Nvidia corporation (20250003694). WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKING THE SAME
WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKING THE SAME
Organization Name
Inventor(s)
Harrison Sangwha Kim of Morgan Hill CA US
Tahir Cader of Spokane Valley WA US
Yunseok Kim of Pleasanton CA US
David Haley of Beaverton OR US
Yuezhan Steven Zhu of San Jose CA US
WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKING THE SAME
This abstract first appeared for US patent application 20250003694 titled 'WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKING THE SAME
Original Abstract Submitted
a heat transfer apparatus including a housing and a wick structure is provided that is configured to dissipate heat from a heat source. the housing defines a chamber that holds working fluid. the wick structure includes a body and pores defined by the body. the heat transfer apparatus defines an evaporator section configured to evaporate the working fluid using heat from a heat source and a condenser section configured to dissipate heat carried by the evaporated working fluid through condensation of the evaporated working fluid. the wick structure has a repeatable, configurable, and controlled geometry optimized to move the working fluid from the condenser section to the evaporator section via capillary action. the body of the wick structure may have a gyroidal geometry. associated methods are also provided.
- Nvidia corporation
- Ron Chao of San Diego CA US
- Elad Mentovich of Tel Aviv IL
- Harrison Sangwha Kim of Morgan Hill CA US
- Mark North of Lancaster PA US
- Xinwei Lu of Shenzhen CN
- Tahir Cader of Spokane Valley WA US
- Fei Zhang of Shenzhen CN
- Yunseok Kim of Pleasanton CA US
- David Haley of Beaverton OR US
- Yuezhan Steven Zhu of San Jose CA US
- Lei Huang of Shenzhen CN
- F28D15/04
- F28D15/02
- CPC F28D15/046
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