Pages that link to "Category:Debendra Mallik of Chandler AZ (US)"
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The following pages link to Category:Debendra Mallik of Chandler AZ (US):
View (previous 50 | next 50) (20 | 50 | 100 | 250 | 500)- US Patent Application 17825350. INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING RETICLE BOUNDARY / DICING STREETS OF MONOLITHIC STRUCTURES THEREIN simplified abstract (← links)
- 18367285. INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES simplified abstract (Intel Corporation) (← links)
- 18462600. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation) (← links)
- 17846086. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) (← links)
- 17846129. PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) (← links)
- 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) (← links)
- 17846173. PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) (← links)
- 17846109. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES AND MULTI-SIDE ROUTING simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (← links)
- Intel corporation (20240113088). INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME simplified abstract (← links)
- 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation) (← links)
- 17957926. INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240128162). NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract (← links)
- Intel corporation (20240128205). HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS simplified abstract (← links)
- Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (← links)
- Intel corporation (20240136278). STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (← links)
- 18397906. NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract (Intel Corporation) (← links)
- 18397915. HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS simplified abstract (Intel Corporation) (← links)
- 18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation) (← links)
- 18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240222321). PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (← links)
- Intel corporation (20240222326). PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (← links)
- Intel corporation (20240222328). PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (← links)
- 18148533. PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (Intel Corporation) (← links)
- 18148528. PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (Intel Corporation) (← links)
- 18148543. PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240234225). GLASS CORE PATCH WITH IN SITU FABRICATED FAN-OUT LAYER TO ENABLE DIE TILING APPLICATIONS simplified abstract (← links)
- 18611534. GLASS CORE PATCH WITH IN SITU FABRICATED FAN-OUT LAYER TO ENABLE DIE TILING APPLICATIONS simplified abstract (Intel Corporation) (← links)
