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• 00:01, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339521). FIN-TYPE FIELD EFFECT TRANSISTOR simplified abstract (hist) ‎[3,340 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:01, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339513). CONTACT AND VIA STRUCTURES simplified abstract (hist) ‎[4,430 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:01, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339511). SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND BACKSIDE SELF-ALIGNED VIA simplified abstract (hist) ‎[4,021 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:01, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339510). SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE CONTACT simplified abstract (hist) ‎[4,179 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:01, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339508). BIPOLAR JUNCTION TRANSISTOR WITH GATE OVER TERMINALS simplified abstract (hist) ‎[3,302 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:01, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339497). Dual Side Contact Structures in Semiconductor Devices simplified abstract (hist) ‎[4,629 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:01, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339475). SIGNAL SHIELDING FOR INTEGRATED CIRCUITS simplified abstract (hist) ‎[4,359 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:01, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339467). ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY simplified abstract (hist) ‎[4,942 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:00, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339456). INPUT/OUTPUT SEMICONDUCTOR DEVICES simplified abstract (hist) ‎[4,192 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:00, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339455). SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (hist) ‎[3,802 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:00, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339449). INTEGRATED CIRCUIT STRUCTURE WITH A REDUCED AMOUNT OF DEFECTS AND METHODS FOR FABRICATING THE SAME simplified abstract (hist) ‎[4,547 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:00, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339448). NOVEL THIN FILM RESISTOR simplified abstract (hist) ‎[2,818 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:00, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339446). EMBEDDED CLAMPING DIODE TO IMPROVE DEVICE RUGGEDNESS simplified abstract (hist) ‎[3,424 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:00, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339432). JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (hist) ‎[3,795 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:00, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339427). MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREOF simplified abstract (hist) ‎[4,597 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:00, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339424). MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW simplified abstract (hist) ‎[3,670 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:00, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339422). SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION simplified abstract (hist) ‎[4,080 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:00, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339415). PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract (hist) ‎[3,611 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 00:00, 14 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339408). Semiconductor Package and Method simplified abstract (hist) ‎[3,973 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:59, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339406). INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH AIR GAPS simplified abstract (hist) ‎[4,532 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:59, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339396). SELF-ALIGNED VIA STRUCTURES AND METHODS simplified abstract (hist) ‎[3,450 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:59, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339369). STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH CAPACITOR simplified abstract (hist) ‎[3,479 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:59, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339362). MULTI-GATE DEVICES WITH IMPROVED PERFORMANCE AND METHODS OF FABRICATING THE SAME simplified abstract (hist) ‎[3,978 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:59, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339356). INSULATING CAP ON CONTACT STRUCTURE simplified abstract (hist) ‎[3,843 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:59, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339355). Air-Replaced Spacer for Self-Aligned Contact Scheme simplified abstract (hist) ‎[3,997 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:59, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339348). PICK-AND-PLACE SYSTEM WITH A STABILIZER simplified abstract (hist) ‎[3,276 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:59, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339344). SYSTEMS AND METHODS FOR INSPECTION STATIONS simplified abstract (hist) ‎[4,148 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:59, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339329). GAS PHASE TREATMENT FOR MANUFACTURING SEMICONDUCTOR STRUCTURE simplified abstract (hist) ‎[4,723 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:59, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339327). METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY simplified abstract (hist) ‎[3,674 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:59, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339326). WAFER EDGE TRIMMING PROCESS AND METHODS THEREOF simplified abstract (hist) ‎[3,631 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:58, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339320). CERAMIC SUBSTRATE STRUCTURES AND METHODS OF FORMING THE SAME simplified abstract (hist) ‎[3,850 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:58, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339169). METHOD AND SYSTEM FOR REPLACEMENT OF MEMORY CELLS simplified abstract (hist) ‎[3,094 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:58, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339156). METHOD FOR PROGRAMMING MEMORY simplified abstract (hist) ‎[3,455 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:58, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339144). Magnetoresistive Random-Access Memory (MRAM) Cell and Method of Operation Thereof simplified abstract (hist) ‎[3,893 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:58, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240339141). Tracking Circuitry and Memory Devices Including the Same simplified abstract (hist) ‎[3,864 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:58, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240338511). INTEGRATED CIRCUIT AND METHOD OF FORMING SAME AND A SYSTEM simplified abstract (hist) ‎[3,672 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:58, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240338510). TEST PATTERN GENERATION SYSTEMS AND METHODS simplified abstract (hist) ‎[4,149 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:58, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240338507). Hybrid Node Chiplet Stacking Design simplified abstract (hist) ‎[3,998 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:58, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240338506). SYSTEM AND METHOD FOR ESL MODELING OF MACHINE LEARNING simplified abstract (hist) ‎[3,886 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:58, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240338115). SOFTWARE PARAMETER MANAGEMENT THROUGH A UNIVERSAL INTERFACE simplified abstract (hist) ‎[3,500 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:58, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240338044). VOLTAGE REFERENCE CIRCUIT AND POWER SUPPLY CIRCUIT BASED ON SAME simplified abstract (hist) ‎[4,044 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:58, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240337951). METHOD OF MANUFACTURING PHOTO MASKS simplified abstract (hist) ‎[5,356 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:58, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240337949). LITHOGRAPHY SYSTEM AND METHODS simplified abstract (hist) ‎[3,364 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:57, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240337947). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (hist) ‎[3,757 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:57, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240337918). EUV PHOTO MASKS AND MANUFACTURING METHOD THEREOF simplified abstract (hist) ‎[3,688 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:57, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240337917). METHODS OF MAKING A SEMICONDUCTOR DEVICE simplified abstract (hist) ‎[3,029 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:57, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240337800). PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING WAVEGUIDE simplified abstract (hist) ‎[3,912 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:57, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240337265). CRYOGENIC PUMP FOR SEMICONDUCTOR PROCESSING simplified abstract (hist) ‎[4,566 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:57, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240337012). APPARATUS AND METHOD FOR MANUFACTURING METAL GATE STRUCTURES simplified abstract (hist) ‎[3,834 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)
• 23:57, 13 October 2024 ‎Taiwan semiconductor manufacturing company, ltd. (20240335957). VACUUM TIP ASSEMBLY FOR USE IN PICK-AND-PLACE TOOL simplified abstract (hist) ‎[3,926 bytes] ‎Wikipatents (talk | contribs) (Creating a new page)

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