Samsung electronics co., ltd. (20250079320). SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES

Organization Name

samsung electronics co., ltd.

Inventor(s)

Junghoon Kang of Suwon-si (KR)

SEMICONDUCTOR PACKAGES

This abstract first appeared for US patent application 20250079320 titled 'SEMICONDUCTOR PACKAGES

Original Abstract Submitted

a semiconductor package comprising: a first redistribution substrate; a module structure on the first redistribution substrate; a first molding layer on the first redistribution substrate and extending around the module structure; a second redistribution substrate on the module structure and the first molding layer; and a first vertical connection structure on a side of the module structure and electrically connecting the first redistribution substrate and the second redistribution substrate, wherein the module structure includes: a third redistribution substrate; a fourth redistribution substrate on the third redistribution substrate; a first semiconductor chip between the third redistribution substrate and the fourth redistribution substrate; a second molding layer between the third redistribution substrate and the fourth redistribution substrate and extending around the first semiconductor chip; and a second semiconductor chip on the fourth redistribution substrate, wherein the first semiconductor chip and the second semiconductor chip are electrically connected by the fourth redistribution substrate.