Chao-Yu Chen

Executive Summary

Chao-Yu Chen is an inventor who has filed 2 patents. Their primary areas of innovation include Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns (1 patents), {Earpieces of the intra-aural type} (1 patents), LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS (generating mechanical vibrations in general (1 patents), and they have worked with companies such as xMEMS Labs, Inc. (2 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

Error creating thumbnail: File missing

List of Technology Areas

• H04R1/2811 (Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns): 1 patents
• H04R1/1016 ({Earpieces of the intra-aural type}): 1 patents
• H04R1/24 (LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS (generating mechanical vibrations in general): 1 patents
• H04R19/02 (Loudspeakers (): 1 patents
• H04R2201/003 (Mems transducers or their use (of the electrostatic type): 1 patents
• H04R7/06 (LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS (generating mechanical vibrations in general): 1 patents
• H04R7/18 (at the periphery): 1 patents
• H04R31/003 ({for diaphragms or their outer suspension}): 1 patents
• B81C1/00158 (Manufacture or treatment of devices or systems in or on a substrate (): 1 patents
• B81B2203/01 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents
• B81B2203/0307 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents
• B81C2203/051 (PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons): 1 patents

Companies

List of Companies

• xMEMS Labs, Inc.: 2 patents

Collaborators

• Chiung C. Lo of San Jose CA (US) (2 collaborations)
• Wen-Chien Chen (2 collaborations)
• Jemm Yue Liang of Sunnyvale CA (US) (1 collaborations)
• Jye Ren (1 collaborations)
• Hao-Hsin Chang (1 collaborations)
• Chun-I Chang (1 collaborations)
• Hai-Hung Wen (1 collaborations)