Difference between revisions of "Category:Chen-Hua Yu"

Latest revision as of 02:13, 19 July 2024

Chen-Hua Yu

Executive Summary

Chen-Hua Yu is an inventor who has filed 43 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), {Multilayer substrates (multilayer metallisation on monolayer substrate (8 patents), Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor} (8 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (43 patents). Their most frequent collaborators include (9 collaborations), (8 collaborations), (6 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 9 patents
H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 8 patents
H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 8 patents
H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 8 patents
H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 8 patents
H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
H01L23/49833 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 7 patents
H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 6 patents
H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
H01L23/5383 ({Multilayer substrates (): 6 patents
H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 6 patents
H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 6 patents
H01L24/17 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
H01L2225/1058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 5 patents
H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 5 patents
H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 5 patents
H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L21/76898 ({formed through a semiconductor substrate}): 4 patents
H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
G02B6/13 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 4 patents
H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
G02B6/12004 (of the integrated circuit kind (electric integrated circuits): 4 patents
H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L23/3114 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L21/563 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L24/96 ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 3 patents
H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2225/1041 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/182 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
G02B2006/12121 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 3 patents
G02B6/4214 (Coupling light guides with opto-electronic elements): 3 patents
H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 3 patents
H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 3 patents
H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/0231 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L24/14 ({of a plurality of bump connectors}): 3 patents
H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 3 patents
H01L23/31 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 3 patents
H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2225/1035 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/3511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/32145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2225/1023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
G02B6/1225 (of the integrated circuit kind (electric integrated circuits): 2 patents
H01L23/3677 (Cooling facilitated by shape of device {(): 2 patents
H01L24/33 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/33181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/73253 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L23/473 (by flowing liquids {(): 2 patents
H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
G02B6/4239 (Coupling light guides with opto-electronic elements): 2 patents
G02B2006/12104 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
G02B6/136 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/02373 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/1433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L24/06 ({of a plurality of bonding areas}): 2 patents
G02B6/132 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
G02B2006/12061 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
H01L2224/02375 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/1632 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 2 patents
H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 2 patents
H01L2224/214 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 2 patents
H01L23/3675 (Cooling facilitated by shape of device {(): 2 patents
H01L23/49861 ({Lead-frames fixed on or encapsulated in insulating substrates (): 2 patents
H01L23/528 ({Geometry or} layout of the interconnection structure {(): 2 patents
H01L23/4006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/2919 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/1437 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/04105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/12105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/73267 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/81224 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/16148 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/48229 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/95001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/06513 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/06524 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/06544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/37001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
G02B6/122 (of the integrated circuit kind (electric integrated circuits): 1 patents
G02B6/12019 (of the integrated circuit kind (electric integrated circuits): 1 patents
G02B6/4243 (Coupling light guides with opto-electronic elements): 1 patents
H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
H01L23/147 ({Semiconductor insulating substrates (semiconductor conductive substrates): 1 patents
H01S5/02315 (Support members, e.g. bases or carriers): 1 patents
H01S5/0232 (Lead-frames): 1 patents
H01S5/02345 (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
H01S5/028 (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
H01L2224/48225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/3736 ({Metallic materials (): 1 patents
H01L2224/29124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/29147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/29155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/29166 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/29172 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
G02B6/262 (Optical coupling means (): 1 patents
G02B2006/12102 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
G02B6/30 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
H01L23/3171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 1 patents
H01L23/525 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/293 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/3192 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/5225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/5329 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
H01L24/11 ({Manufacturing methods (for bumps on insulating substrates): 1 patents
H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 1 patents
G02B6/4295 (Coupling light guides with opto-electronic elements): 1 patents
H01L2224/02381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/4878 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
H01L23/315 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/83359 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2021/60022 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/49866 ({characterised by the materials (materials of the substrates): 1 patents
H01L23/49894 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/14 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/8234 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/35 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/0401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/2101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/2902 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/14104 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/8134 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H04B10/50 (Transmitters): 1 patents
H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/4882 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
H01L23/44 (the complete device being wholly immersed in a fluid other than air {(): 1 patents
H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/16196 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/16587 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/29187 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/82896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/02379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
H01L21/76895 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
H01L21/77 (Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate (electrically programmable read-only memories or multistep manufacturing processes therefor): 1 patents
H01L2224/02311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/02313 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/0239 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/5381 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
H01L2224/16146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/16165 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/818 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/1434 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
G02B6/43 (Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections): 1 patents
G02B6/4204 (Coupling light guides with opto-electronic elements): 1 patents
G02B6/4253 (Coupling light guides with opto-electronic elements): 1 patents
G02B2006/12123 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
H01L2224/05022 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05571 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05624 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05666 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05684 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/08147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/08237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13109 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13111 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13116 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13139 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13164 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/80357 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/0504 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/0544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/05494 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/0665 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/07025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/1432 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/14361 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
G02B6/0006 (Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings): 1 patents
G02B6/124 (of the integrated circuit kind (electric integrated circuits): 1 patents
G02B6/4244 (Coupling light guides with opto-electronic elements): 1 patents
G02B6/4283 (Coupling light guides with opto-electronic elements): 1 patents
H01L23/367 (Cooling facilitated by shape of device {(): 1 patents
H01L23/4012 ({for stacked arrangements of a plurality of semiconductor devices (assemblies per se): 1 patents
H01L23/50 (for integrated circuit devices, {e.g. power bus, number of leads} (): 1 patents
H01L2224/04042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/81385 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/00014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/14 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/15311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/481 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
H01L24/92 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/08146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/33505 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/33519 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/80006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/8083 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/83005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/8383 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/83896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/92142 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/06541 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/06589 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/76877 ({Thin films associated with contacts of capacitors}): 1 patents
H01L2224/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/83101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/92244 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/18162 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/4871 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
H01L22/12 ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions): 1 patents
H01L2924/19103 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

Taiwan Semiconductor Manufacturing Co., Ltd.: 43 patents

Collaborators

Jiun Yi Wu (9 collaborations)
Hsing-Kuo Hsia (8 collaborations)
Chung-Shi Liu (6 collaborations)
Jui Lin Chao (6 collaborations)
Szu-Wei Lu (5 collaborations)
Chuei-Tang Wang (5 collaborations)
Chung-Hao Tsai (4 collaborations)
Wei-Yu Chen (3 collaborations)
Shang-Yun Hou (3 collaborations)
Chih-Wei Tseng (3 collaborations)
Ming-Fa Chen (3 collaborations)
Hung-Yi Kuo (3 collaborations)
Hao-Yi Tsai (3 collaborations)
Tin-Hao Kuo (3 collaborations)
Tung-Liang Shao (3 collaborations)
Yu-Sheng Huang (3 collaborations)
Chi-Hsi Wu (2 collaborations)
Hsien-Pin Hu (2 collaborations)
Jing-Cheng Lin (2 collaborations)
Yung-Chi Lin (2 collaborations)
Kuo-Chung Yee (2 collaborations)
Chung-Ju Lee (2 collaborations)
Cheng-Chieh Hsieh (2 collaborations)
An-Jhih Su (2 collaborations)
Chao-Wen Shih (2 collaborations)
Chien-Hsun Lee (2 collaborations)
Hsien-Wei Chen (2 collaborations)
Jie Chen (2 collaborations)
Wen-Chih Chiou (2 collaborations)
Chia-Shen Cheng (1 collaborations)
Hao-Jan Pei (1 collaborations)
Philip Yu-Shuan Chung (1 collaborations)
Kuei-Wei Huang (1 collaborations)
Yu-Peng Tsai (1 collaborations)
Hsiu-Jen Lin (1 collaborations)
Ching-Hua Hsieh (1 collaborations)
Chin-Chuan Chang (1 collaborations)
Chih-Hao Yu (1 collaborations)
Shih-Peng Tai (1 collaborations)
Kuo-Chiang Ting (1 collaborations)
Sung-Hui Huang (1 collaborations)
Jiun Ren Lai (1 collaborations)
Yu-Jen Lien (1 collaborations)
Ke-Han Shen (1 collaborations)
Wei-Kong Sheng (1 collaborations)
Tsung-Fu Tsai (1 collaborations)
Chih-Ming Ke (1 collaborations)
Han-Ping Pu (1 collaborations)
Hsin-Yu Pan (1 collaborations)
Sen-Kuei Hsu (1 collaborations)
Chih-Hsin Lu (1 collaborations)
Chin-Her Chien (1 collaborations)
You-Rong Shaw (1 collaborations)
Chia-Chia Lin (1 collaborations)
Kuo Yang Wu (1 collaborations)
Po-Hao Tsai (1 collaborations)
Wei Ling Chang (1 collaborations)
Che-Wei Hsu (1 collaborations)
Wen-Hao Cheng (1 collaborations)
Chieh-Yen Chen (1 collaborations)
Jeng-Nan Hung (1 collaborations)
Chih-Hang Tung (1 collaborations)
Chung-Ming Weng (1 collaborations)
Tsung-Yuan Yu (1 collaborations)
Hua-Kuei Lin (1 collaborations)
Che-Hsiang Hsu (1 collaborations)
Wei-Kang Hsieh (1 collaborations)
Shih-Wei Chen (1 collaborations)
Yih Wang (1 collaborations)
Wei-Ting Chen (1 collaborations)
Shin-Puu Jeng (1 collaborations)
Der-Chyang Yeh (1 collaborations)
Sao-Ling Chiu (1 collaborations)
Wen-Hsin Wei (1 collaborations)
Ping-Kang Huang (1 collaborations)
Chih-Ta Shen (1 collaborations)
Ying-Ching Shih (1 collaborations)
Tzuan-Horng Liu (1 collaborations)
Sung-Feng Yeh (1 collaborations)

Subcategories

This category has the following 12 subcategories, out of 12 total.

C

► Chen-Hua Yu‎ (12 C)
► Ching-Hua Hsieh‎ (4 C)
► Chung-Shi Liu‎ (8 C)

H

► Hao-Yi Tsai‎ (4 C)
► Hsien-Wei Chen‎ (5 C)
► Hsing-Kuo Hsia‎ (2 C)
► Hung-Jui Kuo‎ (1 C)

J

► Jiun Yi Wu‎ (4 C)

K

► Kuo-Chung Yee‎ (4 C)

M

► Ming-Fa Chen‎ (3 C)

S

► Shin-Puu Jeng‎ (5 C)
► Szu-Wei Lu‎ (5 C)

Difference between revisions of "Category:Chen-Hua Yu"

Latest revision as of 02:13, 19 July 2024

Contents

Chen-Hua Yu

Executive Summary

Patent Filing Activity

Technology Areas

List of Technology Areas

Companies

List of Companies

Collaborators

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H

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@@ Line 2: / Line 2: @@
 === Executive Summary ===
-Chen-Hua Yu is an inventor who has filed 14 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (8 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (14 patents). Their most frequent collaborators include [[Category:Kuo-Chung Yee|Kuo-Chung Yee]] (5 collaborations), [[Category:Chun-Hui Yu|Chun-Hui Yu]] (4 collaborations), [[Category:Chung-Hao Tsai|Chung-Hao Tsai]] (3 collaborations).
+Chen-Hua Yu is an inventor who has filed 43 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), {Multilayer substrates  (multilayer metallisation on monolayer substrate (8 patents), Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor} (8 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (43 patents). Their most frequent collaborators include [[Category:Jiun Yi Wu|Jiun Yi Wu]] (9 collaborations), [[Category:Hsing-Kuo Hsia|Hsing-Kuo Hsia]] (8 collaborations), [[Category:Chung-Shi Liu|Chung-Shi Liu]] (6 collaborations).
 === Patent Filing Activity ===
@@ Line 11: / Line 11: @@
 ==== List of Technology Areas ====
-* [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
+* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 9 patents
-* [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
+* [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates  (multilayer metallisation on monolayer substrate): 8 patents
+* [[:Category:CPC_H01L23/481|H01L23/481]] (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 8 patents
+* [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 8 patents
+* [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
+* [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
+* [[:Category:CPC_H01L25/18|H01L25/18]] (the devices being of types provided for in two or more different subgroups of the same main group of groups): 8 patents
+* [[:Category:CPC_H01L21/56|H01L21/56]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
+* [[:Category:CPC_H01L23/49833|H01L23/49833]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 7 patents
+* [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
+* [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
+* [[:Category:CPC_H01L23/5389|H01L23/5389]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 6 patents
 * [[:Category:CPC_H01L23/3128|H01L23/3128]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
-* [[:Category:CPC_H01L23/5383|H01L23/5383]] ({Multilayer substrates  (): 5 patents
+* [[:Category:CPC_H01L23/5383|H01L23/5383]] ({Multilayer substrates  (): 6 patents
-* [[:Category:CPC_H01L2224/214|H01L2224/214]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
+* [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 6 patents
-* [[:Category:CPC_H01L23/5389|H01L23/5389]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 4 patents
+* [[:Category:CPC_H01L21/4857|H01L21/4857]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 6 patents
-* [[:Category:CPC_H01L21/4853|H01L21/4853]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 4 patents
+* [[:Category:CPC_H01L24/17|H01L24/17]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
-* [[:Category:CPC_H01L21/4857|H01L21/4857]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 4 patents
+* [[:Category:CPC_H01L24/97|H01L24/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
-* [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_H01L25/105|H01L25/105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
-* [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 4 patents
+* [[:Category:CPC_H01L2224/73204|H01L2224/73204]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
-* [[:Category:CPC_H01L21/6835|H01L21/6835]] ({using temporarily an auxiliary support}): 4 patents
+* [[:Category:CPC_H01L2225/1058|H01L2225/1058]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
-* [[:Category:CPC_H01L21/565|H01L21/565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 5 patents
+* [[:Category:CPC_H01L21/4853|H01L21/4853]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 5 patents
+* [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 5 patents
+* [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
+* [[:Category:CPC_H01L24/81|H01L24/81]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_H01L21/561|H01L21/561]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_H01L21/76898|H01L21/76898]] ({formed through a semiconductor substrate}): 4 patents
+* [[:Category:CPC_H01L25/0652|H01L25/0652]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_G02B6/13|G02B6/13]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 4 patents
+* [[:Category:CPC_H01L23/3121|H01L23/3121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_G02B6/12004|G02B6/12004]] (of the integrated circuit kind  (electric integrated circuits): 4 patents
+* [[:Category:CPC_H01L24/09|H01L24/09]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_H01L21/565|H01L21/565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
 * [[:Category:CPC_H01L23/3114|H01L23/3114]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
-* [[:Category:CPC_H01L25/0652|H01L25/0652]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L21/563|H01L21/563]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
-* [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 3 patents
+* [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 3 patents
-* [[:Category:CPC_H01L2224/12105|H01L2224/12105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L24/94|H01L24/94]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
-* [[:Category:CPC_H01L2224/18|H01L2224/18]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L24/96|H01L24/96]] ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 3 patents
-* [[:Category:CPC_H01L2221/68372|H01L2221/68372]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L24/48|H01L24/48]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L2225/1041|H01L2225/1041]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L2924/182|H01L2924/182]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_G02B2006/12121|G02B2006/12121]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 3 patents
+* [[:Category:CPC_G02B6/4214|G02B6/4214]] (Coupling light guides with opto-electronic elements): 3 patents
+* [[:Category:CPC_H01L23/49827|H01L23/49827]] ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables  (): 3 patents
+* [[:Category:CPC_H10B80/00|H10B80/00]] (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 3 patents
+* [[:Category:CPC_H01L2224/16225|H01L2224/16225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L2224/32245|H01L2224/32245]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L25/0655|H01L25/0655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L2224/0231|H01L2224/0231]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L24/03|H01L24/03]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
 * [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
-* [[:Category:CPC_H01L2224/24137|H01L2224/24137]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L24/14|H01L24/14]] ({of a plurality of bump connectors}): 3 patents
+* [[:Category:CPC_H01L24/13|H01L24/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L21/76802|H01L21/76802]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 3 patents
+* [[:Category:CPC_H01L23/31|H01L23/31]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L24/29|H01L24/29]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L2924/1431|H01L2924/1431]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L23/5385|H01L23/5385]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 3 patents
+* [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L2225/1035|H01L2225/1035]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L2924/3511|H01L2924/3511]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/08235|H01L2224/08235]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/32145|H01L2224/32145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2225/1023|H01L2225/1023]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_G02B6/1225|G02B6/1225]] (of the integrated circuit kind  (electric integrated circuits): 2 patents
+* [[:Category:CPC_H01L23/3677|H01L23/3677]] (Cooling facilitated by shape of device {(): 2 patents
+* [[:Category:CPC_H01L24/33|H01L24/33]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/33181|H01L2224/33181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/73253|H01L2224/73253]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L23/473|H01L23/473]] (by flowing liquids {(): 2 patents
+* [[:Category:CPC_H01L23/3135|H01L23/3135]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_G02B6/4239|G02B6/4239]] (Coupling light guides with opto-electronic elements): 2 patents
+* [[:Category:CPC_G02B2006/12104|G02B2006/12104]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
+* [[:Category:CPC_G02B6/136|G02B6/136]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
 * [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L23/66|H01L23/66]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/02373|H01L2224/02373]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L2224/92244|H01L2224/92244]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2924/1433|H01L2924/1433]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L24/06|H01L24/06]] ({of a plurality of bonding areas}): 2 patents
+* [[:Category:CPC_G02B6/132|G02B6/132]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
+* [[:Category:CPC_G02B2006/12061|G02B2006/12061]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
+* [[:Category:CPC_H01L2224/02375|H01L2224/02375]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L24/83|H01L24/83]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2924/1632|H01L2924/1632]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L23/5384|H01L23/5384]] ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors  (): 2 patents
+* [[:Category:CPC_H01L23/562|H01L23/562]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L23/49811|H01L23/49811]] ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads  (): 2 patents
+* [[:Category:CPC_H01L2224/214|H01L2224/214]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L25/167|H01L25/167]] (the devices being of types provided for in two or more different main groups of groups): 2 patents
+* [[:Category:CPC_H01L23/3675|H01L23/3675]] (Cooling facilitated by shape of device {(): 2 patents
+* [[:Category:CPC_H01L23/49861|H01L23/49861]] ({Lead-frames fixed on or encapsulated in insulating substrates  (): 2 patents
+* [[:Category:CPC_H01L23/528|H01L23/528]] ({Geometry or} layout of the interconnection structure {(): 2 patents
+* [[:Category:CPC_H01L23/4006|H01L23/4006]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/08145|H01L2224/08145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/2919|H01L2224/2919]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2924/1437|H01L2924/1437]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 * [[:Category:CPC_H01L2224/04105|H01L2224/04105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/12105|H01L2224/12105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L25/0655|H01L25/0655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 * [[:Category:CPC_H01L2224/73267|H01L2224/73267]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L2224/16227|H01L2224/16227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/175|H01L2224/175]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2225/06524|H01L2225/06524]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/81224|H01L2224/81224]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L23/367|H01L23/367]] (Cooling facilitated by shape of device {(): 2 patents
+* [[:Category:CPC_H01L2224/16148|H01L2224/16148]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L24/96|H01L24/96]] ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 2 patents
+* [[:Category:CPC_H01L2224/48229|H01L2224/48229]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_G02B6/12004|G02B6/12004]] (of the integrated circuit kind  (electric integrated circuits): 2 patents
+* [[:Category:CPC_H01L2224/95001|H01L2224/95001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/561|H01L21/561]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2225/06513|H01L2225/06513]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2225/06524|H01L2225/06524]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L24/13|H01L24/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2225/06544|H01L2225/06544]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L24/24|H01L24/24]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2924/37001|H01L2924/37001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 2 patents
+* [[:Category:CPC_G02B6/122|G02B6/122]] (of the integrated circuit kind  (electric integrated circuits): 1 patents
-* [[:Category:CPC_H01L2224/05647|H01L2224/05647]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_G02B6/12019|G02B6/12019]] (of the integrated circuit kind  (electric integrated circuits): 1 patents
-* [[:Category:CPC_H01L2224/215|H01L2224/215]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_G02B6/4243|G02B6/4243]] (Coupling light guides with opto-electronic elements): 1 patents
-* [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L21/6835|H01L21/6835]] ({using temporarily an auxiliary support}): 1 patents
-* [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L23/147|H01L23/147]] ({Semiconductor insulating substrates  (semiconductor conductive substrates): 1 patents
-* [[:Category:CPC_G02B6/4239|G02B6/4239]] (Coupling light guides with opto-electronic elements): 2 patents
+* [[:Category:CPC_H01S5/02315|H01S5/02315]] (Support members, e.g. bases or carriers): 1 patents
-* [[:Category:CPC_H01L23/481|H01L23/481]] (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 2 patents
+* [[:Category:CPC_H01S5/0232|H01S5/0232]] (Lead-frames): 1 patents
-* [[:Category:CPC_H01L24/02|H01L24/02]] ({Bonding areas  (on insulating substrates, e.g. chip carriers,): 2 patents
+* [[:Category:CPC_H01S5/02345|H01S5/02345]] (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
-* [[:Category:CPC_H01L2224/024|H01L2224/024]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01S5/028|H01S5/028]] (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
-* [[:Category:CPC_H01L21/56|H01L21/56]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/48225|H01L2224/48225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 2 patents
+* [[:Category:CPC_H01L23/3736|H01L23/3736]] ({Metallic materials  (): 1 patents
-* [[:Category:CPC_H01L2221/68359|H01L2221/68359]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/29124|H01L2224/29124]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L33/62|H01L33/62]] (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
+* [[:Category:CPC_H01L2224/29147|H01L2224/29147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L25/0753|H01L25/0753]] (the devices being of a type provided for in group): 1 patents
+* [[:Category:CPC_H01L2224/29155|H01L2224/29155]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L33/105|H01L33/105]] ({with a resonant cavity structure}): 1 patents
+* [[:Category:CPC_H01L2224/29166|H01L2224/29166]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L33/465|H01L33/465]] ({with a resonant cavity structure}): 1 patents
+* [[:Category:CPC_H01L2224/29172|H01L2224/29172]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L33/52|H01L33/52]] (Encapsulations): 1 patents
+* [[:Category:CPC_G02B6/262|G02B6/262]] (Optical coupling means  (): 1 patents
-* [[:Category:CPC_H01L2933/0025|H01L2933/0025]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_G02B2006/12102|G02B2006/12102]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
-* [[:Category:CPC_H01L2933/0033|H01L2933/0033]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_G02B6/30|G02B6/30]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
-* [[:Category:CPC_H01L2933/005|H01L2933/005]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L23/3171|H01L23/3171]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01S5/022|H01S5/022]] (Mountings; Housings): 1 patents
+* [[:Category:CPC_H01L23/5283|H01L23/5283]] ({Geometry or} layout of the interconnection structure {(): 1 patents
+* [[:Category:CPC_H01L23/525|H01L23/525]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L23/293|H01L23/293]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L23/3192|H01L23/3192]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L23/5225|H01L23/5225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L23/5329|H01L23/5329]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L23/552|H01L23/552]] (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
+* [[:Category:CPC_H01L24/11|H01L24/11]] ({Manufacturing methods  (for bumps on insulating substrates): 1 patents
+* [[:Category:CPC_H01L23/5286|H01L23/5286]] ({Geometry or} layout of the interconnection structure {(): 1 patents
+* [[:Category:CPC_G02B6/4295|G02B6/4295]] (Coupling light guides with opto-electronic elements): 1 patents
+* [[:Category:CPC_H01L2224/02381|H01L2224/02381]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L21/4878|H01L21/4878]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
+* [[:Category:CPC_H01L23/315|H01L23/315]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/16235|H01L2224/16235]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/83359|H01L2224/83359]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2021/60022|H01L2021/60022]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L23/49866|H01L23/49866]] ({characterised by the materials  (materials of the substrates): 1 patents
+* [[:Category:CPC_H01L23/49894|H01L23/49894]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
+* [[:Category:CPC_H01L2224/16227|H01L2224/16227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L23/14|H01L23/14]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/8234|H01L2224/8234]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/35|H01L2924/35]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/0401|H01L2224/0401]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/211|H01L2224/211]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/2101|H01L2224/2101]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/2902|H01L2224/2902]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/14104|H01L2224/14104]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/8134|H01L2224/8134]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H04B10/50|H04B10/50]] (Transmitters): 1 patents
+* [[:Category:CPC_H01L2224/08225|H01L2224/08225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L21/4882|H01L21/4882]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
+* [[:Category:CPC_H01L23/44|H01L23/44]] (the complete device being wholly immersed in a fluid other than air {(): 1 patents
+* [[:Category:CPC_H01L23/3735|H01L23/3735]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/16196|H01L2924/16196]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/16235|H01L2924/16235]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/16587|H01L2924/16587]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/29187|H01L2224/29187]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/82896|H01L2224/82896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/02379|H01L2224/02379]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L23/544|H01L23/544]] (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps  (test patterns for characterising or monitoring manufacturing processes): 1 patents
+* [[:Category:CPC_H01L21/76895|H01L21/76895]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
+* [[:Category:CPC_H01L21/77|H01L21/77]] (Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate  (electrically programmable read-only memories or multistep manufacturing processes therefor): 1 patents
+* [[:Category:CPC_H01L2224/02311|H01L2224/02311]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/02313|H01L2224/02313]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/0239|H01L2224/0239]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L23/5381|H01L23/5381]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
 * [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
-* [[:Category:CPC_H01L21/78|H01L21/78]] (with subsequent division of the substrate into plural individual devices  (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
+* [[:Category:CPC_H01L2224/16146|H01L2224/16146]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L23/5384|H01L23/5384]] ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors  (): 1 patents
+* [[:Category:CPC_H01L2224/16165|H01L2224/16165]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01Q1/2283|H01Q1/2283]] ({mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}): 1 patents
+* [[:Category:CPC_H01L2224/818|H01L2224/818]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01Q21/0087|H01Q21/0087]] ({Apparatus or processes specially adapted for manufacturing antenna arrays  (manufacturing waveguides): 1 patents
+* [[:Category:CPC_H01L2924/1434|H01L2924/1434]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L23/5385|H01L23/5385]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
+* [[:Category:CPC_G02B6/43|G02B6/43]] (Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections): 1 patents
-* [[:Category:CPC_H01L2224/73204|H01L2224/73204]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_G02B6/4204|G02B6/4204]] (Coupling light guides with opto-electronic elements): 1 patents
-* [[:Category:CPC_H01L2223/6688|H01L2223/6688]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_G02B6/4253|G02B6/4253]] (Coupling light guides with opto-electronic elements): 1 patents
-* [[:Category:CPC_H01L2224/32145|H01L2224/32145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_G02B2006/12123|G02B2006/12123]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
-* [[:Category:CPC_H01L2224/73253|H01L2224/73253]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/05022|H01L2224/05022]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/81005|H01L2224/81005]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2223/6616|H01L2223/6616]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2223/6677|H01L2223/6677]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2223/6683|H01L2223/6683]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2225/06548|H01L2225/06548]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2225/06558|H01L2225/06558]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2225/06572|H01L2225/06572]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2225/06586|H01L2225/06586]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2225/06555|H01L2225/06555]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L23/5381|H01L23/5381]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
-* [[:Category:CPC_H01L2224/95001|H01L2224/95001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_G02B6/13|G02B6/13]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
-* [[:Category:CPC_H01L25/105|H01L25/105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H10B80/00|H10B80/00]] (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
-* [[:Category:CPC_H01L24/09|H01L24/09]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/05018|H01L2224/05018]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/05027|H01L2224/05027]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2224/05124|H01L2224/05124]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/05147|H01L2224/05147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2224/05562|H01L2224/05562]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2224/05571|H01L2224/05571]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2224/05624|H01L2224/05624]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/05644|H01L2224/05644]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/05647|H01L2224/05647]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/08235|H01L2224/08235]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/05666|H01L2224/05666]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/05684|H01L2224/05684]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/08147|H01L2224/08147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2224/08237|H01L2224/08237]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/09181|H01L2224/09181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/13109|H01L2224/13109]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2224/13111|H01L2224/13111]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/13116|H01L2224/13116]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/13124|H01L2224/13124]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2224/13139|H01L2224/13139]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/13144|H01L2224/13144]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2224/13147|H01L2224/13147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/244|H01L2224/244]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/13155|H01L2224/13155]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/245|H01L2224/245]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/13164|H01L2224/13164]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2224/80357|H01L2224/80357]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2225/1023|H01L2225/1023]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/80379|H01L2224/80379]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2225/107|H01L2225/107]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/0504|H01L2924/0504]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/01013|H01L2924/01013]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/0544|H01L2924/0544]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/01028|H01L2924/01028]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/05494|H01L2924/05494]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/01029|H01L2924/01029]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/0665|H01L2924/0665]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/01047|H01L2924/01047]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/07025|H01L2924/07025]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/01074|H01L2924/01074]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/1432|H01L2924/1432]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/01079|H01L2924/01079]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/14361|H01L2924/14361]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/014|H01L2924/014]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_G02B6/0006|G02B6/0006]] (Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings): 1 patents
-* [[:Category:CPC_G02B6/4243|G02B6/4243]] (Coupling light guides with opto-electronic elements): 1 patents
+* [[:Category:CPC_G02B6/124|G02B6/124]] (of the integrated circuit kind  (electric integrated circuits): 1 patents
-* [[:Category:CPC_G02B6/4214|G02B6/4214]] (Coupling light guides with opto-electronic elements): 1 patents
+* [[:Category:CPC_G02B6/4244|G02B6/4244]] (Coupling light guides with opto-electronic elements): 1 patents
-* [[:Category:CPC_G02B6/4251|G02B6/4251]] (Coupling light guides with opto-electronic elements): 1 patents
+* [[:Category:CPC_G02B6/4283|G02B6/4283]] (Coupling light guides with opto-electronic elements): 1 patents
-* [[:Category:CPC_G02B6/4274|G02B6/4274]] (Coupling light guides with opto-electronic elements): 1 patents
+* [[:Category:CPC_H01L23/367|H01L23/367]] (Cooling facilitated by shape of device {(): 1 patents
-* [[:Category:CPC_H01L25/167|H01L25/167]] (the devices being of types provided for in two or more different main groups of groups): 1 patents
+* [[:Category:CPC_H01L23/4012|H01L23/4012]] ({for stacked arrangements of a plurality of semiconductor devices  (assemblies per se): 1 patents
-* [[:Category:CPC_G02B6/4202|G02B6/4202]] (Coupling light guides with opto-electronic elements): 1 patents
+* [[:Category:CPC_H01L23/50|H01L23/50]] (for integrated circuit devices, {e.g. power bus, number of leads} (): 1 patents
-* [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/04042|H01L2224/04042]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L23/5286|H01L23/5286]] ({Geometry or} layout of the interconnection structure {(): 1 patents
-* [[:Category:CPC_H01L23/5283|H01L23/5283]] ({Geometry or} layout of the interconnection structure {(): 1 patents
-* [[:Category:CPC_H01L2225/06544|H01L2225/06544]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2225/06568|H01L2225/06568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/1011|H01L2924/1011]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/10157|H01L2924/10157]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/08146|H01L2224/08146]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/0801|H01L2224/0801]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/05016|H01L2224/05016]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/05556|H01L2224/05556]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/05576|H01L2224/05576]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/13026|H01L2224/13026]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L24/12|H01L24/12]] ({Structure, shape, material or disposition of the bump connectors prior to the connecting process}): 1 patents
-* [[:Category:CPC_H01L25/065|H01L25/065]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L24/48|H01L24/48]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/02331|H01L2224/02331]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/02379|H01L2224/02379]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2224/48091|H01L2224/48091]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2224/48227|H01L2224/48227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/48464|H01L2224/48464]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/73265|H01L2224/73265]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/81385|H01L2224/81385]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2924/00014|H01L2924/00014]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/10252|H01L2924/10252]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/14|H01L2924/14]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/10253|H01L2924/10253]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/15311|H01L2924/15311]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/10272|H01L2924/10272]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/10329|H01L2924/10329]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/1203|H01L2924/1203]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/1304|H01L2924/1304]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/1433|H01L2924/1433]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2924/181|H01L2924/181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L23/49503|H01L23/49503]] (Lead-frames {or other flat leads  (): 1 patents
+* [[:Category:CPC_H01L21/481|H01L21/481]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
-* [[:Category:CPC_H01L24/06|H01L24/06]] ({of a plurality of bonding areas}): 1 patents
+* [[:Category:CPC_H01L24/92|H01L24/92]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L24/18|H01L24/18]] ({High density interconnect [HDI] connectors; Manufacturing methods related thereto  (interconnection structure between a plurality of semiconductor chips): 1 patents
+* [[:Category:CPC_H01L2224/08146|H01L2224/08146]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L24/25|H01L24/25]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/33505|H01L2224/33505]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L24/97|H01L24/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/33519|H01L2224/33519]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/80006|H01L2224/80006]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/8083|H01L2224/8083]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/83005|H01L2224/83005]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/8383|H01L2224/8383]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/83896|H01L2224/83896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/92142|H01L2224/92142]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2225/06541|H01L2225/06541]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2225/06589|H01L2225/06589]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2224/023|H01L2224/023]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/02375|H01L2224/02375]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2225/107|H01L2225/107]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/02381|H01L2224/02381]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/0401|H01L2224/0401]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L21/76877|H01L21/76877]] ({Thin films associated with contacts of capacitors}): 1 patents
-* [[:Category:CPC_H01L2224/05558|H01L2224/05558]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/19|H01L2224/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/05569|H01L2224/05569]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/83101|H01L2224/83101]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/05572|H01L2224/05572]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/92244|H01L2224/92244]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/05655|H01L2224/05655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/05666|H01L2224/05666]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/05684|H01L2224/05684]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/0603|H01L2224/0603]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/06051|H01L2224/06051]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/06102|H01L2224/06102]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/06181|H01L2224/06181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/09051|H01L2224/09051]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/09055|H01L2224/09055]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/14181|H01L2224/14181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/225|H01L2224/225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/82|H01L2224/82]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/82986|H01L2224/82986]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2224/97|H01L2224/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2225/1035|H01L2225/1035]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L2924/18162|H01L2924/18162]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/37001|H01L2924/37001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L21/4871|H01L21/4871]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
-* [[:Category:CPC_G02B6/34|G02B6/34]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
+* [[:Category:CPC_H01L21/78|H01L21/78]] (with subsequent division of the substrate into plural individual devices  (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
-* [[:Category:CPC_G02B6/4201|G02B6/4201]] (Coupling light guides with opto-electronic elements): 1 patents
+* [[:Category:CPC_H01L22/12|H01L22/12]] ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions  (electrical measurement of diffusions): 1 patents
-* [[:Category:CPC_G02B2006/12104|G02B2006/12104]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
+* [[:Category:CPC_H01L2924/19103|H01L2924/19103]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_G02B2006/12114|G02B2006/12114]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
-* [[:Category:CPC_H01L23/46|H01L23/46]] (involving the transfer of heat by flowing fluids  (): 1 patents
-* [[:Category:CPC_H01L23/3157|H01L23/3157]] ({Partial encapsulation or coating  (mask layer used as insulation layer): 1 patents
-* [[:Category:CPC_H01L23/433|H01L23/433]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L24/29|H01L24/29]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/29018|H01L2224/29018]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L24/81|H01L24/81]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L25/18|H01L25/18]] (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
-* [[:Category:CPC_H01L2221/68381|H01L2221/68381]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2223/6627|H01L2223/6627]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/24225|H01L2224/24225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/1431|H01L2924/1431]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2924/1434|H01L2924/1434]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/2101|H01L2224/2101]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 === Companies ===
@@ Line 207: / Line 272: @@
 ==== List of Companies ====
-* Taiwan Semiconductor Manufacturing Company, Ltd.: 14 patents
+* Taiwan Semiconductor Manufacturing Co., Ltd.: 43 patents
 === Collaborators ===
-* [[:Category:Kuo-Chung Yee|Kuo-Chung Yee]][[Category:Kuo-Chung Yee]] (5 collaborations)
+* [[:Category:Jiun Yi Wu|Jiun Yi Wu]][[Category:Jiun Yi Wu]] (9 collaborations)
-* [[:Category:Chun-Hui Yu|Chun-Hui Yu]][[Category:Chun-Hui Yu]] (4 collaborations)
+* [[:Category:Hsing-Kuo Hsia|Hsing-Kuo Hsia]][[Category:Hsing-Kuo Hsia]] (8 collaborations)
-* [[:Category:Chung-Hao Tsai|Chung-Hao Tsai]][[Category:Chung-Hao Tsai]] (3 collaborations)
+* [[:Category:Chung-Shi Liu|Chung-Shi Liu]][[Category:Chung-Shi Liu]] (6 collaborations)
-* [[:Category:Chuei-Tang WANG|Chuei-Tang WANG]][[Category:Chuei-Tang WANG]] (3 collaborations)
+* [[:Category:Jui Lin Chao|Jui Lin Chao]][[Category:Jui Lin Chao]] (6 collaborations)
-* [[:Category:Chien-Hsun Chen|Chien-Hsun Chen]][[Category:Chien-Hsun Chen]] (2 collaborations)
+* [[:Category:Szu-Wei Lu|Szu-Wei Lu]][[Category:Szu-Wei Lu]] (5 collaborations)
-* [[:Category:Chung-Ming Weng|Chung-Ming Weng]][[Category:Chung-Ming Weng]] (2 collaborations)
+* [[:Category:Chuei-Tang Wang|Chuei-Tang Wang]][[Category:Chuei-Tang Wang]] (5 collaborations)
-* [[:Category:Chung-Shi Liu|Chung-Shi Liu]][[Category:Chung-Shi Liu]] (2 collaborations)
+* [[:Category:Chung-Hao Tsai|Chung-Hao Tsai]][[Category:Chung-Hao Tsai]] (4 collaborations)
+* [[:Category:Wei-Yu Chen|Wei-Yu Chen]][[Category:Wei-Yu Chen]] (3 collaborations)
+* [[:Category:Shang-Yun Hou|Shang-Yun Hou]][[Category:Shang-Yun Hou]] (3 collaborations)
+* [[:Category:Chih-Wei Tseng|Chih-Wei Tseng]][[Category:Chih-Wei Tseng]] (3 collaborations)
+* [[:Category:Ming-Fa Chen|Ming-Fa Chen]][[Category:Ming-Fa Chen]] (3 collaborations)
+* [[:Category:Hung-Yi Kuo|Hung-Yi Kuo]][[Category:Hung-Yi Kuo]] (3 collaborations)
+* [[:Category:Hao-Yi Tsai|Hao-Yi Tsai]][[Category:Hao-Yi Tsai]] (3 collaborations)
+* [[:Category:Tin-Hao Kuo|Tin-Hao Kuo]][[Category:Tin-Hao Kuo]] (3 collaborations)
+* [[:Category:Tung-Liang Shao|Tung-Liang Shao]][[Category:Tung-Liang Shao]] (3 collaborations)
+* [[:Category:Yu-Sheng Huang|Yu-Sheng Huang]][[Category:Yu-Sheng Huang]] (3 collaborations)
+* [[:Category:Chi-Hsi Wu|Chi-Hsi Wu]][[Category:Chi-Hsi Wu]] (2 collaborations)
+* [[:Category:Hsien-Pin Hu|Hsien-Pin Hu]][[Category:Hsien-Pin Hu]] (2 collaborations)
+* [[:Category:Jing-Cheng Lin|Jing-Cheng Lin]][[Category:Jing-Cheng Lin]] (2 collaborations)
+* [[:Category:Yung-Chi Lin|Yung-Chi Lin]][[Category:Yung-Chi Lin]] (2 collaborations)
+* [[:Category:Kuo-Chung Yee|Kuo-Chung Yee]][[Category:Kuo-Chung Yee]] (2 collaborations)
+* [[:Category:Chung-Ju Lee|Chung-Ju Lee]][[Category:Chung-Ju Lee]] (2 collaborations)
 * [[:Category:Cheng-Chieh Hsieh|Cheng-Chieh Hsieh]][[Category:Cheng-Chieh Hsieh]] (2 collaborations)
-* [[:Category:Hung-Yi Kuo|Hung-Yi Kuo]][[Category:Hung-Yi Kuo]] (2 collaborations)
+* [[:Category:An-Jhih Su|An-Jhih Su]][[Category:An-Jhih Su]] (2 collaborations)
-* [[:Category:Tsung-Yuan Yu|Tsung-Yuan Yu]][[Category:Tsung-Yuan Yu]] (2 collaborations)
+* [[:Category:Chao-Wen Shih|Chao-Wen Shih]][[Category:Chao-Wen Shih]] (2 collaborations)
-* [[:Category:Che-Hsiang Hsu|Che-Hsiang Hsu]][[Category:Che-Hsiang Hsu]] (2 collaborations)
+* [[:Category:Chien-Hsun Lee|Chien-Hsun Lee]][[Category:Chien-Hsun Lee]] (2 collaborations)
-* [[:Category:Jeng-Nan Hung|Jeng-Nan Hung]][[Category:Jeng-Nan Hung]] (2 collaborations)
+* [[:Category:Hsien-Wei Chen|Hsien-Wei Chen]][[Category:Hsien-Wei Chen]] (2 collaborations)
-* [[:Category:Po-Fan Lin|Po-Fan Lin]][[Category:Po-Fan Lin]] (2 collaborations)
+* [[:Category:Jie Chen|Jie Chen]][[Category:Jie Chen]] (2 collaborations)
-* [[:Category:Keng-Han Lin|Keng-Han Lin]][[Category:Keng-Han Lin]] (1 collaborations)
+* [[:Category:Wen-Chih Chiou|Wen-Chih Chiou]][[Category:Wen-Chih Chiou]] (2 collaborations)
-* [[:Category:Hung-Jui Kuo|Hung-Jui Kuo]][[Category:Hung-Jui Kuo]] (1 collaborations)
+* [[:Category:Chia-Shen Cheng|Chia-Shen Cheng]][[Category:Chia-Shen Cheng]] (1 collaborations)
-* [[:Category:Hui-Jung Tsai|Hui-Jung Tsai]][[Category:Hui-Jung Tsai]] (1 collaborations)
+* [[:Category:Hao-Jan Pei|Hao-Jan Pei]][[Category:Hao-Jan Pei]] (1 collaborations)
-* [[:Category:Wei-Ting Chen|Wei-Ting Chen]][[Category:Wei-Ting Chen]] (1 collaborations)
+* [[:Category:Philip Yu-Shuan Chung|Philip Yu-Shuan Chung]][[Category:Philip Yu-Shuan Chung]] (1 collaborations)
-* [[:Category:Shih-Ya Huang|Shih-Ya Huang]][[Category:Shih-Ya Huang]] (1 collaborations)
+* [[:Category:Kuei-Wei Huang|Kuei-Wei Huang]][[Category:Kuei-Wei Huang]] (1 collaborations)
-* [[:Category:Chih-Wei Tseng|Chih-Wei Tseng]][[Category:Chih-Wei Tseng]] (1 collaborations)
+* [[:Category:Yu-Peng Tsai|Yu-Peng Tsai]][[Category:Yu-Peng Tsai]] (1 collaborations)
-* [[:Category:Hsing-Kuo Hsia|Hsing-Kuo Hsia]][[Category:Hsing-Kuo Hsia]] (1 collaborations)
+* [[:Category:Hsiu-Jen Lin|Hsiu-Jen Lin]][[Category:Hsiu-Jen Lin]] (1 collaborations)
-* [[:Category:Stefan Rusu of Sunnydale CA (US)|Stefan Rusu of Sunnydale CA (US)]][[Category:Stefan Rusu of Sunnydale CA (US)]] (1 collaborations)
+* [[:Category:Ching-Hua Hsieh|Ching-Hua Hsieh]][[Category:Ching-Hua Hsieh]] (1 collaborations)
-* [[:Category:Chewn-Pu Jou|Chewn-Pu Jou]][[Category:Chewn-Pu Jou]] (1 collaborations)
+* [[:Category:Chin-Chuan Chang|Chin-Chuan Chang]][[Category:Chin-Chuan Chang]] (1 collaborations)
-* [[:Category:Tso-Jung Chang|Tso-Jung Chang]][[Category:Tso-Jung Chang]] (1 collaborations)
+* [[:Category:Chih-Hao Yu|Chih-Hao Yu]][[Category:Chih-Hao Yu]] (1 collaborations)
-* [[:Category:Jeng-Shien Hsieh|Jeng-Shien Hsieh]][[Category:Jeng-Shien Hsieh]] (1 collaborations)
+* [[:Category:Shih-Peng Tai|Shih-Peng Tai]][[Category:Shih-Peng Tai]] (1 collaborations)
-* [[:Category:Shih-Ping Lin|Shih-Ping Lin]][[Category:Shih-Ping Lin]] (1 collaborations)
+* [[:Category:Kuo-Chiang Ting|Kuo-Chiang Ting]][[Category:Kuo-Chiang Ting]] (1 collaborations)
-* [[:Category:Chih-Peng Lin|Chih-Peng Lin]][[Category:Chih-Peng Lin]] (1 collaborations)
+* [[:Category:Sung-Hui Huang|Sung-Hui Huang]][[Category:Sung-Hui Huang]] (1 collaborations)
+* [[:Category:Jiun Ren Lai|Jiun Ren Lai]][[Category:Jiun Ren Lai]] (1 collaborations)
+* [[:Category:Yu-Jen Lien|Yu-Jen Lien]][[Category:Yu-Jen Lien]] (1 collaborations)
+* [[:Category:Ke-Han Shen|Ke-Han Shen]][[Category:Ke-Han Shen]] (1 collaborations)
+* [[:Category:Wei-Kong Sheng|Wei-Kong Sheng]][[Category:Wei-Kong Sheng]] (1 collaborations)
+* [[:Category:Tsung-Fu Tsai|Tsung-Fu Tsai]][[Category:Tsung-Fu Tsai]] (1 collaborations)
+* [[:Category:Chih-Ming Ke|Chih-Ming Ke]][[Category:Chih-Ming Ke]] (1 collaborations)
+* [[:Category:Han-Ping Pu|Han-Ping Pu]][[Category:Han-Ping Pu]] (1 collaborations)
+* [[:Category:Hsin-Yu Pan|Hsin-Yu Pan]][[Category:Hsin-Yu Pan]] (1 collaborations)
+* [[:Category:Sen-Kuei Hsu|Sen-Kuei Hsu]][[Category:Sen-Kuei Hsu]] (1 collaborations)
+* [[:Category:Chih-Hsin Lu|Chih-Hsin Lu]][[Category:Chih-Hsin Lu]] (1 collaborations)
+* [[:Category:Chin-Her Chien|Chin-Her Chien]][[Category:Chin-Her Chien]] (1 collaborations)
+* [[:Category:You-Rong Shaw|You-Rong Shaw]][[Category:You-Rong Shaw]] (1 collaborations)
+* [[:Category:Chia-Chia Lin|Chia-Chia Lin]][[Category:Chia-Chia Lin]] (1 collaborations)
+* [[:Category:Kuo Yang Wu|Kuo Yang Wu]][[Category:Kuo Yang Wu]] (1 collaborations)
+* [[:Category:Po-Hao Tsai|Po-Hao Tsai]][[Category:Po-Hao Tsai]] (1 collaborations)
+* [[:Category:Wei Ling Chang|Wei Ling Chang]][[Category:Wei Ling Chang]] (1 collaborations)
+* [[:Category:Che-Wei Hsu|Che-Wei Hsu]][[Category:Che-Wei Hsu]] (1 collaborations)
+* [[:Category:Wen-Hao Cheng|Wen-Hao Cheng]][[Category:Wen-Hao Cheng]] (1 collaborations)
 * [[:Category:Chieh-Yen Chen|Chieh-Yen Chen]][[Category:Chieh-Yen Chen]] (1 collaborations)
-* [[:Category:Hao-Yi Tsai|Hao-Yi Tsai]][[Category:Hao-Yi Tsai]] (1 collaborations)
+* [[:Category:Jeng-Nan Hung|Jeng-Nan Hung]][[Category:Jeng-Nan Hung]] (1 collaborations)
+* [[:Category:Chih-Hang Tung|Chih-Hang Tung]][[Category:Chih-Hang Tung]] (1 collaborations)
+* [[:Category:Chung-Ming Weng|Chung-Ming Weng]][[Category:Chung-Ming Weng]] (1 collaborations)
+* [[:Category:Tsung-Yuan Yu|Tsung-Yuan Yu]][[Category:Tsung-Yuan Yu]] (1 collaborations)
 * [[:Category:Hua-Kuei Lin|Hua-Kuei Lin]][[Category:Hua-Kuei Lin]] (1 collaborations)
-* [[:Category:Chih-Chieh Chang|Chih-Chieh Chang]][[Category:Chih-Chieh Chang]] (1 collaborations)
+* [[:Category:Che-Hsiang Hsu|Che-Hsiang Hsu]][[Category:Che-Hsiang Hsu]] (1 collaborations)
-* [[:Category:Chuei-Tang Wang|Chuei-Tang Wang]][[Category:Chuei-Tang Wang]] (1 collaborations)
+* [[:Category:Wei-Kang Hsieh|Wei-Kang Hsieh]][[Category:Wei-Kang Hsieh]] (1 collaborations)
-* [[:Category:Chih-Hsin Lu|Chih-Hsin Lu]][[Category:Chih-Hsin Lu]] (1 collaborations)
+* [[:Category:Shih-Wei Chen|Shih-Wei Chen]][[Category:Shih-Wei Chen]] (1 collaborations)
-* [[:Category:Shou-Yi Wang|Shou-Yi Wang]][[Category:Shou-Yi Wang]] (1 collaborations)
+* [[:Category:Yih Wang|Yih Wang]][[Category:Yih Wang]] (1 collaborations)
-* [[:Category:Jiun Yi Wu|Jiun Yi Wu]][[Category:Jiun Yi Wu]] (1 collaborations)
+* [[:Category:Wei-Ting Chen|Wei-Ting Chen]][[Category:Wei-Ting Chen]] (1 collaborations)
+* [[:Category:Shin-Puu Jeng|Shin-Puu Jeng]][[Category:Shin-Puu Jeng]] (1 collaborations)
+* [[:Category:Der-Chyang Yeh|Der-Chyang Yeh]][[Category:Der-Chyang Yeh]] (1 collaborations)
+* [[:Category:Sao-Ling Chiu|Sao-Ling Chiu]][[Category:Sao-Ling Chiu]] (1 collaborations)
+* [[:Category:Wen-Hsin Wei|Wen-Hsin Wei]][[Category:Wen-Hsin Wei]] (1 collaborations)
+* [[:Category:Ping-Kang Huang|Ping-Kang Huang]][[Category:Ping-Kang Huang]] (1 collaborations)
+* [[:Category:Chih-Ta Shen|Chih-Ta Shen]][[Category:Chih-Ta Shen]] (1 collaborations)
+* [[:Category:Ying-Ching Shih|Ying-Ching Shih]][[Category:Ying-Ching Shih]] (1 collaborations)
+* [[:Category:Tzuan-Horng Liu|Tzuan-Horng Liu]][[Category:Tzuan-Horng Liu]] (1 collaborations)
+* [[:Category:Sung-Feng Yeh|Sung-Feng Yeh]][[Category:Sung-Feng Yeh]] (1 collaborations)
 [[Category:Chen-Hua Yu]]
 [[Category:Inventors]]
-[[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Company, Ltd.]]
+[[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Co., Ltd.]]