WikiPatents contributors, "17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160 (accessed June 23, 2024).

CBE/CSE style

WikiPatents contributors. 17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2023 Dec 14, 12:41 UTC [cited 2024 Jun 23]. Available from: http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160.

Bluebook style

17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160 (last visited June 23, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160",
   note = "[Online; accessed 23-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160}",
   note = "[Online; accessed 23-June-2024]"
 }


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