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- 05:37, 4 July 2024 Intel corporation (20240222257). GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES simplified abstract (hist) [4,537 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:37, 4 July 2024 Intel corporation (20240222249). INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES simplified abstract (hist) [3,676 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:37, 4 July 2024 Intel corporation (20240222248). ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER simplified abstract (hist) [3,904 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:37, 4 July 2024 Intel corporation (20240222243). APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRID BONDING simplified abstract (hist) [5,040 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:36, 4 July 2024 Intel corporation (20240222238). APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY simplified abstract (hist) [4,410 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:36, 4 July 2024 Intel corporation (20240222228). DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIUM NITRIDE LAYER simplified abstract (hist) [3,471 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:36, 4 July 2024 Intel corporation (20240222219). PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract (hist) [4,524 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:36, 4 July 2024 Intel corporation (20240222216). PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING simplified abstract (hist) [3,577 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:36, 4 July 2024 Intel corporation (20240222211). IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS simplified abstract (hist) [3,093 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:36, 4 July 2024 Intel corporation (20240222210). GLASS SUBSTRATE FABRICATION USING HYBRID BONDING simplified abstract (hist) [4,385 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:36, 4 July 2024 Intel corporation (20240222182). METHOD AND APPARATUS FOR A SILICON DIE PREPARATION INCLUDING AUXETIC AND ELECTROSTATIC DISSIPATATIVE FEATURES simplified abstract (hist) [3,591 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:36, 4 July 2024 Intel corporation (20240222178). ENHANCED ELECTROSTATIC WAFER CHUCK DESIGNS simplified abstract (hist) [3,247 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:36, 4 July 2024 Intel corporation (20240222139). MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES simplified abstract (hist) [3,556 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:36, 4 July 2024 Intel corporation (20240222137). ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES simplified abstract (hist) [3,418 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:36, 4 July 2024 Intel corporation (20240222136). ELECTRICAL LAYER WITH ROUGHENED SURFACES simplified abstract (hist) [4,560 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:36, 4 July 2024 Intel corporation (20240222130). ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES simplified abstract (hist) [3,716 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:35, 4 July 2024 Intel corporation (20240222126). FABRICATION OF NOVEL DEVICES USING ION BEAMS simplified abstract (hist) [3,635 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:35, 4 July 2024 Intel corporation (20240222119). PATTERNING BASED ON IN-SITU FORMATION OF BLOCK COPOYLMER THROUGH DEPROTECTION simplified abstract (hist) [4,646 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:35, 4 July 2024 Intel corporation (20240222113). PASSIVATION OF CRYSTALLINE SUBSTRATE FOR METAL CHALCOGEN MATERIAL SYNTHESIS simplified abstract (hist) [4,983 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:35, 4 July 2024 Intel corporation (20240222089). ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABILITY FOR INTEGRATED CIRCUITS simplified abstract (hist) [3,391 bytes] Wikipatents (talk | contribs) (Creating a new page)