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  • Meta Platforms Technologies, LLC patent applications on July 18th, 2024
    IPC Code(s): G01S7/4865, G01S7/481, G01S17/10, H01L23/00, H01L31/107 ...Category:G01S7/481]][[Category:G01S17/10]][[Category:H01L23/00]][[Category:H01L31/107]][[Category:CPC_G01S7/4865]][[Category:meta platforms technologies, llc
    12 KB (1,816 words) - 05:20, 18 July 2024
  • IDEMITSU KOSAN CO.,LTD. Patent Application Trends in 2024
    * [[:Category:CPC_H01L31/02013|H01L31/02013]] (Details) [[Category:CPC_C07C311/09]]
    15 KB (2,006 words) - 06:44, 19 July 2024
  • Patent Applications Report for 10th Nov 2023
    ...:Category:C12N5/078|C12N5/078]] (1 applications), [[:Category:H01L31/02016|H01L31/02016]] (1 applications), [[:Category:H01S5/04254|H01S5/04254]] (1 applicat
    28 KB (3,504 words) - 04:04, 4 December 2023
  • SUMITOMO ELECTRIC INDUSTRIES, LTD. Patent Application Trends in 2024
    * [[:Category:CPC_H01L31/1892|H01L31/1892]] (Processes or apparatus specially adapted for the manufacture or tre * [[:Category:CPC_H01L31/0392|H01L31/0392]] (including thin films deposited on metallic or insulating substrates
    21 KB (2,799 words) - 09:31, 18 July 2024
  • Sumitomo Electric Industries, Ltd. Patent Application Trends in 2024
    * [[:Category:CPC_H01L31/1892|H01L31/1892]] (Processes or apparatus specially adapted for the manufacture or tre * [[:Category:CPC_H01L31/0392|H01L31/0392]] (including thin films deposited on metallic or insulating substrates
    21 KB (2,799 words) - 09:05, 20 July 2024
  • Patent Applications Report for 23rd Jun 2023
    ...30/10]] (2), [[:Category:H02S20/25|H02S20/25]] (2), [[:Category:H01L31/049|H01L31/049]] (2), [[:Category:H02S40/36|H02S40/36]] (2), [[:Category:G06F17/16|G06 ...egory:G06Q10/02|G06Q10/02]] (6 applications), [[:Category:B60W30/09|B60W30/09]] (6 applications)
    36 KB (4,442 words) - 02:33, 5 January 2024
  • Patent Applications Report for 2nd Feb 2024
    ...HIKI KAISHA has filed patents in the areas of [[:Category:B60W30/09|B60W30/09]] (6 applications), [[:Category:G06V20/56|G06V20/56]] (5 applications), [[: ...gory:G01N33/57484|G01N33/57484]] (1 applications), [[:Category:H01L31/0224|H01L31/0224]] (1 applications), [[:Category:G06T2207/10064|G06T2207/10064]] (1 app
    46 KB (5,621 words) - 06:41, 2 February 2024
  • Patent Applications Report for 28th Jun 2024
    [[:Category:C07C5/09|C07C5/09]] (2 applications), [[:Category:B01J31/18|B01J31/18]] (2 applications), [[: ...tegory:H01L31/0224|H01L31/0224]] (1 applications), [[:Category:H01L31/0725|H01L31/0725]] (1 applications)
    60 KB (7,598 words) - 05:42, 2 July 2024
  • Patent Applications Report for 10th Feb 2023
    ...egory:B60W10/08|B60W10/08]] (4 applications), [[:Category:B60W30/09|B60W30/09]] (4 applications), [[:Category:B60L58/13|B60L58/13]] (4 applications), [[: [[:Category:F03D7/06|F03D7/06]] (2 applications), [[:Category:H01L31/0725|H01L31/0725]] (2 applications), [[:Category:G01R33/36|G01R33/36]] (2 applications)
    39 KB (4,888 words) - 04:21, 2 January 2024
  • CANON KABUSHIKI KAISHA patent applications on June 13th, 2024
    IPC Code(s): G03G5/10, C08K3/22, C08K3/36, C08K5/09, C08K5/19, C08K5/3445, C08K5/41, C08K5/42, C08K5/50, C08K5/52, C08K5/5313, ...egory:G03G5/10]][[Category:C08K3/22]][[Category:C08K3/36]][[Category:C08K5/09]][[Category:C08K5/19]][[Category:C08K5/3445]][[Category:C08K5/41]][[Categor
    80 KB (12,444 words) - 04:18, 14 June 2024
  • Korea Advanced Institute of Science and Technology Patent Application Trends in 2024
    * [[:Category:CPC_H01L31/1136|H01L31/1136]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS) [[Category:CPC_G06N3/09]]
    18 KB (2,475 words) - 17:39, 18 July 2024
  • KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY Patent Application Trends in 2024
    * [[:Category:CPC_H01L31/1136|H01L31/1136]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS) [[Category:CPC_G06N3/09]]
    19 KB (2,563 words) - 07:02, 25 July 2024
  • CANON KABUSHIKI KAISHA patent applications on July 18th, 2024
    IPC Code(s): G01S7/4863, G01S17/10, G01S17/894, H01L31/107, G01S17/931 ...tegory:G01S7/4863]][[Category:G01S17/10]][[Category:G01S17/894]][[Category:H01L31/107]][[Category:G01S17/931]][[Category:CPC_G01S7/4863]][[Category:canon kab
    70 KB (10,776 words) - 03:10, 19 July 2024
  • CANON KABUSHIKI KAISHA patent applications on February 29th, 2024
    IPC Code(s): G03G15/09, G03G15/01, G03G15/08, G03G15/095 ...density positions of the third and fourth magnetic poles.[[Category:G03G15/09]][[Category:G03G15/01]][[Category:G03G15/08]][[Category:G03G15/095]][[Categ
    108 KB (16,553 words) - 04:58, 4 March 2024
  • CANON KABUSHIKI KAISHA patent applications on August 8th, 2024
    IPC Code(s): G03G9/09 ...id exists on a surface of the strontium titanate particle.[[Category:G03G9/09]][[Category:CPC_G03G9/0902]][[Category:canon kabushiki kaisha]]
    73 KB (11,114 words) - 08:36, 8 August 2024
  • Patent Applications Report for 20th Sep 2024
    ...0]] (2), [[:Category:G07C5/08|G07C5/08]] (1), [[:Category:B60W40/09|B60W40/09]] (1), [[:Category:G09B7/02|G09B7/02]] (1), [[:Category:G01S17/10|G01S17/10 [[:Category:CPC_A63F13/67|A63F13/67]] (1), [[:Category:CPC_H01L31/0445|H01L31/0445]] (1), [[:Category:CPC_H04N25/531|H04N25/531]] (1), [[:Category:CPC_H0
    86 KB (10,634 words) - 09:37, 19 September 2024
  • NEC Corporation patent applications on March 28th, 2024
    IPC Code(s): B60W30/09, B60W30/095, B60W50/14, G06V20/58, G06V40/10 ...ntrol based on the positional relation and the attribute.[[Category:B60W30/09]][[Category:B60W30/095]][[Category:B60W50/14]][[Category:G06V20/58]][[Categ
    73 KB (10,812 words) - 08:07, 11 April 2024
  • Apple Inc. patent applications on August 22nd, 2024
    IPC Code(s): G02B27/01, G02B27/09, G03B21/14, G06F1/16, G06F1/3231, G06F3/01, G06F3/041, H04N13/344, H04N13/3 ...ctures or other housing structures.[[Category:G02B27/01]][[Category:G02B27/09]][[Category:G03B21/14]][[Category:G06F1/16]][[Category:G06F1/3231]][[Catego
    80 KB (12,829 words) - 05:46, 22 August 2024
  • Huawei Technologies Co., Ltd. patent applications on August 15th, 2024
    IPC Code(s): G02B27/01, G02B7/02, G02B27/00, G02B27/09 ...ry:G02B27/01]][[Category:G02B7/02]][[Category:G02B27/00]][[Category:G02B27/09]][[Category:CPC_G02B27/0172]][[Category:huawei technologies co., ltd.]]
    123 KB (19,116 words) - 01:49, 22 August 2024
  • Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
    IPC Code(s): G03F7/00, G03F7/004, G03F7/09, H01L21/768 ...ion with voids.[[Category:G03F7/00]][[Category:G03F7/004]][[Category:G03F7/09]][[Category:H01L21/768]][[Category:taiwan semiconductor manufacturing compa
    235 KB (34,158 words) - 03:03, 19 March 2024

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