Difference between revisions of "THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)"
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− | The abstract describes a three-dimensional integrated circuit (3DIC) package that uses an interposer substrate in the bottom die layer. This interposer substrate provides support for the bottom die(s) of the package and is longer in length than the top die. This allows for a larger top die to be bonded in the | + | The abstract describes a three-dimensional integrated circuit (3DIC) package that uses an interposer substrate in the bottom die layer. This interposer substrate provides support for the bottom die(s) of the package and is longer in length than the top die. This allows for a larger top die to be bonded in the additional die area provided by the extended interposer substrate. The fabrication process involves bonding the top die to the bottom wafer using a top die-to-bottom wafer process. |
Revision as of 16:12, 1 October 2023
The abstract describes a three-dimensional integrated circuit (3DIC) package that uses an interposer substrate in the bottom die layer. This interposer substrate provides support for the bottom die(s) of the package and is longer in length than the top die. This allows for a larger top die to be bonded in the additional die area provided by the extended interposer substrate. The fabrication process involves bonding the top die to the bottom wafer using a top die-to-bottom wafer process.