Category:Kandabara Tapily of Albany NY (US)

Kandabara Tapily of Albany NY (US)

Executive Summary

Kandabara Tapily of Albany NY (US) is an inventor who has filed 6 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as Tokyo Electron Limited (6 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L28/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02189 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02194 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/0228 ({deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD}): 1 patents
• H01L21/283 (Deposition of conductive or insulating materials for electrodes {conducting electric current}): 1 patents
• H01L21/321 (After treatment): 1 patents
• H10B53/00 (Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors): 1 patents
• H01L21/32133 ({by chemical means only}): 1 patents
• G03F7/70733 (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices): 1 patents
• H01L21/02164 ({the material being a silicon oxide, e.g. SiO): 1 patents
• H01L21/02263 ({deposition from the gas or vapour phase}): 1 patents
• H01L21/02318 ({post-treatment}): 1 patents
• H01L21/0337 ({characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment}): 1 patents
• H01L21/32051 (Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers (manufacture of electrodes): 1 patents
• H01L21/32055 (Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers (manufacture of electrodes): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• C23C16/403 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/45536 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/56 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• H01L2224/80011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8002 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80236 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G03F7/167 ({from the gas phase, by plasma deposition (): 1 patents
• G03F7/70033 (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices): 1 patents
• H01L21/0273 ({characterised by the treatment of photoresist layers}): 1 patents
• H01L21/32136 ({using plasmas}): 1 patents
• H01L21/02175 ({characterised by the metal (): 1 patents
• H01L21/02244 ({the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides (adhesion layers or buffer layers): 1 patents
• H01L21/02252 ({formation by plasma treatment, e.g. plasma oxidation of the substrate (after treatment of an insulating film by plasma): 1 patents
• H01L21/02337 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/31122 (to form insulating layers thereon, e.g. for masking or by using photolithographic techniques (encapsulating layers): 1 patents
• G03F7/039 (Macromolecular compounds which are photodegradable, e.g. positive electron resists (): 1 patents
• C08F230/04 (MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS): 1 patents
• G03F7/038 (Macromolecular compounds which are rendered insoluble or differentially wettable (): 1 patents
• G03F7/168 ({Finishing the coated layer, e.g. drying, baking, soaking}): 1 patents
• G03F7/2004 (Exposure; Apparatus therefor (photographic printing apparatus for making copies): 1 patents
• H01L21/0274 (Making masks on semiconductor bodies for further photolithographic processing not provided for in group): 1 patents

Companies

List of Companies

• Tokyo Electron Limited: 6 patents

Collaborators

• Kai-Hung Yu of Albany NY (US) (2 collaborations)
• Nobuo Matsuki (2 collaborations)
• Dina Triyoso of Albany NY (US) (1 collaborations)
• Robert Clark of Albany NY (US) (1 collaborations)
• Tony Schenk (1 collaborations)
• Alireza Kashir (1 collaborations)
• Stefan Ferdinand Mueller (1 collaborations)
• Hirokazu Aizawa of Albany NY (US) (1 collaborations)
• Nicholas Joy of Albany NY (US) (1 collaborations)
• Yusuke Yoshida of Albany NY (US) (1 collaborations)
• Soo Doo Chae of Albany NY (US) (1 collaborations)
• Satohiko Hoshino of Albany NY (US) (1 collaborations)
• Hojin Kim of Albany NY (US) (1 collaborations)
• Adam Gildea of Albany NY (US) (1 collaborations)
• Hisashi Higuchi (1 collaborations)
• Cory Wajda of Albany NY (US) (1 collaborations)
• Gyanaranjan Pattanaik of Albany NY (US) (1 collaborations)
• Gerrit Leusink of Albany NY (US) (1 collaborations)
• Robert Clark (1 collaborations)