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- 15:40, 4 October 2024 Intel corporation (20240332379). BACKSIDE CONTACT ETCH BEFORE CAVITY SPACER FORMATION FOR BACKSIDE CONTACT OF TRANSISTOR SOURCE/DRAIN simplified abstract (hist) [4,127 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:40, 4 October 2024 Intel corporation (20240332377). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT SELECTIVITY simplified abstract (hist) [4,492 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:40, 4 October 2024 Intel corporation (20240332353). METHODS OF FORMING DIE STRUCTURES WITH SCALLOPED SIDEWALLS AND STRUCTURES FORMED THEREBY simplified abstract (hist) [3,184 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:40, 4 October 2024 Intel corporation (20240332322). INDUCTORLESS CIRCUITS FOR CURRENT-VOLTAGE CONTROL AND REGULATION IN GLASS CORE simplified abstract (hist) [3,470 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:40, 4 October 2024 Intel corporation (20240332302). INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE CONDUCTIVE SOURCE OR DRAIN CONTACT HAVING ENHANCED CONTACT AREA simplified abstract (hist) [4,870 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:39, 4 October 2024 Intel corporation (20240332301). INTEGRATED CIRCUIT STRUCTURES WITH SUB-FIN ISOLATION simplified abstract (hist) [3,985 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:39, 4 October 2024 Intel corporation (20240332299). INTEGRATED CIRCUIT DEVICE WITH HETEROGENOUS TRANSISTORS simplified abstract (hist) [3,618 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:39, 4 October 2024 Intel corporation (20240332290). TRANSISTOR WITH CHANNEL-SYMMETRIC GATE simplified abstract (hist) [5,609 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:39, 4 October 2024 Intel corporation (20240332285). CIRCUIT COMPONENTS WITH HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL simplified abstract (hist) [3,666 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:39, 4 October 2024 Intel corporation (20240332251). DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION simplified abstract (hist) [3,344 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:39, 4 October 2024 Intel corporation (20240332237). MICROELECTRONIC ASSEMBLIES WITH DIRECT BONDING USING NANOTWINNED COPPER simplified abstract (hist) [3,795 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:39, 4 October 2024 Intel corporation (20240332222). CONFIGURABLE SEMICONDUCTOR PACKAGE CAPACITORS AND METHOD simplified abstract (hist) [3,134 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:39, 4 October 2024 Intel corporation (20240332203). MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER simplified abstract (hist) [4,428 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:39, 4 October 2024 Intel corporation (20240332195). SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE TSV BRIDGE FOR GLASS CORE PACKAGES simplified abstract (hist) [3,573 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332193). INTERCONNECT BRIDGE CIRCUITRY DESIGNS FOR INTEGRATED CIRCUIT PACKAGE SUBSTRATES simplified abstract (hist) [3,770 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332175). BACKSIDE TRANSISTOR CONTACT SURROUNDED BY OXIDE simplified abstract (hist) [3,758 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332172). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT WIDENING simplified abstract (hist) [4,940 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332166). INTEGRATED CIRCUIT STRUCTURES HAVING AIR GAPS simplified abstract (hist) [4,547 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332155). SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS simplified abstract (hist) [2,923 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332153). DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION simplified abstract (hist) [2,573 bytes] Wikipatents (talk | contribs) (Creating a new page)