Difference between revisions of "Category:Chen-Hua Yu"
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=== Executive Summary === | === Executive Summary === | ||
| − | Chen-Hua Yu is an inventor who has filed | + | Chen-Hua Yu is an inventor who has filed 14 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (8 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (14 patents). Their most frequent collaborators include [[Category:Kuo-Chung Yee|Kuo-Chung Yee]] (5 collaborations), [[Category:Chun-Hui Yu|Chun-Hui Yu]] (4 collaborations), [[Category:Chung-Hao Tsai|Chung-Hao Tsai]] (3 collaborations). |
=== Patent Filing Activity === | === Patent Filing Activity === | ||
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==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
| − | * [[:Category:CPC_H01L24/ | + | * [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents |
| − | + | * [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents | |
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| − | * [[:Category:CPC_H01L24/ | ||
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* [[:Category:CPC_H01L23/3128|H01L23/3128]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents | * [[:Category:CPC_H01L23/3128|H01L23/3128]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents | ||
| − | * [[:Category:CPC_H01L23/5383|H01L23/5383]] ({Multilayer substrates (): | + | * [[:Category:CPC_H01L23/5383|H01L23/5383]] ({Multilayer substrates (): 5 patents |
| − | * [[:Category:CPC_H01L23/ | + | * [[:Category:CPC_H01L2224/214|H01L2224/214]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents |
| − | * [[:Category:CPC_H01L21/ | + | * [[:Category:CPC_H01L23/5389|H01L23/5389]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 4 patents |
| − | + | * [[:Category:CPC_H01L21/4853|H01L21/4853]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 4 patents | |
| − | + | * [[:Category:CPC_H01L21/4857|H01L21/4857]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 4 patents | |
| − | + | * [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents | |
| − | + | * [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 4 patents | |
| − | + | * [[:Category:CPC_H01L21/6835|H01L21/6835]] ({using temporarily an auxiliary support}): 4 patents | |
| − | + | * [[:Category:CPC_H01L21/565|H01L21/565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents | |
| − | * [[:Category:CPC_H01L21/ | ||
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| − | * [[:Category:CPC_H01L21/ | ||
| − | * [[:Category: | ||
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| − | * [[:Category: | ||
| − | * [[:Category:CPC_H01L21/565|H01L21/565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): | ||
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* [[:Category:CPC_H01L23/3114|H01L23/3114]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents | * [[:Category:CPC_H01L23/3114|H01L23/3114]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents | ||
| − | * [[:Category: | + | * [[:Category:CPC_H01L25/0652|H01L25/0652]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents |
| − | * [[:Category: | + | * [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 3 patents |
| − | + | * [[:Category:CPC_H01L2224/12105|H01L2224/12105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents | |
| − | + | * [[:Category:CPC_H01L2224/18|H01L2224/18]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents | |
| − | + | * [[:Category:CPC_H01L2221/68372|H01L2221/68372]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents | |
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| − | * [[:Category:CPC_H01L2224/ | ||
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| − | * [[:Category:CPC_H01L2224/ | ||
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* [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents | * [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents | ||
| − | + | * [[:Category:CPC_H01L2224/24137|H01L2224/24137]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents | |
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| − | * [[:Category:CPC_H01L2224/ | ||
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* [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | * [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| − | + | * [[:Category:CPC_H01L23/66|H01L23/66]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | |
| − | + | * [[:Category:CPC_H01L2224/92244|H01L2224/92244]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | |
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| − | * [[:Category:CPC_H01L23/ | ||
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| − | * [[:Category:CPC_H01L2224/ | ||
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* [[:Category:CPC_H01L2224/04105|H01L2224/04105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | * [[:Category:CPC_H01L2224/04105|H01L2224/04105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| + | * [[:Category:CPC_H01L25/0655|H01L25/0655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
* [[:Category:CPC_H01L2224/73267|H01L2224/73267]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | * [[:Category:CPC_H01L2224/73267|H01L2224/73267]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L2224/16227|H01L2224/16227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L2225/06524|H01L2225/06524]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L23/367|H01L23/367]] (Cooling facilitated by shape of device {(): 2 patents |
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L24/96|H01L24/96]] ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 2 patents |
| + | * [[:Category:CPC_G02B6/12004|G02B6/12004]] (of the integrated circuit kind (electric integrated circuits): 2 patents | ||
| + | * [[:Category:CPC_H01L21/561|H01L21/561]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| + | * [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| + | * [[:Category:CPC_H01L24/13|H01L24/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| + | * [[:Category:CPC_H01L24/24|H01L24/24]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| + | * [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 2 patents | ||
| + | * [[:Category:CPC_H01L2224/05647|H01L2224/05647]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| + | * [[:Category:CPC_H01L2224/215|H01L2224/215]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| + | * [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| + | * [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| + | * [[:Category:CPC_G02B6/4239|G02B6/4239]] (Coupling light guides with opto-electronic elements): 2 patents | ||
| + | * [[:Category:CPC_H01L23/481|H01L23/481]] (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 2 patents | ||
| + | * [[:Category:CPC_H01L24/02|H01L24/02]] ({Bonding areas (on insulating substrates, e.g. chip carriers,): 2 patents | ||
| + | * [[:Category:CPC_H01L2224/024|H01L2224/024]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| + | * [[:Category:CPC_H01L21/56|H01L21/56]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| + | * [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents | ||
| + | * [[:Category:CPC_H01L2221/68359|H01L2221/68359]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| + | * [[:Category:CPC_H01L33/62|H01L33/62]] (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents | ||
| + | * [[:Category:CPC_H01L25/0753|H01L25/0753]] (the devices being of a type provided for in group): 1 patents | ||
| + | * [[:Category:CPC_H01L33/105|H01L33/105]] ({with a resonant cavity structure}): 1 patents | ||
| + | * [[:Category:CPC_H01L33/465|H01L33/465]] ({with a resonant cavity structure}): 1 patents | ||
| + | * [[:Category:CPC_H01L33/52|H01L33/52]] (Encapsulations): 1 patents | ||
| + | * [[:Category:CPC_H01L2933/0025|H01L2933/0025]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2933/0033|H01L2933/0033]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2933/005|H01L2933/005]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01S5/022|H01S5/022]] (Mountings; Housings): 1 patents | ||
| + | * [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents | ||
| + | * [[:Category:CPC_H01L21/78|H01L21/78]] (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents | ||
| + | * [[:Category:CPC_H01L23/5384|H01L23/5384]] ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents | ||
| + | * [[:Category:CPC_H01Q1/2283|H01Q1/2283]] ({mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}): 1 patents | ||
| + | * [[:Category:CPC_H01Q21/0087|H01Q21/0087]] ({Apparatus or processes specially adapted for manufacturing antenna arrays (manufacturing waveguides): 1 patents | ||
| + | * [[:Category:CPC_H01L23/5385|H01L23/5385]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/73204|H01L2224/73204]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2223/6688|H01L2223/6688]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/32145|H01L2224/32145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/73253|H01L2224/73253]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/81005|H01L2224/81005]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2223/6616|H01L2223/6616]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2223/6677|H01L2223/6677]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2223/6683|H01L2223/6683]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2225/06548|H01L2225/06548]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2225/06558|H01L2225/06558]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2225/06572|H01L2225/06572]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2225/06586|H01L2225/06586]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2225/06555|H01L2225/06555]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L23/5381|H01L23/5381]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents | ||
* [[:Category:CPC_H01L2224/95001|H01L2224/95001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/95001|H01L2224/95001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| − | + | * [[:Category:CPC_G02B6/13|G02B6/13]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents | |
| − | + | * [[:Category:CPC_H01L25/105|H01L25/105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| − | + | * [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| − | + | * [[:Category:CPC_H10B80/00|H10B80/00]] (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents | |
| − | * [[:Category:CPC_G02B6/ | + | * [[:Category:CPC_H01L24/09|H01L24/09]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | + | * [[:Category:CPC_H01L2224/05018|H01L2224/05018]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| − | + | * [[:Category:CPC_H01L2224/05027|H01L2224/05027]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
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* [[:Category:CPC_H01L2224/05124|H01L2224/05124]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/05124|H01L2224/05124]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/05147|H01L2224/05147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
* [[:Category:CPC_H01L2224/05562|H01L2224/05562]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/05562|H01L2224/05562]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
* [[:Category:CPC_H01L2224/05571|H01L2224/05571]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/05571|H01L2224/05571]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
* [[:Category:CPC_H01L2224/05624|H01L2224/05624]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/05624|H01L2224/05624]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L2224/05644|H01L2224/05644]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L2224/08235|H01L2224/08235]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
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* [[:Category:CPC_H01L2224/08237|H01L2224/08237]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/08237|H01L2224/08237]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L2224/09181|H01L2224/09181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
* [[:Category:CPC_H01L2224/13111|H01L2224/13111]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/13111|H01L2224/13111]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
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* [[:Category:CPC_H01L2224/13139|H01L2224/13139]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/13139|H01L2224/13139]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
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* [[:Category:CPC_H01L2224/13147|H01L2224/13147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/13147|H01L2224/13147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L2224/244|H01L2224/244]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L2224/245|H01L2224/245]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
* [[:Category:CPC_H01L2224/80357|H01L2224/80357]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/80357|H01L2224/80357]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| − | * [[:Category: | + | * [[:Category:CPC_H01L2225/1023|H01L2225/1023]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2924/ | + | * [[:Category:CPC_H01L2225/107|H01L2225/107]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2924/ | + | * [[:Category:CPC_H01L2924/01013|H01L2924/01013]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2924/ | + | * [[:Category:CPC_H01L2924/01028|H01L2924/01028]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2924/ | + | * [[:Category:CPC_H01L2924/01029|H01L2924/01029]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2924/ | + | * [[:Category:CPC_H01L2924/01047|H01L2924/01047]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2924/ | + | * [[:Category:CPC_H01L2924/01074|H01L2924/01074]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2924/ | + | * [[:Category:CPC_H01L2924/01079|H01L2924/01079]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_G02B6/ | + | * [[:Category:CPC_H01L2924/014|H01L2924/014]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_G02B6/ | + | * [[:Category:CPC_G02B6/4243|G02B6/4243]] (Coupling light guides with opto-electronic elements): 1 patents |
| − | * [[:Category:CPC_G02B6/ | + | * [[:Category:CPC_G02B6/4214|G02B6/4214]] (Coupling light guides with opto-electronic elements): 1 patents |
| − | * [[:Category:CPC_G02B6/ | + | * [[:Category:CPC_G02B6/4251|G02B6/4251]] (Coupling light guides with opto-electronic elements): 1 patents |
| − | * [[:Category:CPC_H01L23/ | + | * [[:Category:CPC_G02B6/4274|G02B6/4274]] (Coupling light guides with opto-electronic elements): 1 patents |
| − | * [[:Category:CPC_H01L23/ | + | * [[:Category:CPC_H01L25/167|H01L25/167]] (the devices being of types provided for in two or more different main groups of groups): 1 patents |
| − | * [[:Category: | + | * [[:Category:CPC_G02B6/4202|G02B6/4202]] (Coupling light guides with opto-electronic elements): 1 patents |
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| + | * [[:Category:CPC_H01L23/5286|H01L23/5286]] ({Geometry or} layout of the interconnection structure {(): 1 patents | ||
| + | * [[:Category:CPC_H01L23/5283|H01L23/5283]] ({Geometry or} layout of the interconnection structure {(): 1 patents | ||
| + | * [[:Category:CPC_H01L2225/06544|H01L2225/06544]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2225/06568|H01L2225/06568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2924/1011|H01L2924/1011]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2924/10157|H01L2924/10157]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/08146|H01L2224/08146]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/0801|H01L2224/0801]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/05016|H01L2224/05016]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/05556|H01L2224/05556]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/05576|H01L2224/05576]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/13026|H01L2224/13026]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L24/12|H01L24/12]] ({Structure, shape, material or disposition of the bump connectors prior to the connecting process}): 1 patents | ||
| + | * [[:Category:CPC_H01L25/065|H01L25/065]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L24/48|H01L24/48]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/02331|H01L2224/02331]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/02379|H01L2224/02379]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
* [[:Category:CPC_H01L2224/48091|H01L2224/48091]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/48091|H01L2224/48091]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
* [[:Category:CPC_H01L2224/48227|H01L2224/48227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/48227|H01L2224/48227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L2224/48464|H01L2224/48464]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | |||
* [[:Category:CPC_H01L2924/00014|H01L2924/00014]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2924/00014|H01L2924/00014]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| − | * [[:Category:CPC_H01L2924/ | + | * [[:Category:CPC_H01L2924/10252|H01L2924/10252]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2924/ | + | * [[:Category:CPC_H01L2924/10253|H01L2924/10253]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| + | * [[:Category:CPC_H01L2924/10272|H01L2924/10272]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2924/10329|H01L2924/10329]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2924/1203|H01L2924/1203]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2924/1304|H01L2924/1304]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2924/1433|H01L2924/1433]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
* [[:Category:CPC_H01L2924/181|H01L2924/181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2924/181|H01L2924/181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| − | * [[:Category: | + | * [[:Category:CPC_H01L23/49503|H01L23/49503]] (Lead-frames {or other flat leads (): 1 patents |
| − | * [[:Category:CPC_H01L24/ | + | * [[:Category:CPC_H01L24/06|H01L24/06]] ({of a plurality of bonding areas}): 1 patents |
| − | * [[:Category: | + | * [[:Category:CPC_H01L24/18|H01L24/18]] ({High density interconnect [HDI] connectors; Manufacturing methods related thereto (interconnection structure between a plurality of semiconductor chips): 1 patents |
| − | + | * [[:Category:CPC_H01L24/25|H01L24/25]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| − | * [[:Category: | + | * [[:Category:CPC_H01L24/97|H01L24/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category: | ||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
* [[:Category:CPC_H01L2224/023|H01L2224/023]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/023|H01L2224/023]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| − | * [[:Category: | + | * [[:Category:CPC_H01L2224/02375|H01L2224/02375]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category: | + | * [[:Category:CPC_H01L2224/02381|H01L2224/02381]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category: | + | * [[:Category:CPC_H01L2224/0401|H01L2224/0401]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L2224/05558|H01L2224/05558]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L2224/05569|H01L2224/05569]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/ | + | * [[:Category:CPC_H01L2224/05572|H01L2224/05572]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| + | * [[:Category:CPC_H01L2224/05655|H01L2224/05655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/05666|H01L2224/05666]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/05684|H01L2224/05684]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/0603|H01L2224/0603]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/06051|H01L2224/06051]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/06102|H01L2224/06102]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/06181|H01L2224/06181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/09051|H01L2224/09051]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/09055|H01L2224/09055]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/14181|H01L2224/14181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/225|H01L2224/225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/82|H01L2224/82]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/82986|H01L2224/82986]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
* [[:Category:CPC_H01L2224/97|H01L2224/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2224/97|H01L2224/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2225/1035|H01L2225/1035]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
* [[:Category:CPC_H01L2924/18162|H01L2924/18162]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L2924/18162|H01L2924/18162]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| − | * [[:Category: | + | * [[:Category:CPC_H01L2924/37001|H01L2924/37001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category: | + | * [[:Category:CPC_G02B6/34|G02B6/34]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents |
| − | * [[:Category: | + | * [[:Category:CPC_G02B6/4201|G02B6/4201]] (Coupling light guides with opto-electronic elements): 1 patents |
| − | * [[:Category:CPC_H01L2924/ | + | * [[:Category:CPC_G02B2006/12104|G02B2006/12104]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents |
| + | * [[:Category:CPC_G02B2006/12114|G02B2006/12114]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents | ||
| + | * [[:Category:CPC_H01L23/46|H01L23/46]] (involving the transfer of heat by flowing fluids (): 1 patents | ||
| + | * [[:Category:CPC_H01L23/3157|H01L23/3157]] ({Partial encapsulation or coating (mask layer used as insulation layer): 1 patents | ||
| + | * [[:Category:CPC_H01L23/433|H01L23/433]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L24/29|H01L24/29]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/29018|H01L2224/29018]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L24/81|H01L24/81]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L25/18|H01L25/18]] (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents | ||
| + | * [[:Category:CPC_H01L2221/68381|H01L2221/68381]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2223/6627|H01L2223/6627]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/24225|H01L2224/24225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2924/1431|H01L2924/1431]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2924/1434|H01L2924/1434]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/2101|H01L2224/2101]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
=== Companies === | === Companies === | ||
| Line 272: | Line 207: | ||
==== List of Companies ==== | ==== List of Companies ==== | ||
| − | * Taiwan Semiconductor Manufacturing | + | * Taiwan Semiconductor Manufacturing Company, Ltd.: 14 patents |
=== Collaborators === | === Collaborators === | ||
| − | * [[:Category: | + | * [[:Category:Kuo-Chung Yee|Kuo-Chung Yee]][[Category:Kuo-Chung Yee]] (5 collaborations) |
| − | + | * [[:Category:Chun-Hui Yu|Chun-Hui Yu]][[Category:Chun-Hui Yu]] (4 collaborations) | |
| − | + | * [[:Category:Chung-Hao Tsai|Chung-Hao Tsai]][[Category:Chung-Hao Tsai]] (3 collaborations) | |
| − | + | * [[:Category:Chuei-Tang WANG|Chuei-Tang WANG]][[Category:Chuei-Tang WANG]] (3 collaborations) | |
| − | + | * [[:Category:Chien-Hsun Chen|Chien-Hsun Chen]][[Category:Chien-Hsun Chen]] (2 collaborations) | |
| − | * [[:Category: | + | * [[:Category:Chung-Ming Weng|Chung-Ming Weng]][[Category:Chung-Ming Weng]] (2 collaborations) |
| − | * [[:Category:Chung-Hao Tsai|Chung-Hao Tsai]][[Category:Chung-Hao Tsai | + | * [[:Category:Chung-Shi Liu|Chung-Shi Liu]][[Category:Chung-Shi Liu]] (2 collaborations) |
| − | |||
| − | * [[:Category: | ||
| − | * [[:Category: | ||
| − | |||
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| − | * [[:Category: | ||
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| − | * [[:Category:Chung- | ||
* [[:Category:Cheng-Chieh Hsieh|Cheng-Chieh Hsieh]][[Category:Cheng-Chieh Hsieh]] (2 collaborations) | * [[:Category:Cheng-Chieh Hsieh|Cheng-Chieh Hsieh]][[Category:Cheng-Chieh Hsieh]] (2 collaborations) | ||
| − | * [[:Category: | + | * [[:Category:Hung-Yi Kuo|Hung-Yi Kuo]][[Category:Hung-Yi Kuo]] (2 collaborations) |
| − | * [[:Category: | + | * [[:Category:Tsung-Yuan Yu|Tsung-Yuan Yu]][[Category:Tsung-Yuan Yu]] (2 collaborations) |
| − | * [[:Category: | + | * [[:Category:Che-Hsiang Hsu|Che-Hsiang Hsu]][[Category:Che-Hsiang Hsu]] (2 collaborations) |
| − | * [[:Category: | + | * [[:Category:Jeng-Nan Hung|Jeng-Nan Hung]][[Category:Jeng-Nan Hung]] (2 collaborations) |
| − | * [[:Category: | + | * [[:Category:Po-Fan Lin|Po-Fan Lin]][[Category:Po-Fan Lin]] (2 collaborations) |
| − | + | * [[:Category:Keng-Han Lin|Keng-Han Lin]][[Category:Keng-Han Lin]] (1 collaborations) | |
| − | * [[:Category: | + | * [[:Category:Hung-Jui Kuo|Hung-Jui Kuo]][[Category:Hung-Jui Kuo]] (1 collaborations) |
| − | * [[:Category: | + | * [[:Category:Hui-Jung Tsai|Hui-Jung Tsai]][[Category:Hui-Jung Tsai]] (1 collaborations) |
| − | * [[:Category: | + | * [[:Category:Wei-Ting Chen|Wei-Ting Chen]][[Category:Wei-Ting Chen]] (1 collaborations) |
| − | + | * [[:Category:Shih-Ya Huang|Shih-Ya Huang]][[Category:Shih-Ya Huang]] (1 collaborations) | |
| − | + | * [[:Category:Chih-Wei Tseng|Chih-Wei Tseng]][[Category:Chih-Wei Tseng]] (1 collaborations) | |
| − | * [[:Category: | + | * [[:Category:Hsing-Kuo Hsia|Hsing-Kuo Hsia]][[Category:Hsing-Kuo Hsia]] (1 collaborations) |
| − | * [[:Category: | + | * [[:Category:Stefan Rusu of Sunnydale CA (US)|Stefan Rusu of Sunnydale CA (US)]][[Category:Stefan Rusu of Sunnydale CA (US)]] (1 collaborations) |
| − | + | * [[:Category:Chewn-Pu Jou|Chewn-Pu Jou]][[Category:Chewn-Pu Jou]] (1 collaborations) | |
| − | * [[:Category:Chih- | + | * [[:Category:Tso-Jung Chang|Tso-Jung Chang]][[Category:Tso-Jung Chang]] (1 collaborations) |
| − | * [[:Category: | + | * [[:Category:Jeng-Shien Hsieh|Jeng-Shien Hsieh]][[Category:Jeng-Shien Hsieh]] (1 collaborations) |
| − | + | * [[:Category:Shih-Ping Lin|Shih-Ping Lin]][[Category:Shih-Ping Lin]] (1 collaborations) | |
| − | * [[:Category: | + | * [[:Category:Chih-Peng Lin|Chih-Peng Lin]][[Category:Chih-Peng Lin]] (1 collaborations) |
| − | |||
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| − | * [[:Category: | ||
| − | * [[:Category: | ||
| − | * [[:Category: | ||
| − | * [[:Category: | ||
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| − | * [[:Category:Chih- | ||
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* [[:Category:Chieh-Yen Chen|Chieh-Yen Chen]][[Category:Chieh-Yen Chen]] (1 collaborations) | * [[:Category:Chieh-Yen Chen|Chieh-Yen Chen]][[Category:Chieh-Yen Chen]] (1 collaborations) | ||
| − | * [[:Category: | + | * [[:Category:Hao-Yi Tsai|Hao-Yi Tsai]][[Category:Hao-Yi Tsai]] (1 collaborations) |
| − | |||
| − | |||
| − | |||
* [[:Category:Hua-Kuei Lin|Hua-Kuei Lin]][[Category:Hua-Kuei Lin]] (1 collaborations) | * [[:Category:Hua-Kuei Lin|Hua-Kuei Lin]][[Category:Hua-Kuei Lin]] (1 collaborations) | ||
| − | * [[:Category: | + | * [[:Category:Chih-Chieh Chang|Chih-Chieh Chang]][[Category:Chih-Chieh Chang]] (1 collaborations) |
| − | * [[:Category: | + | * [[:Category:Chuei-Tang Wang|Chuei-Tang Wang]][[Category:Chuei-Tang Wang]] (1 collaborations) |
| − | + | * [[:Category:Chih-Hsin Lu|Chih-Hsin Lu]][[Category:Chih-Hsin Lu]] (1 collaborations) | |
| − | + | * [[:Category:Shou-Yi Wang|Shou-Yi Wang]][[Category:Shou-Yi Wang]] (1 collaborations) | |
| − | * [[:Category: | + | * [[:Category:Jiun Yi Wu|Jiun Yi Wu]][[Category:Jiun Yi Wu]] (1 collaborations) |
| − | |||
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| − | * [[:Category: | ||
| − | * [[:Category: | ||
| − | |||
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| − | |||
[[Category:Chen-Hua Yu]] | [[Category:Chen-Hua Yu]] | ||
[[Category:Inventors]] | [[Category:Inventors]] | ||
| − | [[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing | + | [[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Company, Ltd.]] |
Revision as of 01:55, 19 July 2024
Contents
Chen-Hua Yu
Executive Summary
Chen-Hua Yu is an inventor who has filed 14 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (8 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (14 patents). Their most frequent collaborators include (5 collaborations), (4 collaborations), (3 collaborations).
Patent Filing Activity
Technology Areas
List of Technology Areas
- H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
- H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
- H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
- H01L23/5383 ({Multilayer substrates (): 5 patents
- H01L2224/214 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
- H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 4 patents
- H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 4 patents
- H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 4 patents
- H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
- H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 4 patents
- H01L21/6835 ({using temporarily an auxiliary support}): 4 patents
- H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L23/3114 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 3 patents
- H01L2224/12105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L2224/18 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L2221/68372 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L2224/24137 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L23/66 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/92244 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/04105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/73267 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2225/06524 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L23/367 (Cooling facilitated by shape of device {(): 2 patents
- H01L24/96 ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 2 patents
- G02B6/12004 (of the integrated circuit kind (electric integrated circuits): 2 patents
- H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L24/24 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 2 patents
- H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/215 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- G02B6/4239 (Coupling light guides with opto-electronic elements): 2 patents
- H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 2 patents
- H01L24/02 ({Bonding areas (on insulating substrates, e.g. chip carriers,): 2 patents
- H01L2224/024 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
- H01L2221/68359 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
- H01L25/0753 (the devices being of a type provided for in group): 1 patents
- H01L33/105 ({with a resonant cavity structure}): 1 patents
- H01L33/465 ({with a resonant cavity structure}): 1 patents
- H01L33/52 (Encapsulations): 1 patents
- H01L2933/0025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2933/0033 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2933/005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01S5/022 (Mountings; Housings): 1 patents
- H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
- H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
- H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents
- H01Q1/2283 ({mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}): 1 patents
- H01Q21/0087 ({Apparatus or processes specially adapted for manufacturing antenna arrays (manufacturing waveguides): 1 patents
- H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
- H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2223/6688 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/32145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/73253 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/81005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2223/6616 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2223/6677 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2223/6683 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2225/06548 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2225/06558 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2225/06572 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2225/06586 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2225/06555 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/5381 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
- H01L2224/95001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- G02B6/13 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
- H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
- H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05018 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05027 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05571 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05624 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05644 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/08237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/09181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/13111 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/13139 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/13147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/244 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/80357 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2225/1023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2225/107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/01013 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/01028 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/01029 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/01047 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/01074 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/01079 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- G02B6/4243 (Coupling light guides with opto-electronic elements): 1 patents
- G02B6/4214 (Coupling light guides with opto-electronic elements): 1 patents
- G02B6/4251 (Coupling light guides with opto-electronic elements): 1 patents
- G02B6/4274 (Coupling light guides with opto-electronic elements): 1 patents
- H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 1 patents
- G02B6/4202 (Coupling light guides with opto-electronic elements): 1 patents
- H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 1 patents
- H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 1 patents
- H01L2225/06544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2225/06568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/1011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/10157 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/08146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/0801 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05016 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05556 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05576 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/13026 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/12 ({Structure, shape, material or disposition of the bump connectors prior to the connecting process}): 1 patents
- H01L25/065 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/02331 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/02379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/48464 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/00014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/10252 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/10253 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/10272 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/10329 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/1203 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/1304 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/1433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/49503 (Lead-frames {or other flat leads (): 1 patents
- H01L24/06 ({of a plurality of bonding areas}): 1 patents
- H01L24/18 ({High density interconnect [HDI] connectors; Manufacturing methods related thereto (interconnection structure between a plurality of semiconductor chips): 1 patents
- H01L24/25 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/02375 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/02381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/0401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05558 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05569 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05572 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05666 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05684 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/0603 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/06051 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/06102 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/06181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/09051 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/09055 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/14181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/82 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/82986 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2225/1035 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/18162 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/37001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- G02B6/34 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
- G02B6/4201 (Coupling light guides with opto-electronic elements): 1 patents
- G02B2006/12104 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
- G02B2006/12114 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
- H01L23/46 (involving the transfer of heat by flowing fluids (): 1 patents
- H01L23/3157 ({Partial encapsulation or coating (mask layer used as insulation layer): 1 patents
- H01L23/433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/29018 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
- H01L2221/68381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2223/6627 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/24225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/1434 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/2101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
Companies
List of Companies
- Taiwan Semiconductor Manufacturing Company, Ltd.: 14 patents
Collaborators
- Kuo-Chung Yee (5 collaborations)
- Chun-Hui Yu (4 collaborations)
- Chung-Hao Tsai (3 collaborations)
- Chuei-Tang WANG (3 collaborations)
- Chien-Hsun Chen (2 collaborations)
- Chung-Ming Weng (2 collaborations)
- Chung-Shi Liu (2 collaborations)
- Cheng-Chieh Hsieh (2 collaborations)
- Hung-Yi Kuo (2 collaborations)
- Tsung-Yuan Yu (2 collaborations)
- Che-Hsiang Hsu (2 collaborations)
- Jeng-Nan Hung (2 collaborations)
- Po-Fan Lin (2 collaborations)
- Keng-Han Lin (1 collaborations)
- Hung-Jui Kuo (1 collaborations)
- Hui-Jung Tsai (1 collaborations)
- Wei-Ting Chen (1 collaborations)
- Shih-Ya Huang (1 collaborations)
- Chih-Wei Tseng (1 collaborations)
- Hsing-Kuo Hsia (1 collaborations)
- Stefan Rusu of Sunnydale CA (US) (1 collaborations)
- Chewn-Pu Jou (1 collaborations)
- Tso-Jung Chang (1 collaborations)
- Jeng-Shien Hsieh (1 collaborations)
- Shih-Ping Lin (1 collaborations)
- Chih-Peng Lin (1 collaborations)
- Chieh-Yen Chen (1 collaborations)
- Hao-Yi Tsai (1 collaborations)
- Hua-Kuei Lin (1 collaborations)
- Chih-Chieh Chang (1 collaborations)
- Chuei-Tang Wang (1 collaborations)
- Chih-Hsin Lu (1 collaborations)
- Shou-Yi Wang (1 collaborations)
- Jiun Yi Wu (1 collaborations)
Subcategories
This category has the following 12 subcategories, out of 12 total.
C
H
J
K
M
S
Categories:
- Kuo-Chung Yee
- Chun-Hui Yu
- Chung-Hao Tsai
- Chuei-Tang WANG
- Chien-Hsun Chen
- Chung-Ming Weng
- Chung-Shi Liu
- Cheng-Chieh Hsieh
- Hung-Yi Kuo
- Tsung-Yuan Yu
- Che-Hsiang Hsu
- Jeng-Nan Hung
- Po-Fan Lin
- Keng-Han Lin
- Hung-Jui Kuo
- Hui-Jung Tsai
- Wei-Ting Chen
- Shih-Ya Huang
- Chih-Wei Tseng
- Hsing-Kuo Hsia
- Stefan Rusu of Sunnydale CA (US)
- Chewn-Pu Jou
- Tso-Jung Chang
- Jeng-Shien Hsieh
- Shih-Ping Lin
- Chih-Peng Lin
- Chieh-Yen Chen
- Hao-Yi Tsai
- Hua-Kuei Lin
- Chih-Chieh Chang
- Chuei-Tang Wang
- Chih-Hsin Lu
- Shou-Yi Wang
- Jiun Yi Wu
- Chen-Hua Yu
- Inventors
- Inventors filing patents with Taiwan Semiconductor Manufacturing Company, Ltd.
