Samsung electronics co., ltd. (20250087647). SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Organization Name

samsung electronics co., ltd.

Inventor(s)

Jing Cheng Lin of Suwon-si (KR)

Youngkun Jee of Suwon-si (KR)

SEMICONDUCTOR PACKAGE

This abstract first appeared for US patent application 20250087647 titled 'SEMICONDUCTOR PACKAGE

Original Abstract Submitted

a semiconductor package includes a lower redistribution structure, an internal semiconductor chip on the lower redistribution structure and including first connection pads on a lower surface of the internal semiconductor chip, conductive posts connected to the lower redistribution structure, an encapsulant surrounding a side surface of each of the conductive posts, surrounding a side surface of the internal semiconductor chip, and covering an upper surface of the internal semiconductor chip, upper trace pads on the encapsulant and respectively connected to ends of the conductive posts, an external semiconductor device on the encapsulant, the external semiconductor device including second connection pads on a lower surface of the external semiconductor device and respectively connected to the upper trace pads, and a heat dissipation structure on the encapsulant and laterally spaced apart from the external semiconductor device.