Hewlett Packard Enterprise Development LP patent applications published on July 25th, 2024

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Summary of the patent applications from Hewlett Packard Enterprise Development LP on July 25th, 2024

    • Summary:**

The recent patents filed by the organization describe innovative technologies for enhancing data security, improving network performance, and optimizing circuit board cooling. These patents introduce methods and systems for secure communication connections, dynamic flow state management in networks, and efficient circuit board cooling technology. By utilizing shared tokens, per-flow packet dropping, and conforming heat transfer devices, these inventions aim to address key challenges in network security, network congestion control, and thermal management of electronic devices.

    • Key Points of Patents:**

- Secure communication connections using shared tokens to prevent replay attacks. - Dynamic flow state management for efficient packet dropping and ECN marking in networks. - Circuit board cooling technology with heat spreader, heat transfer device, and heat transport device.

    • Notable Applications:**

- Enhanced security for communication connections in IoT networks. - Improved network performance and congestion control mechanisms. - Efficient cooling of electronic devices for enhanced performance and reliability.



Patent applications for Hewlett Packard Enterprise Development LP on July 25th, 2024

SPECULATIVE REGISTER RECLAMATION (18143990)

Main Inventor

Sanyam Mehta


SHARED RESOURCE ACCESS (18295375)

Main Inventor

Grace Priscilla Nambi


SELECTIVE DELETION OF SENSITIVE DATA (18296245)

Main Inventor

Vijaya Kumbhashi


COMPACT CAM ARRAY FOR DECISION TREE INFERENCE (TREE-CAM) (18347318)

Main Inventor

GIACOMO PEDRETTI


SCALABLE KEY STATE FOR NETWORK ENCRYPTION (18515782)

Main Inventor

KEITH D. UNDERWOOD


SECURE CONNECTION INITIATION TO PREVENT REPLAY ATTACKS IN AN ENCRYPTED NETWORK (18360446)

Main Inventor

KEITH D. UNDERWOOD


METHOD AND SYSTEM FOR FACILITATING LOSSY DROPPING AND ECN MARKING (18626452)

Main Inventor

Jonathan P. Beecroft


CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOLING APPLICATIONS (18627195)

Main Inventor

Ernesto Ferrer Medina