Category:Wei Liu: Difference between revisions

Wei Liu

Executive Summary

Wei Liu is an inventor who has filed 5 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as YANGTZE MEMORY TECHNOLOGIES CO., LTD. (3 patents), Yangtze Memory Technologies Co., Ltd. (2 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

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List of Technology Areas

• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 3 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 3 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 3 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2924/1436 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H10B12/488 (ELECTRONIC MEMORY DEVICES): 2 patents
• H10B12/315 (ELECTRONIC MEMORY DEVICES): 2 patents
• H01L2924/14511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G11C5/063 (STATIC STORES (semiconductor memory devices): 1 patents
• H10B12/482 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10D30/6728 (No explanation available): 1 patents
• H10D62/102 (No explanation available): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
• H01L2224/80006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• YANGTZE MEMORY TECHNOLOGIES CO., LTD.: 3 patents
• Yangtze Memory Technologies Co., Ltd.: 2 patents

Collaborators

• Hongbin Zhu (2 collaborations)
• Ning Jiang (2 collaborations)
• Zhiliang Xia (2 collaborations)
• Yuancheng Yang (2 collaborations)
• Ziqun Hua (1 collaborations)
• Wenyu Hua (1 collaborations)
• Yanhong Wang (1 collaborations)
• Liang Chen (1 collaborations)
• Wenxi Zhou (1 collaborations)
• Kun Zhang (1 collaborations)
• Chao Sun (1 collaborations)
• Dongxue Zhao (1 collaborations)
• Tao Yang (1 collaborations)
• Changzhi Sun (1 collaborations)
• Zongliang Huo (1 collaborations)
• Wu Liu (1 collaborations)
• Zichen Liu (1 collaborations)