Category:Hui Wang

Hui Wang

Executive Summary

Hui Wang is an inventor who has filed 8 patents. Their primary areas of innovation include {Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells} (3 patents), Process control or regulation (controlling or regulating in general (3 patents), {Cell separation, e.g. membranes, diaphragms} (2 patents), and they have worked with companies such as ACM RESEARCH (SHANGHAI), INC. (8 patents). Their most frequent collaborators include (6 collaborations), (4 collaborations), (4 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• C25D17/001 ({Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells}): 3 patents
• C25D21/12 (Process control or regulation (controlling or regulating in general): 3 patents
• C25D17/002 ({Cell separation, e.g. membranes, diaphragms}): 2 patents
• C25D21/10 (Agitating of electrolytes; Moving of racks): 2 patents
• C25D7/12 (Semiconductors): 2 patents
• H01L21/68764 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H01L21/6708 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/6715 ({Apparatus for applying a liquid, a resin, an ink or the like (): 1 patents
• H01L21/68735 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H01L21/68742 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• G03F7/7075 (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices): 1 patents
• G03F7/168 ({Finishing the coated layer, e.g. drying, baking, soaking}): 1 patents
• G03F7/70533 (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices): 1 patents
• G03F7/70825 (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices): 1 patents
• G03F7/70933 (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices): 1 patents
• B01D19/0036 ({Flash degasification (the other groups take precedence)}): 1 patents
• B01D19/00 (Degasification of liquids): 1 patents
• B01D19/0031 (Degasification of liquids): 1 patents
• B08B3/041 ({Cleaning travelling work}): 1 patents
• B08B3/08 (the liquid having chemical or dissolving effect (substances used, see the relevant classes)): 1 patents
• B08B3/10 (with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration): 1 patents
• B08B3/12 (by sonic or ultrasonic vibrations (washing or rinsing machines for crockery or tableware using sonic or ultrasonic waves): 1 patents
• B08B7/04 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• F04B15/04 (POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS (machines for liquids, or pumps, of rotary-piston or oscillating-piston type): 1 patents
• F04B23/00 (Pumping installations or systems (pumps characterised by combination with, or adaptation to, specific driving engines or motors): 1 patents
• H01L21/02052 ({Wet cleaning only (): 1 patents
• H01L21/02057 ({Cleaning during device manufacture}): 1 patents
• H01L21/67017 ({Apparatus for fluid treatment (): 1 patents
• H01L21/67051 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses): 1 patents
• H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• B08B2203/007 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• F04B23/04 (POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS (machines for liquids, or pumps, of rotary-piston or oscillating-piston type): 1 patents
• C25D5/18 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR): 1 patents
• C25D7/123 ({Semiconductors first coated with a seed layer or a conductive layer}): 1 patents
• C25D17/06 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR): 1 patents
• C25D17/005 ({Contacting devices}): 1 patents
• C25D17/10 (Electrodes {, e.g. composition, counter electrode}): 1 patents
• H01L21/2885 (from a liquid, e.g. electrolytic deposition): 1 patents

Companies

List of Companies

• ACM RESEARCH (SHANGHAI), INC.: 8 patents

Collaborators

• Jian Wang (6 collaborations)
• Hongchao Yang (4 collaborations)
• Zhaowei Jia (4 collaborations)
• Shena Jia (2 collaborations)
• Fuping Chen (2 collaborations)
• Jun Wang (2 collaborations)
• Yinuo Jin (2 collaborations)
• Feng Liu (1 collaborations)
• Xiaofeng Tao (1 collaborations)
• Haibo Hu (1 collaborations)
• Yang Liu (1 collaborations)
• Mark Lee (1 collaborations)
• Jun Wu (1 collaborations)
• Cheng Cheng (1 collaborations)
• Andrew Jung (1 collaborations)
• Bruce Sohn (1 collaborations)
• Yy Kim (1 collaborations)
• Xi Wang (1 collaborations)
• Danying Wang (1 collaborations)
• Chaowei Jiang (1 collaborations)
• Yingwei Dai (1 collaborations)
• Yulu Hu (1 collaborations)
• Jun Cai (1 collaborations)
• Chenhua Lu (1 collaborations)
• Jiaqi Li (1 collaborations)
• Meng Wu (1 collaborations)