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Bibliographic details for US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract
- Page name: US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 6 December 2023 08:37 UTC
- Date retrieved: 26 June 2024 02:20 UTC
- Permanent URL: http://wikipatents.org/index.php?title=US_Patent_Application_18446748._SEMICONDUCTOR_PACKAGE_AND_METHOD_COMPRISING_FORMATION_OF_REDISTRIBUTION_STRUCTURE_AND_INTERCONNECTING_DIE_simplified_abstract&oldid=14631
- Page Version ID: 14631
Citation styles for US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract
APA style
US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract. (2023, December 6). WikiPatents, . Retrieved 02:20, June 26, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18446748._SEMICONDUCTOR_PACKAGE_AND_METHOD_COMPRISING_FORMATION_OF_REDISTRIBUTION_STRUCTURE_AND_INTERCONNECTING_DIE_simplified_abstract&oldid=14631.
MLA style
"US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract." WikiPatents, . 6 Dec 2023, 08:37 UTC. 26 Jun 2024, 02:20 <http://wikipatents.org/index.php?title=US_Patent_Application_18446748._SEMICONDUCTOR_PACKAGE_AND_METHOD_COMPRISING_FORMATION_OF_REDISTRIBUTION_STRUCTURE_AND_INTERCONNECTING_DIE_simplified_abstract&oldid=14631>.
MHRA style
WikiPatents contributors, 'US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract', WikiPatents, , 6 December 2023, 08:37 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18446748._SEMICONDUCTOR_PACKAGE_AND_METHOD_COMPRISING_FORMATION_OF_REDISTRIBUTION_STRUCTURE_AND_INTERCONNECTING_DIE_simplified_abstract&oldid=14631> [accessed 26 June 2024]
Chicago style
WikiPatents contributors, "US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18446748._SEMICONDUCTOR_PACKAGE_AND_METHOD_COMPRISING_FORMATION_OF_REDISTRIBUTION_STRUCTURE_AND_INTERCONNECTING_DIE_simplified_abstract&oldid=14631 (accessed June 26, 2024).
CBE/CSE style
WikiPatents contributors. US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract [Internet]. WikiPatents, ; 2023 Dec 6, 08:37 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18446748._SEMICONDUCTOR_PACKAGE_AND_METHOD_COMPRISING_FORMATION_OF_REDISTRIBUTION_STRUCTURE_AND_INTERCONNECTING_DIE_simplified_abstract&oldid=14631.
Bluebook style
US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18446748._SEMICONDUCTOR_PACKAGE_AND_METHOD_COMPRISING_FORMATION_OF_REDISTRIBUTION_STRUCTURE_AND_INTERCONNECTING_DIE_simplified_abstract&oldid=14631 (last visited June 26, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "http://wikipatents.org/index.php?title=US_Patent_Application_18446748._SEMICONDUCTOR_PACKAGE_AND_METHOD_COMPRISING_FORMATION_OF_REDISTRIBUTION_STRUCTURE_AND_INTERCONNECTING_DIE_simplified_abstract&oldid=14631",
note = "[Online; accessed 26-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18446748._SEMICONDUCTOR_PACKAGE_AND_METHOD_COMPRISING_FORMATION_OF_REDISTRIBUTION_STRUCTURE_AND_INTERCONNECTING_DIE_simplified_abstract&oldid=14631}",
note = "[Online; accessed 26-June-2024]"
}
