Category:HSIANG-TAI LU: Difference between revisions

HSIANG-TAI LU

Executive Summary

HSIANG-TAI LU is an inventor who has filed 3 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (3 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/5223 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L28/60 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L22/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G01R31/2884 (Testing of electronic circuits, e.g. by signal tracer ({EMC, EMP or similar testing of electronic circuits): 1 patents
• H01L22/14 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/06 ({of a plurality of bonding areas}): 1 patents
• H01L24/11 ({Manufacturing methods (for bumps on insulating substrates): 1 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/14 ({of a plurality of bump connectors}): 1 patents
• H01L2224/0392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05557 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05567 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05624 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/06131 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/06132 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/06515 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/119 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13021 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13083 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13084 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/14131 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/14132 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/14515 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/81815 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/21 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.: 3 patents

Collaborators

• WEI-YU CHOU (2 collaborations)
• YANG-CHE CHEN (2 collaborations)
• TSE-WEI LIAO (2 collaborations)
• TING-YUAN HUANG (1 collaborations)
• CHENG-YU HSIEH (1 collaborations)
• MING-CHUNG WU (1 collaborations)
• CHIH-HSUAN TAI (1 collaborations)
• CHI-HUI LAI (1 collaborations)