Pages that link to "Category:Suddhasattwa Nad of Chandler AZ (US)"
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The following pages link to Category:Suddhasattwa Nad of Chandler AZ (US):
View (previous 50 | next 50) (20 | 50 | 100 | 250 | 500)- 18071237. GLASS EMBEDDED TRUE AIR CORE INDUCTORS simplified abstract (Intel Corporation) (← links)
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- Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract (← links)
- Intel corporation (20240186270). MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE THEREIN simplified abstract (← links)
- Intel corporation (20240188212). PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING simplified abstract (← links)
- Intel corporation (20240194548). APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract (← links)
- Intel corporation (20240194608). LOW Z-HEIGHT, GLASS-REINFORCED PACKAGE WITH EMBEDDED BRIDGE simplified abstract (← links)
- Intel corporation (20240194657). INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES simplified abstract (← links)
- 18065250. APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract (Intel Corporation) (← links)
- 18080612. LOW Z-HEIGHT, GLASS-REINFORCED PACKAGE WITH EMBEDDED BRIDGE simplified abstract (Intel Corporation) (← links)
- 18080152. INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240213111). CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract (← links)
- Intel corporation (20240213131). DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING simplified abstract (← links)
- Intel corporation (20240213132). THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract (← links)
- Intel corporation (20240213235). ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (← links)
- Intel corporation (20240213301). THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES simplified abstract (← links)
- 18088360. CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract (Intel Corporation) (← links)
- 18089499. DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING simplified abstract (Intel Corporation) (← links)
- 18089476. THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract (Intel Corporation) (← links)
- 18089459. ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation) (← links)
- 18089471. THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240219632). TECHNOLOGIES FOR INTEGRATED GRADED INDEX LENSES IN PHOTONIC CIRCUITS simplified abstract (← links)
- Intel corporation (20240219633). ELECTRO-OPTICAL CIRCUITS WITH LOW-COST SWITCHABLE PHOTONIC INTERFACE simplified abstract (← links)
- Intel corporation (20240219644). ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE simplified abstract (← links)
- Intel corporation (20240219645). ELECTRO-OPTICAL CIRCUITS WITH LOW-VOLTAGE SWITCHABLE PHOTONIC INTERFACE simplified abstract (← links)
- Intel corporation (20240222018). SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract (← links)
- Intel corporation (20240222035). PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS simplified abstract (← links)
- Intel corporation (20240222139). MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES simplified abstract (← links)
- Intel corporation (20240222219). PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract (← links)
- Intel corporation (20240222249). INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES simplified abstract (← links)
- Intel corporation (20240222258). GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION simplified abstract (← links)
- Intel corporation (20240222279). TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract (← links)
- Intel corporation (20240222298). TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING simplified abstract (← links)
- Intel corporation (20240222320). DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES simplified abstract (← links)
- Intel corporation (20240224543). STACKED MULTICHIP IC DEVICE PACKAGES INCLUDING A GLASS SUBSTRATE simplified abstract (← links)
- Patent Applications Report for 5th Jul 2024 (← links)
- 18091535. TECHNOLOGIES FOR INTEGRATED GRADED INDEX LENSES IN PHOTONIC CIRCUITS simplified abstract (Intel Corporation) (← links)
- 18090258. ELECTRO-OPTICAL CIRCUITS WITH LOW-COST SWITCHABLE PHOTONIC INTERFACE simplified abstract (Intel Corporation) (← links)
- 18090260. ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE simplified abstract (Intel Corporation) (← links)
- 18090253. ELECTRO-OPTICAL CIRCUITS WITH LOW-VOLTAGE SWITCHABLE PHOTONIC INTERFACE simplified abstract (Intel Corporation) (← links)
- 18147503. SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract (Intel Corporation) (← links)
- 18090305. PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS simplified abstract (Intel Corporation) (← links)
- 18090879. MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES simplified abstract (Intel Corporation) (← links)
- 18090883. PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract (Intel Corporation) (← links)
- 18148355. INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES simplified abstract (Intel Corporation) (← links)
- 18092012. GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION simplified abstract (Intel Corporation) (← links)
- 18091560. TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation) (← links)
- 18091583. TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING simplified abstract (Intel Corporation) (← links)
- 18091265. DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES simplified abstract (Intel Corporation) (← links)