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Bibliographic details for US Patent Application 18230135. SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME simplified abstract

Citation styles for US Patent Application 18230135. SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME simplified abstract

APA style

US Patent Application 18230135. SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME simplified abstract. (2023, December 4). WikiPatents, . Retrieved 16:18, June 17, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18230135._SEMICONDUCTOR_DIE_INCLUDING_THROUGH_SUBSTRATE_VIA_BARRIER_STRUCTURE_AND_METHODS_FOR_FORMING_THE_SAME_simplified_abstract&oldid=11676.

MLA style

"US Patent Application 18230135. SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME simplified abstract." WikiPatents, . 4 Dec 2023, 10:00 UTC. 17 Jun 2024, 16:18 <http://wikipatents.org/index.php?title=US_Patent_Application_18230135._SEMICONDUCTOR_DIE_INCLUDING_THROUGH_SUBSTRATE_VIA_BARRIER_STRUCTURE_AND_METHODS_FOR_FORMING_THE_SAME_simplified_abstract&oldid=11676>.

MHRA style

WikiPatents contributors, 'US Patent Application 18230135. SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME simplified abstract', WikiPatents, , 4 December 2023, 10:00 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18230135._SEMICONDUCTOR_DIE_INCLUDING_THROUGH_SUBSTRATE_VIA_BARRIER_STRUCTURE_AND_METHODS_FOR_FORMING_THE_SAME_simplified_abstract&oldid=11676> [accessed 17 June 2024]

Chicago style

WikiPatents contributors, "US Patent Application 18230135. SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18230135._SEMICONDUCTOR_DIE_INCLUDING_THROUGH_SUBSTRATE_VIA_BARRIER_STRUCTURE_AND_METHODS_FOR_FORMING_THE_SAME_simplified_abstract&oldid=11676 (accessed June 17, 2024).

CBE/CSE style

WikiPatents contributors. US Patent Application 18230135. SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME simplified abstract [Internet]. WikiPatents, ; 2023 Dec 4, 10:00 UTC [cited 2024 Jun 17]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18230135._SEMICONDUCTOR_DIE_INCLUDING_THROUGH_SUBSTRATE_VIA_BARRIER_STRUCTURE_AND_METHODS_FOR_FORMING_THE_SAME_simplified_abstract&oldid=11676.

Bluebook style

US Patent Application 18230135. SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18230135._SEMICONDUCTOR_DIE_INCLUDING_THROUGH_SUBSTRATE_VIA_BARRIER_STRUCTURE_AND_METHODS_FOR_FORMING_THE_SAME_simplified_abstract&oldid=11676 (last visited June 17, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18230135. SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=US_Patent_Application_18230135._SEMICONDUCTOR_DIE_INCLUDING_THROUGH_SUBSTRATE_VIA_BARRIER_STRUCTURE_AND_METHODS_FOR_FORMING_THE_SAME_simplified_abstract&oldid=11676",
   note = "[Online; accessed 17-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18230135. SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18230135._SEMICONDUCTOR_DIE_INCLUDING_THROUGH_SUBSTRATE_VIA_BARRIER_STRUCTURE_AND_METHODS_FOR_FORMING_THE_SAME_simplified_abstract&oldid=11676}",
   note = "[Online; accessed 17-June-2024]"
 }


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