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Bibliographic details for 17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Page name: 17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 14 December 2023 12:36 UTC
- Date retrieved: 28 June 2024 01:56 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125
- Page Version ID: 16125
Citation styles for 17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
APA style
17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2023, December 14). WikiPatents, . Retrieved 01:56, June 28, 2024 from http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125.
MLA style
"17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 14 Dec 2023, 12:36 UTC. 28 Jun 2024, 01:56 <http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125>.
MHRA style
WikiPatents contributors, '17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 14 December 2023, 12:36 UTC, <http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125> [accessed 28 June 2024]
Chicago style
WikiPatents contributors, "17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125 (accessed June 28, 2024).
CBE/CSE style
WikiPatents contributors. 17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2023 Dec 14, 12:36 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125.
Bluebook style
17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125 (last visited June 28, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ", year = "2023", url = "http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125", note = "[Online; accessed 28-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ", year = "2023", url = "\url{http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125}", note = "[Online; accessed 28-June-2024]" }