Vibrant Microsystems Inc. (20250059023). FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE: Difference between revisions
Creating a new page |
Creating a new page |
||
Line 8: | Line 8: | ||
[[Category:Vibrant Microsystems Inc.]] | [[Category:Vibrant Microsystems Inc.]] | ||
==Inventor(s)== | |||
[[:Category:Joseph Doll of Bend OR (US)|Joseph Doll of Bend OR (US)]][[Category:Joseph Doll of Bend OR (US)]] | |||
[[:Category:Sanjay Bhandari of Cupertino CA (US)|Sanjay Bhandari of Cupertino CA (US)]][[Category:Sanjay Bhandari of Cupertino CA (US)]] | |||
==FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE== | |||
This abstract first appeared for US patent application 20250059023 titled 'FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE | |||
==Original Abstract Submitted== | |||
a mems audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the mems audio device. | |||
[[Category:B81B7/00]] | |||
[[Category:B81C1/00]] | |||
[[Category:H04R3/00]] | |||
[[Category:H04R7/04]] | |||
[[Category:H04R19/02]] | |||
[[Category:H04R19/04]] | |||
[[Category:H04R31/00]] | |||
[[Category:CPC_B81B7/0006]] |
Latest revision as of 04:10, 19 March 2025
FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
Organization Name
Inventor(s)
Sanjay Bhandari of Cupertino CA (US)
FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
This abstract first appeared for US patent application 20250059023 titled 'FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
Original Abstract Submitted
a mems audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the mems audio device.
(Ad) Transform your business with AI in minutes, not months
Trusted by 1,000+ companies worldwide