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- 10:54, 19 September 2024 18123049. PCB FABRICATION WITH EMI FILM ON MULTI-LAYER RIGID PCB simplified abstract (Intel Corporation) (hist) [3,140 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:54, 19 September 2024 18121297. THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES simplified abstract (Intel Corporation) (hist) [3,471 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:54, 19 September 2024 18604121. SMALL DATA TRANSMISSION (SDT) PROCEDURES AND FAILURE RECOVERY DURING AN INACTIVE STATE simplified abstract (Intel Corporation) (hist) [5,265 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:54, 19 September 2024 18412153. ENHANCED QUALITY OF SERVICE FOR 5G WIRELESS COMMUNICATIONS simplified abstract (Intel Corporation) (hist) [3,884 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:54, 19 September 2024 18399512. APPARATUS, SYSTEM, AND METHOD OF COMMUNICATING CELLULAR QUALITY OF SERVICE (QOS) INFORMATION simplified abstract (Intel Corporation) (hist) [4,023 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:54, 19 September 2024 18521937. METHODS AND APPARATUS TO MODEL VOLUMETRIC REPRESENTATIONS simplified abstract (Intel Corporation) (hist) [4,279 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:53, 19 September 2024 18568780. AUTOMATIC PROJECTION CORRECTION simplified abstract (Intel Corporation) (hist) [2,965 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:53, 19 September 2024 18574809. LEARNING-BASED DATA COMPRESSION METHOD AND SYSTEM FOR INTER-SYSTEM OR INTER-COMPONENT COMMUNICATIONS simplified abstract (Intel Corporation) (hist) [3,475 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:53, 19 September 2024 18417570. NETWORK INTERFACE FOR DATA TRANSPORT IN HETEROGENEOUS COMPUTING ENVIRONMENTS simplified abstract (Intel Corporation) (hist) [4,984 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:53, 19 September 2024 18549806. RADIO EQUIPMENT DIRECTIVE SOLUTIONS FOR REQUIREMENTS ON CYBERSECURITY, PRIVACY AND PROTECTION OF THE NETWORK simplified abstract (Intel Corporation) (hist) [3,730 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:53, 19 September 2024 18121701. INTEGRATED CIRCUIT STRUCTURE WITH BACK-SIDE CONTACT SELECTIVITY simplified abstract (Intel Corporation) (hist) [3,320 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:53, 19 September 2024 18121724. INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORM GRID METAL GATE AND TRENCH CONTACT PLUG FOR TUB GATES WITH PYRAMIDAL CHANNEL STRUCTURES simplified abstract (Intel Corporation) (hist) [3,701 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:53, 19 September 2024 18121720. FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING TUNED UPPER NANOWIRES simplified abstract (Intel Corporation) (hist) [3,888 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:53, 19 September 2024 18121731. INTEGRATED CIRCUIT STRUCTURES HAVING SELF-ALIGNED UNIFORM GRID METAL GATE AND TRENCH CONTACT PLUG FOR TUB GATES simplified abstract (Intel Corporation) (hist) [4,371 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:53, 19 September 2024 18120904. REFLECTIVE INORGANIC THIN FILM FOR HIGH-DENSITY PANEL-SCALE RE-DISTRIBUTION LAYER (RDL) simplified abstract (Intel Corporation) (hist) [3,381 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:53, 19 September 2024 18122250. FIDUCIAL DESIGN OPTIMIZATION FOR LAND SIDE DEVICE ANYWHERE PACKAGE ASSEMBLY simplified abstract (Intel Corporation) (hist) [3,820 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:53, 19 September 2024 18120910. INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS simplified abstract (Intel Corporation) (hist) [2,976 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:52, 19 September 2024 18670390. Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices simplified abstract (Intel Corporation) (hist) [4,560 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:52, 19 September 2024 18121264. VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract (Intel Corporation) (hist) [3,580 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 10:52, 19 September 2024 18182879. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (Intel Corporation) (hist) [4,769 bytes] Wikipatents (talk | contribs) (Creating a new page)
