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Bibliographic details for US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract
- Page name: US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 6 December 2023 08:41 UTC
- Date retrieved: 25 September 2024 12:20 UTC
- Permanent URL: http://wikipatents.org/index.php?title=US_Patent_Application_18359416._System_and_Method_for_Bonding_Semiconductor_Devices_simplified_abstract&oldid=14666
- Page Version ID: 14666
Citation styles for US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract
APA style
US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract. (2023, December 6). WikiPatents, . Retrieved 12:20, September 25, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18359416._System_and_Method_for_Bonding_Semiconductor_Devices_simplified_abstract&oldid=14666.
MLA style
"US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract." WikiPatents, . 6 Dec 2023, 08:41 UTC. 25 Sep 2024, 12:20 <http://wikipatents.org/index.php?title=US_Patent_Application_18359416._System_and_Method_for_Bonding_Semiconductor_Devices_simplified_abstract&oldid=14666>.
MHRA style
WikiPatents contributors, 'US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract', WikiPatents, , 6 December 2023, 08:41 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18359416._System_and_Method_for_Bonding_Semiconductor_Devices_simplified_abstract&oldid=14666> [accessed 25 September 2024]
Chicago style
WikiPatents contributors, "US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18359416._System_and_Method_for_Bonding_Semiconductor_Devices_simplified_abstract&oldid=14666 (accessed September 25, 2024).
CBE/CSE style
WikiPatents contributors. US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract [Internet]. WikiPatents, ; 2023 Dec 6, 08:41 UTC [cited 2024 Sep 25]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18359416._System_and_Method_for_Bonding_Semiconductor_Devices_simplified_abstract&oldid=14666.
Bluebook style
US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18359416._System_and_Method_for_Bonding_Semiconductor_Devices_simplified_abstract&oldid=14666 (last visited September 25, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "http://wikipatents.org/index.php?title=US_Patent_Application_18359416._System_and_Method_for_Bonding_Semiconductor_Devices_simplified_abstract&oldid=14666",
note = "[Online; accessed 25-September-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18359416._System_and_Method_for_Bonding_Semiconductor_Devices_simplified_abstract&oldid=14666}",
note = "[Online; accessed 25-September-2024]"
}
