New pages
Jump to navigation
Jump to search
(newest | oldest) View (newer 20 | older 20) (20 | 50 | 100 | 250 | 500)
- 15:38, 4 October 2024 Intel corporation (20240332134). METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CIRCUIT PACKAGES simplified abstract (hist) [3,487 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332127). ON-PACKAGE EMBEDDED COOLING DEVICE simplified abstract (hist) [2,937 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332126). THERMAL GROUNDING IN BACKSIDE POWER SCHEMES USING CARRIER WAFERS simplified abstract (hist) [4,989 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332125). 2D FILLERS FOR REDUCED CTE FOR PID simplified abstract (hist) [3,764 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332116). SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD simplified abstract (hist) [2,855 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract (hist) [4,458 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332100). GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES simplified abstract (hist) [4,080 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332088). MODULATION OF CHIP PERFORMANCE BY CONTROLLING TRANSISTOR GATE PROFILE simplified abstract (hist) [4,041 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332077). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE GATE CONNECTION simplified abstract (hist) [3,837 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332071). PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON OXIDIZABLE MATERIAL simplified abstract (hist) [4,487 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332064). BACK SIDE INTERCONNECT PATTERNING AND FRONT SIDE METAL INTERCONNECT ON A TRANSISTOR LAYER simplified abstract (hist) [3,568 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:36, 4 October 2024 Intel corporation (20240331921). ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS simplified abstract (hist) [4,022 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:36, 4 October 2024 Intel corporation (20240331761). N-P BALANCED MULTI-PORT REGISTER FILE WITH COMPLEMENTARY FIELD-EFFECT TRANSISTORS (CFETS) simplified abstract (hist) [4,105 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:36, 4 October 2024 Intel corporation (20240331705). METHODS AND APPARATUS TO MODEL SPEAKER AUDIO simplified abstract (hist) [3,167 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:36, 4 October 2024 Intel corporation (20240331371). METHODS AND APPARATUS TO PERFORM PARALLEL DOUBLE-BATCHED SELF-DISTILLATION IN RESOURCE-CONSTRAINED IMAGE RECOGNITION APPLICATIONS simplified abstract (hist) [4,266 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:36, 4 October 2024 Intel corporation (20240331195). METHODS AND APPARATUS FOR SCALE RECOVERY FROM MONOCULAR VIDEO simplified abstract (hist) [3,967 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:36, 4 October 2024 Intel corporation (20240331168). METHODS AND APPARATUS TO DETERMINE CONFIDENCE OF MOTION VECTORS simplified abstract (hist) [3,305 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:36, 4 October 2024 Intel corporation (20240331083). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO DELIVER IMMERSIVE VIDEOS simplified abstract (hist) [3,428 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:36, 4 October 2024 Intel corporation (20240330726). QUANTUM DOT BASED QUBIT DEVICES WITH ON-CHIP MICROCOIL ARRANGEMENTS simplified abstract (hist) [5,218 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:36, 4 October 2024 Intel corporation (20240330559). METHODS, APPARATUS, AND ARTICLES OF MANUFACTURE TO GROUP DESIGN STAGES IN DESIGN SPACE OPTIMIZATION OF SEMICONDUCTOR DESIGN FOR TOOL AGNOSTIC DESIGN FLOWS simplified abstract (hist) [4,078 bytes] Wikipatents (talk | contribs) (Creating a new page)