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Bibliographic details for 17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2023, December 14). WikiPatents, . Retrieved 06:39, June 20, 2024 from http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160.

MLA style

"17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 14 Dec 2023, 12:41 UTC. 20 Jun 2024, 06:39 <http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160>.

MHRA style

WikiPatents contributors, '17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 14 December 2023, 12:41 UTC, <http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160> [accessed 20 June 2024]

Chicago style

WikiPatents contributors, "17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160 (accessed June 20, 2024).

CBE/CSE style

WikiPatents contributors. 17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2023 Dec 14, 12:41 UTC [cited 2024 Jun 20]. Available from: http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160.

Bluebook style

17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160 (last visited June 20, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160",
   note = "[Online; accessed 20-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=17837312._HEAT_DISSIPATION_STRUCTURES_FOR_INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16160}",
   note = "[Online; accessed 20-June-2024]"
 }


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