Category:Chen-Hua Yu

Chen-Hua Yu

Executive Summary

Chen-Hua Yu is an inventor who has filed 45 patents. Their primary areas of innovation include Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor} (9 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), {Multilayer substrates (multilayer metallisation on monolayer substrate (8 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (43 patents), Taiwan Semiconductor Manufacturing Co., Ltd (2 patents). Their most frequent collaborators include (9 collaborations), (8 collaborations), (6 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 9 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 9 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 8 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 8 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 8 patents
• H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
• H01L23/49833 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 7 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
• H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 6 patents
• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L23/5383 ({Multilayer substrates (): 6 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 6 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 6 patents
• H01L24/17 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L2225/1058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 5 patents
• H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 5 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 5 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L21/76898 ({formed through a semiconductor substrate}): 4 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• G02B6/13 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 4 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• G02B6/12004 (of the integrated circuit kind (electric integrated circuits): 4 patents
• H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L23/3114 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L21/563 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
• H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/96 ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 3 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2225/1041 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2924/182 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• G02B2006/12121 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 3 patents
• G02B6/4214 (Coupling light guides with opto-electronic elements): 3 patents
• H01L23/3675 (Cooling facilitated by shape of device {(): 3 patents
• H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 3 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 3 patents
• H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/0231 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/14 ({of a plurality of bump connectors}): 3 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 3 patents
• H01L23/31 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 3 patents
• H01L2225/1035 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2924/3511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/32145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2225/1023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• G02B6/1225 (of the integrated circuit kind (electric integrated circuits): 2 patents
• H01L23/3677 (Cooling facilitated by shape of device {(): 2 patents
• H01L24/33 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/33181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/73253 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/473 (by flowing liquids {(): 2 patents
• H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• G02B6/4239 (Coupling light guides with opto-electronic elements): 2 patents
• G02B2006/12104 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
• G02B6/136 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/02373 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/1433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/06 ({of a plurality of bonding areas}): 2 patents
• G02B6/132 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
• G02B2006/12061 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
• H01L2224/02375 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/1632 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 2 patents
• H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 2 patents
• H01L2224/214 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 2 patents
• H01L23/49861 ({Lead-frames fixed on or encapsulated in insulating substrates (): 2 patents
• H01L23/528 ({Geometry or} layout of the interconnection structure {(): 2 patents
• H01L23/4006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/2919 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/1437 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/04105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/12105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/73267 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/81224 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16148 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48229 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/95001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06513 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06524 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/37001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/122 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/12019 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/4243 (Coupling light guides with opto-electronic elements): 1 patents
• H01L23/433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K7/20218 (Modifications to facilitate cooling, ventilating, or heating): 1 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
• H01L23/147 ({Semiconductor insulating substrates (semiconductor conductive substrates): 1 patents
• H01S5/02315 (Support members, e.g. bases or carriers): 1 patents
• H01S5/0232 (Lead-frames): 1 patents
• H01S5/02345 (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
• H01S5/028 (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
• H01L2224/48225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3736 ({Metallic materials (): 1 patents
• H01L2224/29124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29166 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29172 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/262 (Optical coupling means (): 1 patents
• G02B2006/12102 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B6/30 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L23/3171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L23/525 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/293 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3192 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5329 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
• H01L24/11 ({Manufacturing methods (for bumps on insulating substrates): 1 patents
• H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 1 patents
• G02B6/4295 (Coupling light guides with opto-electronic elements): 1 patents
• H01L2224/02381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4878 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/315 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83359 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2021/60022 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49866 ({characterised by the materials (materials of the substrates): 1 patents
• H01L23/49894 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/14 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8234 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/35 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/2101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/2902 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/14104 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8134 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H04B10/50 (Transmitters): 1 patents
• H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4882 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/44 (the complete device being wholly immersed in a fluid other than air {(): 1 patents
• H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/16196 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/16587 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29187 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/82896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/02379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
• H01L21/76895 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/77 (Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate (electrically programmable read-only memories or multistep manufacturing processes therefor): 1 patents
• H01L2224/02311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/02313 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0239 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5381 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L2224/16146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16165 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/818 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1434 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/43 (Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections): 1 patents
• G02B6/4204 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4253 (Coupling light guides with opto-electronic elements): 1 patents
• G02B2006/12123 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L2224/05022 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05571 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05624 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05666 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05684 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13109 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13111 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13116 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13139 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13164 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80357 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/0504 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/0544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/05494 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/0665 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/07025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1432 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/14361 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/0006 (Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings): 1 patents
• G02B6/124 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/4244 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4283 (Coupling light guides with opto-electronic elements): 1 patents
• H01L23/367 (Cooling facilitated by shape of device {(): 1 patents
• H01L23/4012 ({for stacked arrangements of a plurality of semiconductor devices (assemblies per se): 1 patents
• H01L24/82 ({by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] (interconnection structure between a plurality of semiconductor chips): 1 patents
• H01L2224/05009 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/50 (for integrated circuit devices, {e.g. power bus, number of leads} (): 1 patents
• H01L2224/04042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/81385 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/00014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/14 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/15311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/481 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L24/92 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/33505 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/33519 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8083 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8383 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/92142 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06541 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06589 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76877 ({Thin films associated with contacts of capacitors}): 1 patents
• H01L2224/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/92244 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/18162 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4871 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L22/12 ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions): 1 patents
• H01L2924/19103 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• Taiwan Semiconductor Manufacturing Co., Ltd.: 43 patents
• Taiwan Semiconductor Manufacturing Co., Ltd: 2 patents

Collaborators

• Jiun Yi Wu (9 collaborations)
• Hsing-Kuo Hsia (8 collaborations)
• Chung-Shi Liu (6 collaborations)
• Jui Lin Chao (6 collaborations)
• Szu-Wei Lu (5 collaborations)
• Chuei-Tang Wang (5 collaborations)
• Tung-Liang Shao (4 collaborations)
• Yu-Sheng Huang (4 collaborations)
• Hung-Yi Kuo (4 collaborations)
• Chung-Hao Tsai (4 collaborations)
• Wei-Yu Chen (3 collaborations)
• Shang-Yun Hou (3 collaborations)
• Chih-Wei Tseng (3 collaborations)
• Ming-Fa Chen (3 collaborations)
• Kuo-Chung Yee (3 collaborations)
• Hao-Yi Tsai (3 collaborations)
• Tin-Hao Kuo (3 collaborations)
• Chi-Hsi Wu (2 collaborations)
• Hsien-Pin Hu (2 collaborations)
• Jing-Cheng Lin (2 collaborations)
• Yung-Chi Lin (2 collaborations)
• Chung-Ju Lee (2 collaborations)
• Cheng-Chieh Hsieh (2 collaborations)
• An-Jhih Su (2 collaborations)
• Chao-Wen Shih (2 collaborations)
• Chien-Hsun Lee (2 collaborations)
• Hsien-Wei Chen (2 collaborations)
• Jie Chen (2 collaborations)
• Wen-Chih Chiou (2 collaborations)
• Chia-Shen Cheng (1 collaborations)
• Hao-Jan Pei (1 collaborations)
• Philip Yu-Shuan Chung (1 collaborations)
• Kuei-Wei Huang (1 collaborations)
• Yu-Peng Tsai (1 collaborations)
• Hsiu-Jen Lin (1 collaborations)
• Ching-Hua Hsieh (1 collaborations)
• Chin-Chuan Chang (1 collaborations)
• Chih-Hao Yu (1 collaborations)
• Shih-Peng Tai (1 collaborations)
• Kuo-Chiang Ting (1 collaborations)
• Sung-Hui Huang (1 collaborations)
• Jiun Ren Lai (1 collaborations)
• Yu-Jen Lien (1 collaborations)
• Ke-Han Shen (1 collaborations)
• Wei-Kong Sheng (1 collaborations)
• Tsung-Fu Tsai (1 collaborations)
• Chih-Ming Ke (1 collaborations)
• Han-Ping Pu (1 collaborations)
• Hsin-Yu Pan (1 collaborations)
• Sen-Kuei Hsu (1 collaborations)
• Chih-Hsin Lu (1 collaborations)
• Chin-Her Chien (1 collaborations)
• You-Rong Shaw (1 collaborations)
• Chia-Chia Lin (1 collaborations)
• Kuo Yang Wu (1 collaborations)
• Po-Hao Tsai (1 collaborations)
• Wei Ling Chang (1 collaborations)
• Che-Wei Hsu (1 collaborations)
• Wen-Hao Cheng (1 collaborations)
• Chieh-Yen Chen (1 collaborations)
• Jeng-Nan Hung (1 collaborations)
• Chih-Hang Tung (1 collaborations)
• Chung-Ming Weng (1 collaborations)
• Tsung-Yuan Yu (1 collaborations)
• Hua-Kuei Lin (1 collaborations)
• Che-Hsiang Hsu (1 collaborations)
• Wei-Kang Hsieh (1 collaborations)
• Shih-Wei Chen (1 collaborations)
• Yih Wang (1 collaborations)
• Wei-Ting Chen (1 collaborations)
• Shin-Puu Jeng (1 collaborations)
• Der-Chyang Yeh (1 collaborations)
• Sao-Ling Chiu (1 collaborations)
• Wen-Hsin Wei (1 collaborations)
• Ping-Kang Huang (1 collaborations)
• Chih-Ta Shen (1 collaborations)
• Ying-Ching Shih (1 collaborations)
• Tzuan-Horng Liu (1 collaborations)
• Sung-Feng Yeh (1 collaborations)