Chung-Te Lin

Executive Summary

Chung-Te Lin is an inventor who has filed 7 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), ELECTRONIC MEMORY DEVICES (2 patents), Protection against radiation, e.g. light {or electromagnetic waves} (1 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (6 patents), Taiwan Semiconductor Manufacturing Company LTD (1 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L29/7869 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H10B51/20 (ELECTRONIC MEMORY DEVICES): 2 patents
• H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
• G11C11/4096 (Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches): 1 patents
• H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B51/30 (ELECTRONIC MEMORY DEVICES): 1 patents
• H01L29/6684 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/78391 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B51/10 (ELECTRONIC MEMORY DEVICES): 1 patents
• H01L27/124 (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents
• H01L27/1225 (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents
• H01L27/1255 (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents
• H01L27/1259 (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents
• H10B99/00 (ELECTRONIC MEMORY DEVICES): 1 patents
• H01L29/4941 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/0262 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/823431 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L29/6675 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66795 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/78618 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/78696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B12/315 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B12/033 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B12/05 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B12/50 (ELECTRONIC MEMORY DEVICES): 1 patents

Companies

List of Companies

• Taiwan Semiconductor Manufacturing Company, Ltd.: 6 patents
• Taiwan Semiconductor Manufacturing Company LTD: 1 patents

Collaborators

• Kuo-Chang Chiang (2 collaborations)
• Katherine H. Chiang (2 collaborations)
• Katherine Chiang (1 collaborations)
• Chen-Jun Wu (1 collaborations)
• Yun-Feng Kao (1 collaborations)
• Sheng-Chih Lai (1 collaborations)
• Li-Shyue Lai (1 collaborations)
• Chien-Hao Huang (1 collaborations)
• Chia-Yu Ling (1 collaborations)
• Katherine H CHIANG (1 collaborations)
• Chieh-Fang Chen (1 collaborations)
• Feng-Cheng Yang (1 collaborations)
• Katherine H. cHIANG (1 collaborations)
• Yen-Chung Ho (1 collaborations)
• Ming-Yen Chuang (1 collaborations)
• I-Che Lee (1 collaborations)
• Huai-Ying Huang (1 collaborations)
• Yen-Chieh Huang (1 collaborations)
• Wei-Gang Chiu (1 collaborations)
• Kai-Wen Cheng (1 collaborations)
• Yu-Ming Lin (1 collaborations)