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- 06:55, 19 September 2024 18117916. HEAT EXCHANGER(S) FOR RECOVERING WATER AND/OR HEAT ENERGY FROM TURBINE ENGINE COMBUSTION PRODUCTS simplified abstract (Raytheon Technologies Corporation) (hist) [3,439 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312900). CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER simplified abstract (hist) [4,163 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 18119154. HEAT EXCHANGER(S) FOR RECOVERING WATER AND/OR HEAT ENERGY FROM TURBINE ENGINE COMBUSTION PRODUCTS simplified abstract (Raytheon Technologies Corporation) (hist) [3,768 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 18119182. RECOVERING WATER AND/OR HEAT ENERGY FROM POWERPLANT COMBUSTION PRODUCTS simplified abstract (Raytheon Technologies Corporation) (hist) [3,754 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312887). SEMICONDUCTOR PACKAGE simplified abstract (hist) [4,163 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 18117919. HEAT EXCHANGER(S) FOR RECOVERING WATER AND/OR HEAT ENERGY FROM TURBINE ENGINE COMBUSTION PRODUCTS simplified abstract (Raytheon Technologies Corporation) (hist) [3,369 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312885). LOW-STRESS PASSIVATION LAYER simplified abstract (hist) [3,922 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 18181149. BOLTED JOINT OF GAS TURBINE ENGINE simplified abstract (Raytheon Technologies Corporation) (hist) [3,807 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312876). Air Gap Seal for Interconnect Air Gap and Method of Fabricating Thereof simplified abstract (hist) [4,017 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 18118365. AIRFOIL TIP ARRANGEMENT FOR GAS TURBINE ENGINE simplified abstract (Raytheon Technologies Corporation) (hist) [3,019 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 18118706. Airfoils with Mixed Skin Passageway Cooling simplified abstract (Raytheon Technologies Corporation) (hist) [3,483 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312872). APPARATUS INCLUDING COOLING STRUCTURE simplified abstract (hist) [4,277 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312864). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [4,328 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 18118471. Airfoils with Axial Leading Edge Impingement Slots simplified abstract (Raytheon Technologies Corporation) (hist) [3,134 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 18118450. CHEMICAL VAPOR INFILTRATION TOOLING HOLE MODIFICATION FOR OPTIMIZING INFILTRATION IN CERAMIC MATRIX COMPOSITES simplified abstract (Raytheon Technologies Corporation) (hist) [4,007 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312859). PACKAGE SYSTEM AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [3,874 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 18118460. CHEMICAL VAPOR INFILTRATION TOOLING FOR OPTIMIZING INFILTRATION IN CERAMIC MATRIX COMPOSITES simplified abstract (Raytheon Technologies Corporation) (hist) [4,412 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312852). MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (hist) [4,043 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312851). SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME simplified abstract (hist) [3,838 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 18118466. METHOD OF REDUCING SURFACE DEFORMATION FROM Z-CHANNEL CREATION simplified abstract (Raytheon Technologies Corporation) (hist) [4,293 bytes] Wikipatents (talk | contribs) (Creating a new page)
