Canon kabushiki kaisha (20250128513). LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, AND MANUFACTURING METHOD OF LIQUID EJECTION HEAD: Difference between revisions
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{"@context":"https://schema.org","@type":"TechArticle","headline":"LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, AND MANUFACTURING METHOD OF LIQUID EJECTION HEAD","name":"LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, AND MANUFACTURING METHOD OF LIQUID EJECTION HEAD","description":"an object is to provide a liquid ejection head capable of improving reliability of the connection section between an element substrate and an electrical wiring substrate. the liquid ejection head ejec...","datePublished":"April 24th, 2025","mainEntity":{"@type":"Patent","identifier":"20250128513","name":"LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, AND MANUFACTURING METHOD OF LIQUID EJECTION HEAD","abstract":"an object is to provide a liquid ejection head capable of improving reliability of the connection section between an element substrate and an electrical wiring substrate. the liquid ejection head ejecting liquid includes an element substrate having a terminal and a wiring substrate including a wiring portion connected to the terminal in contact therewith. in a direction perpendicular to a surface on which the terminal is provided on the element substrate, a second distance between the end portion of the element substrate and the wiring portion is greater than a first distance between the surface on which the terminal is provided and a portion opposite to the terminal of the wiring portion.","applicationNumber":"20250128513","datePublished":"April 24th, 2025","inventor":[{"@type":"Person","name":"ZENTARO TAMENAGA"},{"@type":"Person","name":"TAKASHI TERAGAKI"},{"@type":"Person","name":"HIROYUKI KIGAMI"}],"applicant":{"@type":"Organization","name":"canon kabushiki kaisha"},"additionalProperty":[{"@type":"PropertyValue","name":"IPC Classification","value":"B41J2/14"},{"@type":"PropertyValue","name":"IPC Classification","value":"B41J2/16"},{"@type":"PropertyValue","name":"CPC Classification","value":"B41J2/14201"}]}} | |||
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=LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, AND MANUFACTURING METHOD OF LIQUID EJECTION HEAD= | =LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, AND MANUFACTURING METHOD OF LIQUID EJECTION HEAD= | ||
Latest revision as of 16:00, 29 April 2025
LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, AND MANUFACTURING METHOD OF LIQUID EJECTION HEAD
Organization Name
Inventor(s)
ZENTARO Tamenaga of Kanagawa JP
TAKASHI Teragaki of Kanagawa JP
HIROYUKI Kigami of Kanagawa JP
LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, AND MANUFACTURING METHOD OF LIQUID EJECTION HEAD
This abstract first appeared for US patent application 20250128513 titled 'LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, AND MANUFACTURING METHOD OF LIQUID EJECTION HEAD
Original Abstract Submitted
an object is to provide a liquid ejection head capable of improving reliability of the connection section between an element substrate and an electrical wiring substrate. the liquid ejection head ejecting liquid includes an element substrate having a terminal and a wiring substrate including a wiring portion connected to the terminal in contact therewith. in a direction perpendicular to a surface on which the terminal is provided on the element substrate, a second distance between the end portion of the element substrate and the wiring portion is greater than a first distance between the surface on which the terminal is provided and a portion opposite to the terminal of the wiring portion.
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