Difference between revisions of "Intel Corporation patent applications published on June 27th, 2024"
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+ | '''Summary of the patent applications from Intel Corporation on June 27th, 2024''' | ||
+ | |||
+ | 1. **Summary**: | ||
+ | Intel Corporation has recently filed patents for innovative electronic systems and integrated circuit structures. These patents focus on enhancing performance, reliability, and efficiency in electronic devices. The first patent describes an electronic system with a glass core layer for active component dies, buildup layers, and solder bumps for interconnections. The second patent focuses on structures with backside capacitors in integrated circuits for increased memory capacity and data processing speed. The third patent introduces a package core technology with a glass substrate and electrically conductive traces for efficient electrical connectivity. Lastly, the fourth patent details techniques to enhance coverage for the Physical Uplink Control Channel (PUCCH) in wireless communication systems by allowing transmission from multiple antenna ports of a User Equipment (UE) based on configuration information. | ||
+ | |||
+ | 2. **Key Points of Patents**: | ||
+ | - Glass core layer with cavity for active component dies, buildup layers, and solder bumps. | ||
+ | - Backside capacitors for increased memory capacity and data processing speed. | ||
+ | - Package core technology with glass substrate and electrically conductive traces. | ||
+ | - Techniques to enhance coverage for the Physical Uplink Control Channel (PUCCH). | ||
+ | |||
+ | 3. **Notable Applications**: | ||
+ | - Advanced electronic devices, microelectronics, and semiconductor industry. | ||
+ | - Memory storage in integrated circuits, high-density data storage applications. | ||
+ | - Electronic packaging for various devices, semiconductor industry for integrated circuits. | ||
+ | - Mobile telecommunications networks, Internet of Things. | ||
+ | |||
+ | |||
+ | |||
+ | |||
==Patent applications for Intel Corporation on June 27th, 2024== | ==Patent applications for Intel Corporation on June 27th, 2024== | ||
Revision as of 16:37, 3 July 2024
Summary of the patent applications from Intel Corporation on June 27th, 2024
1. **Summary**: Intel Corporation has recently filed patents for innovative electronic systems and integrated circuit structures. These patents focus on enhancing performance, reliability, and efficiency in electronic devices. The first patent describes an electronic system with a glass core layer for active component dies, buildup layers, and solder bumps for interconnections. The second patent focuses on structures with backside capacitors in integrated circuits for increased memory capacity and data processing speed. The third patent introduces a package core technology with a glass substrate and electrically conductive traces for efficient electrical connectivity. Lastly, the fourth patent details techniques to enhance coverage for the Physical Uplink Control Channel (PUCCH) in wireless communication systems by allowing transmission from multiple antenna ports of a User Equipment (UE) based on configuration information.
2. **Key Points of Patents**: - Glass core layer with cavity for active component dies, buildup layers, and solder bumps. - Backside capacitors for increased memory capacity and data processing speed. - Package core technology with glass substrate and electrically conductive traces. - Techniques to enhance coverage for the Physical Uplink Control Channel (PUCCH).
3. **Notable Applications**: - Advanced electronic devices, microelectronics, and semiconductor industry. - Memory storage in integrated circuits, high-density data storage applications. - Electronic packaging for various devices, semiconductor industry for integrated circuits. - Mobile telecommunications networks, Internet of Things.
Contents
- 1 Patent applications for Intel Corporation on June 27th, 2024
- 1.1 ENTITY ALLOCATION FOR NAVIGATED ROUTES (18338418)
- 1.2 ENHANCED STATIC-DYNAMIC STRESS TECHNIQUES TO ACCELERATE LATENT DEFECTS FOR INTEGRATED CIRCUITS (18089411)
- 1.3 SCAN CHAIN DIAGNOSTIC ACCURACY USING HIGH VOLUME MANUFACTURING FUNCTIONAL TESTING (18089546)
- 1.4 TIME OF FLIGHT DISTANCE DETERMINATIONS (18145858)
- 1.5 FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS (18089501)
- 1.6 PRECURSORS AND METHODS FOR PRODUCING BISMUTH-OXY-CARBIDE-BASED PHOTORESIST (18145038)
- 1.7 SYSTEM FOR EXPOSURE OF ULTRA-VIOLET LIGHT TO A PHOTORESIST DEVELOPER SOLUTION (18145035)
- 1.8 Composite Materials for Electronic Device Chassis and Related Methods (18129524)
- 1.9 INTEGRATING AUTONOMOUS MEMORY SUBSYSTEM SELF-REFRESH WITH SYSTEM POWER MANAGEMENT STATES (18598810)
- 1.10 COMPUTER PROCESSOR FOR HIGHER PRECISION COMPUTATIONS USING A MIXED-PRECISION DECOMPOSITION OF OPERATIONS (18402606)
- 1.11 ACCELERATING KECCAK ALGORITHMS (18145744)
- 1.12 REMOTE ATOMIC OPERATIONS FOR CLUSTERED PROCESSING ARCHITECTURE (18145770)
- 1.13 ACCELERATING FOUR-WAY PARALLEL KECCAK EXECUTION ON 256-BIT VECTOR PROCESSOR (18145776)
- 1.14 APPARATUSES, METHODS, AND SYSTEMS TO ACCELERATE STORE PROCESSING (18419059)
- 1.15 ACCELERATING EIGHT-WAY PARALLEL KECCAK EXECUTION (18145801)
- 1.16 METHOD FOR A PRIMARY VIRTUAL MACHINE TO SCHEDULE A TASK OF SIBLING VIRTUAL MACHINES (18395766)
- 1.17 TECHNOLOGIES FOR DYNAMICALLY SHARING REMOTE RESOURCES ACROSS REMOTE COMPUTING NODES (18598837)
- 1.18 TECHNIQUES TO SUSTAIN ERROR INFORMATION FOR CRASH DATA ERROR HARVESTING (18596471)
- 1.19 ADAPTIVE INTERNAL ERROR SCRUBBING AND ERROR HANDLING (18025868)
- 1.20 BUFFER ALLOCATION (18434569)
- 1.21 DISAGGREGATING A MEMORY SIDE CACHE DATA ARRAY AND CACHE CONTROLLER (18069249)
- 1.22 LOAD STORE MICROARCHITECTURE CACHE ENHANCEMENTS (18086441)
- 1.23 APPARATUS AND METHOD FOR PROBABILISTIC CACHE REPLACEMENT FOR ACCELERATING ADDRESS TRANSLATION (18087887)
- 1.24 METHODS AND APPARATUS FOR PRIVATE SYNTHETIC DATA GENERATION (18591640)
- 1.25 Apparatus and Method for Flexible Processor Security and Authenticated Code Execution (18087776)
- 1.26 Method and System of Audio Detection of a Target Audio Source in Noisy Environments (18233803)
- 1.27 GEOGRAPHIC HEAT OR COLD DISTRIBUTION MODEL (18146218)
- 1.28 TRAFFIC ANOMALY SCENE RECONSTRUCTION (18146557)
- 1.29 ENHANCED MULTI-VIEW BACKGROUND MATTING FOR VIDEO CONFERENCING (18146927)
- 1.30 HIERARCHICAL SEGMENT-BASED MAP OPTIMIZATION FOR LOCALIZATION AND MAPPING SYSTEM (18568676)
- 1.31 Caching Apparatus, Driver Apparatus, Transcoding Apparatus and Corresponding Devices, Methods and Computer Programs (18567808)
- 1.32 CHEMICAL MECHANICAL POLISHING OF METAL GATE CUTS FORMED AFTER SOURCE AND DRAIN CONTACTS (18085768)
- 1.33 ENHANCED NOZZLE FOR DISAGGREGATED DIE HANDLING DURING THERMAL COMPRESSION BONDING (18089468)
- 1.34 METAL GATE CUT WITH HYBRID MATERIAL FILL (18087879)
- 1.35 CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE (18088360)
- 1.36 METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES (18069507)
- 1.37 GALLIUM NITRIDE (GAN) DEVICES WITH THROUGH-SILICON VIAS (18088545)
- 1.38 DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING (18089499)
- 1.39 THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA (18089476)
- 1.40 INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE HIGH (18088541)
- 1.41 INTERNAL NODE JUMPER FOR MEMORY BIT CELLS (18599049)
- 1.42 LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES (18089491)
- 1.43 INTERCONNECT DEVICE AND METHOD (18089417)
- 1.44 TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS (18089483)
- 1.45 LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD (18086265)
- 1.46 GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS (18086293)
- 1.47 ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY (18596488)
- 1.48 UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING (18087517)
- 1.49 Innovative Interconnect Design for Package Architecture to Improve Latency (18599147)
- 1.50 MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS (18597684)
- 1.51 PACKAGE STACKING USING CHIP TO WAFER BONDING (18601774)
- 1.52 ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES (18089459)
- 1.53 SELF-ALIGNED BACKBONE FOR FORKSHEET TRANSISTORS (18088547)
- 1.54 THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES (18089471)
- 1.55 ELONGATED CONTACT FOR SOURCE OR DRAIN REGION (18087318)
- 1.56 DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES (18089494)
- 1.57 GALLIUM NITRIDE (GAN) LAYER ON SUBSTRATE CARBURIZATION FOR INTEGRATED CIRCUIT TECHNOLOGY (18088542)
- 1.58 EDGE COMBINING SUB-HARMONIC N-PATH FILTER (18088928)
- 1.59 CLOCK ADJUSTMENT CIRCUIT WITH BIAS SCHEME (18086822)
- 1.60 IP FREQUENCY ADAPTIVE SAME-CYCLE CLOCK GATING (18089026)
- 1.61 System and method for testing a phase noise or jitter of a phase-locked loop (18145867)
- 1.62 Digital-to-analog converter and method for amplitude and skew error correction in the digital-to-analog converter (18145025)
- 1.63 APPARATUS FOR ANALOG-TO-DIGITAL CONVERSION, RECEIVER, BASE STATION, MOBILE DEVICE AND METHOD FOR ANALOG-TO-DIGITAL CONVERSION (18145108)
- 1.64 WIRELESS COMMUNICATION, MAINTAINING WIRELESS THROUGHPUT, AND DETECTION AND MANAGEMENT OF HUMAN BODY PROXIMITY TO TRANSMITTING ANTENNAS (18145860)
- 1.65 GROUP-BASED CHANNEL STATE INFORMATION REFERENCE SIGNAL (CSI-RS) TRANSMISSION (18558153)
- 1.66 ENHANCED NON-CODEBOOK-BASED UPLINK TRANSMISSIONS IN WIRELESS CELLULAR NETWORK (18456368)
- 1.67 MULTI-DEVICE SYSTEM AND METHOD FOR PHASE ALIGNMENT OF DEVICES IN THE MULTI-DEVICE SYSTEM (18145024)
- 1.68 PROTECTING SECRET PROCESSING, SECRET INPUT DATA, AND SECRET OUTPUT DATA USING ENCLAVES (18556022)
- 1.69 APPARATUS FOR CONTROLLING AN EQUALIZER, SIGNAL PROCESSING SYSTEM, RECEIVER, BASE STATION, MOBILE DEVICE, METHOD FOR CONTROLLING AN EQUALIZER (18145874)
- 1.70 A1 POLICY FUNCTIONS FOR OPEN RADIO ACCESS NETWORK (O-RAN) SYSTEMS (18550276)
- 1.71 MULTI-NODE SERVICE RESILIENCY (18433291)
- 1.72 TRAFFIC STEERING FOR SERVICE FUNCTION CHAINING (SFC) IN NEXT GENERATION CELLULAR NETWORKS (18287943)
- 1.73 SUPPLY CHAIN ATTESTATION TRANSPARENCY AND AUTHORIZATION (18146687)
- 1.74 VIDEO CODEC ASSISTED REAL-TIME VIDEO ENHANCEMENT USING DEEP LEARNING (18404696)
- 1.75 DETECTION OF VIDEO TAMPERING (18412806)
- 1.76 EPIPOLAR SCAN LINE NEURAL PROCESSOR ARRAYS FOR FOUR-DIMENSIONAL EVENT DETECTION AND IDENTIFICATION (18456303)
- 1.77 ORCHESTRATION ADAPTER FOR OPTICAL POWER CONTROLS IN C+L BAND NETWORK (18146707)
- 1.78 GENERATION OF SPATIAL SOUND SIGNAL FROM AUDITORY PERSPECTIVE OF INDIVIDUAL (18146562)
- 1.79 VULNERABLE ROAD USER BASIC SERVICE COMMUNICATION PROTOCOLS FRAMEWORK AND DYNAMIC STATES (17916748)
- 1.80 APPARATUS AND METHOD FOR 5G QUALITY OF SERVICE INDICATOR MANAGEMENT (18600310)
- 1.81 RADIO RESOURCE MANAGEMENT REQUIREMENTS FOR INTER CELL BEAM MEASUREMENT (18288518)
- 1.82 POWER SCALING FOR UPLINK FULL POWER TRANSMISSION (18288128)
- 1.83 SYSTEMS AND METHODS OF POWER HEADROOM REPORTING (18288662)
- 1.84 COVERAGE ENHANCEMENT FOR PHYSICAL UPLINK CONTROL CHANNEL TRANSMISSIONS IN NEW RADIO (18403568)
- 1.85 SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION (18089489)
- 1.86 INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE POWER DELIVERY AND SIGNAL ROUTING FOR FRONT SIDE DRAM (18088543)
- 1.87 INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CAPACITORS (18088552)
- 1.88 GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY (18086232)
Patent applications for Intel Corporation on June 27th, 2024
ENTITY ALLOCATION FOR NAVIGATED ROUTES (18338418)
Main Inventor
Raghavendra Bhat
ENHANCED STATIC-DYNAMIC STRESS TECHNIQUES TO ACCELERATE LATENT DEFECTS FOR INTEGRATED CIRCUITS (18089411)
Main Inventor
Andres MALDONADO
SCAN CHAIN DIAGNOSTIC ACCURACY USING HIGH VOLUME MANUFACTURING FUNCTIONAL TESTING (18089546)
Main Inventor
Nir BONE
TIME OF FLIGHT DISTANCE DETERMINATIONS (18145858)
Main Inventor
Shabbir AHMED
FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS (18089501)
Main Inventor
Zhixin XIE
PRECURSORS AND METHODS FOR PRODUCING BISMUTH-OXY-CARBIDE-BASED PHOTORESIST (18145038)
Main Inventor
Charles Cameron Mokhtarzadeh
SYSTEM FOR EXPOSURE OF ULTRA-VIOLET LIGHT TO A PHOTORESIST DEVELOPER SOLUTION (18145035)
Main Inventor
Joseph Bloxham
Composite Materials for Electronic Device Chassis and Related Methods (18129524)
Main Inventor
David Pidwerbecki
INTEGRATING AUTONOMOUS MEMORY SUBSYSTEM SELF-REFRESH WITH SYSTEM POWER MANAGEMENT STATES (18598810)
Main Inventor
Vijay Anand MATHIYALAGAN
COMPUTER PROCESSOR FOR HIGHER PRECISION COMPUTATIONS USING A MIXED-PRECISION DECOMPOSITION OF OPERATIONS (18402606)
Main Inventor
Gregory HENRY
ACCELERATING KECCAK ALGORITHMS (18145744)
Main Inventor
Santosh Ghosh
REMOTE ATOMIC OPERATIONS FOR CLUSTERED PROCESSING ARCHITECTURE (18145770)
Main Inventor
Yuvraj Dhillon
ACCELERATING FOUR-WAY PARALLEL KECCAK EXECUTION ON 256-BIT VECTOR PROCESSOR (18145776)
Main Inventor
Santosh Ghosh
APPARATUSES, METHODS, AND SYSTEMS TO ACCELERATE STORE PROCESSING (18419059)
Main Inventor
Ahmad YASIN
ACCELERATING EIGHT-WAY PARALLEL KECCAK EXECUTION (18145801)
Main Inventor
Santosh Ghosh
METHOD FOR A PRIMARY VIRTUAL MACHINE TO SCHEDULE A TASK OF SIBLING VIRTUAL MACHINES (18395766)
Main Inventor
Zhao LIU
TECHNOLOGIES FOR DYNAMICALLY SHARING REMOTE RESOURCES ACROSS REMOTE COMPUTING NODES (18598837)
Main Inventor
Francesc Guim Bernat
TECHNIQUES TO SUSTAIN ERROR INFORMATION FOR CRASH DATA ERROR HARVESTING (18596471)
Main Inventor
Divya GUPTA
ADAPTIVE INTERNAL ERROR SCRUBBING AND ERROR HANDLING (18025868)
Main Inventor
Kuljit S. BAINS
BUFFER ALLOCATION (18434569)
Main Inventor
Salma Mirza JOHNSON
DISAGGREGATING A MEMORY SIDE CACHE DATA ARRAY AND CACHE CONTROLLER (18069249)
Main Inventor
Israel Diamand
LOAD STORE MICROARCHITECTURE CACHE ENHANCEMENTS (18086441)
Main Inventor
Abhishek R. Appu
APPARATUS AND METHOD FOR PROBABILISTIC CACHE REPLACEMENT FOR ACCELERATING ADDRESS TRANSLATION (18087887)
Main Inventor
JOYDEEP RAKSHIT
METHODS AND APPARATUS FOR PRIVATE SYNTHETIC DATA GENERATION (18591640)
Main Inventor
Marius Arvinte
Apparatus and Method for Flexible Processor Security and Authenticated Code Execution (18087776)
Main Inventor
Alexander EYDELBERG
Method and System of Audio Detection of a Target Audio Source in Noisy Environments (18233803)
Main Inventor
Rita CHATTOPADHYAY
GEOGRAPHIC HEAT OR COLD DISTRIBUTION MODEL (18146218)
Main Inventor
Cornelius Buerkle
TRAFFIC ANOMALY SCENE RECONSTRUCTION (18146557)
Main Inventor
Frederik Pasch
ENHANCED MULTI-VIEW BACKGROUND MATTING FOR VIDEO CONFERENCING (18146927)
Main Inventor
Niloufar Pourian
HIERARCHICAL SEGMENT-BASED MAP OPTIMIZATION FOR LOCALIZATION AND MAPPING SYSTEM (18568676)
Main Inventor
Yuxin TIAN
Caching Apparatus, Driver Apparatus, Transcoding Apparatus and Corresponding Devices, Methods and Computer Programs (18567808)
Main Inventor
Jia BAO
CHEMICAL MECHANICAL POLISHING OF METAL GATE CUTS FORMED AFTER SOURCE AND DRAIN CONTACTS (18085768)
Main Inventor
Matthew J. Prince
ENHANCED NOZZLE FOR DISAGGREGATED DIE HANDLING DURING THERMAL COMPRESSION BONDING (18089468)
Main Inventor
Mark SALTAS
METAL GATE CUT WITH HYBRID MATERIAL FILL (18087879)
Main Inventor
Swapnadip Ghosh
CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE (18088360)
Main Inventor
Mohammad Mamunur RAHMAN
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES (18069507)
Main Inventor
Kyle Arrington
GALLIUM NITRIDE (GAN) DEVICES WITH THROUGH-SILICON VIAS (18088545)
Main Inventor
Han Wui THEN
DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING (18089499)
Main Inventor
Yi YANG
THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA (18089476)
Main Inventor
Kristof DARMAWIKARTA
INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE HIGH (18088541)
Main Inventor
Han Wui THEN
INTERNAL NODE JUMPER FOR MEMORY BIT CELLS (18599049)
Main Inventor
Smita SHRIDHARAN
LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES (18089491)
Main Inventor
Kristof DARMAWIKARTA
INTERCONNECT DEVICE AND METHOD (18089417)
Main Inventor
Jung Kyu Han
TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS (18089483)
Main Inventor
Minglu LIU
LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD (18086265)
Main Inventor
Bohan Shan
GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS (18086293)
Main Inventor
Bohan Shan
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY (18596488)
Main Inventor
Tomita YOSHIHIRO
UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING (18087517)
Main Inventor
Liang He
Innovative Interconnect Design for Package Architecture to Improve Latency (18599147)
Main Inventor
MD Altaf Hossain
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS (18597684)
Main Inventor
Adel A. ELSHERBINI
PACKAGE STACKING USING CHIP TO WAFER BONDING (18601774)
Main Inventor
Georg SEIDEMANN
ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES (18089459)
Main Inventor
Suddhasattwa Nad
SELF-ALIGNED BACKBONE FOR FORKSHEET TRANSISTORS (18088547)
Main Inventor
Shao Ming KOH
THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES (18089471)
Main Inventor
Darko GRUJICIC
ELONGATED CONTACT FOR SOURCE OR DRAIN REGION (18087318)
Main Inventor
Tuhin Guha Neogi
DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES (18089494)
Main Inventor
Vinith BEJUGAM
GALLIUM NITRIDE (GAN) LAYER ON SUBSTRATE CARBURIZATION FOR INTEGRATED CIRCUIT TECHNOLOGY (18088542)
Main Inventor
Han Wui THEN
EDGE COMBINING SUB-HARMONIC N-PATH FILTER (18088928)
Main Inventor
Run Levinger
CLOCK ADJUSTMENT CIRCUIT WITH BIAS SCHEME (18086822)
Main Inventor
Zeev Toroker
IP FREQUENCY ADAPTIVE SAME-CYCLE CLOCK GATING (18089026)
Main Inventor
Jianwei Dai
System and method for testing a phase noise or jitter of a phase-locked loop (18145867)
Main Inventor
Marc Jan Georges TIEBOUT
Digital-to-analog converter and method for amplitude and skew error correction in the digital-to-analog converter (18145025)
Main Inventor
Daniel GRUBER
APPARATUS FOR ANALOG-TO-DIGITAL CONVERSION, RECEIVER, BASE STATION, MOBILE DEVICE AND METHOD FOR ANALOG-TO-DIGITAL CONVERSION (18145108)
Main Inventor
Albert MOLINA
WIRELESS COMMUNICATION, MAINTAINING WIRELESS THROUGHPUT, AND DETECTION AND MANAGEMENT OF HUMAN BODY PROXIMITY TO TRANSMITTING ANTENNAS (18145860)
Main Inventor
Vamshi Krishna AAGIRU
GROUP-BASED CHANNEL STATE INFORMATION REFERENCE SIGNAL (CSI-RS) TRANSMISSION (18558153)
Main Inventor
Alexei DAVYDOV
ENHANCED NON-CODEBOOK-BASED UPLINK TRANSMISSIONS IN WIRELESS CELLULAR NETWORK (18456368)
Main Inventor
Guotong Wang
MULTI-DEVICE SYSTEM AND METHOD FOR PHASE ALIGNMENT OF DEVICES IN THE MULTI-DEVICE SYSTEM (18145024)
Main Inventor
Daniel GRUBER
PROTECTING SECRET PROCESSING, SECRET INPUT DATA, AND SECRET OUTPUT DATA USING ENCLAVES (18556022)
Main Inventor
Zhiqiang LI
APPARATUS FOR CONTROLLING AN EQUALIZER, SIGNAL PROCESSING SYSTEM, RECEIVER, BASE STATION, MOBILE DEVICE, METHOD FOR CONTROLLING AN EQUALIZER (18145874)
Main Inventor
Albert MOLINA
A1 POLICY FUNCTIONS FOR OPEN RADIO ACCESS NETWORK (O-RAN) SYSTEMS (18550276)
Main Inventor
Dawei Ying
MULTI-NODE SERVICE RESILIENCY (18433291)
Main Inventor
Matthew J. ADILETTA
TRAFFIC STEERING FOR SERVICE FUNCTION CHAINING (SFC) IN NEXT GENERATION CELLULAR NETWORKS (18287943)
Main Inventor
Zongrui Ding
SUPPLY CHAIN ATTESTATION TRANSPARENCY AND AUTHORIZATION (18146687)
Main Inventor
Ned M. Smith
VIDEO CODEC ASSISTED REAL-TIME VIDEO ENHANCEMENT USING DEEP LEARNING (18404696)
Main Inventor
Chen Wang
DETECTION OF VIDEO TAMPERING (18412806)
Main Inventor
Noam Levy
EPIPOLAR SCAN LINE NEURAL PROCESSOR ARRAYS FOR FOUR-DIMENSIONAL EVENT DETECTION AND IDENTIFICATION (18456303)
Main Inventor
David Israel Gonzalez-Aguirre
ORCHESTRATION ADAPTER FOR OPTICAL POWER CONTROLS IN C+L BAND NETWORK (18146707)
Main Inventor
Nikhil Satyarthi
GENERATION OF SPATIAL SOUND SIGNAL FROM AUDITORY PERSPECTIVE OF INDIVIDUAL (18146562)
Main Inventor
Rafael Rosales
VULNERABLE ROAD USER BASIC SERVICE COMMUNICATION PROTOCOLS FRAMEWORK AND DYNAMIC STATES (17916748)
Main Inventor
Vesh Raj SHARMA BANJADE
APPARATUS AND METHOD FOR 5G QUALITY OF SERVICE INDICATOR MANAGEMENT (18600310)
Main Inventor
Yizhi Yao
RADIO RESOURCE MANAGEMENT REQUIREMENTS FOR INTER CELL BEAM MEASUREMENT (18288518)
Main Inventor
Hua Li
POWER SCALING FOR UPLINK FULL POWER TRANSMISSION (18288128)
Main Inventor
Guotong Wang
SYSTEMS AND METHODS OF POWER HEADROOM REPORTING (18288662)
Main Inventor
Yi Wang
COVERAGE ENHANCEMENT FOR PHYSICAL UPLINK CONTROL CHANNEL TRANSMISSIONS IN NEW RADIO (18403568)
Main Inventor
Sergey Sosnin
SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION (18089489)
Main Inventor
Onur OZKAN
INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE POWER DELIVERY AND SIGNAL ROUTING FOR FRONT SIDE DRAM (18088543)
Main Inventor
Abhishek Anil SHARMA
INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CAPACITORS (18088552)
Main Inventor
Abhishek Anil SHARMA
GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY (18086232)
Main Inventor
Bohan Shan