Difference between revisions of "IQM FINLAND OY Patent Application Trends in 2024"
Jump to navigation
Jump to search
Wikipatents (talk | contribs) (Updating IQM FINLAND OY_Patent_Application_Trends_in_2024) |
Wikipatents (talk | contribs) (Updating IQM FINLAND OY_Patent_Application_Trends_in_2024) |
||
| Line 5: | Line 5: | ||
[[File:IQM FINLAND OY Top Technology Areas 2024 - Up to June 2024.png|border|800px|IQM FINLAND OY Top Technology Areas 2024 - Up to June 2024]] | [[File:IQM FINLAND OY Top Technology Areas 2024 - Up to June 2024.png|border|800px|IQM FINLAND OY Top Technology Areas 2024 - Up to June 2024]] | ||
| − | * [[:Category:CPC_G06N10/40|G06N10/40]] ( | + | * [[:Category:CPC_G06N10/40|G06N10/40]] (Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control) |
** Count: 5 patents | ** Count: 5 patents | ||
** Example: [[20240204885. OPTICAL DRIVE FOR QUBITS simplified abstract (IQM FINLAND OY)]] | ** Example: [[20240204885. OPTICAL DRIVE FOR QUBITS simplified abstract (IQM FINLAND OY)]] | ||
| Line 11: | Line 11: | ||
** Count: 3 patents | ** Count: 3 patents | ||
** Example: [[20240107899. SUPERCONDUCTING VACUUM-BRIDGED JOSEPHSON JUNCTIONS simplified abstract (IQM Finland Oy)]] | ** Example: [[20240107899. SUPERCONDUCTING VACUUM-BRIDGED JOSEPHSON JUNCTIONS simplified abstract (IQM Finland Oy)]] | ||
| − | * [[:Category:CPC_H03K17/92|H03K17/92]] ( | + | * [[:Category:CPC_H03K17/92|H03K17/92]] (PULSE TECHNIQUE (measuring pulse characteristics) |
** Count: 3 patents | ** Count: 3 patents | ||
** Example: [[20240204778. MICROWAVE POWER SOURCE, AND A METHOD FOR GENERATING MICROWAVE SIGNALS simplified abstract (IQM FINLAND OY)]] | ** Example: [[20240204778. MICROWAVE POWER SOURCE, AND A METHOD FOR GENERATING MICROWAVE SIGNALS simplified abstract (IQM FINLAND OY)]] | ||
| Line 23: | Line 23: | ||
** Count: 1 patents | ** Count: 1 patents | ||
** Example: [[20240107899. SUPERCONDUCTING VACUUM-BRIDGED JOSEPHSON JUNCTIONS simplified abstract (IQM Finland Oy)]] | ** Example: [[20240107899. SUPERCONDUCTING VACUUM-BRIDGED JOSEPHSON JUNCTIONS simplified abstract (IQM Finland Oy)]] | ||
| − | * [[:Category:CPC_H04B10/70|H04B10/70]] ( | + | * [[:Category:CPC_H04B10/70|H04B10/70]] (Photonic quantum communication) |
** Count: 1 patents | ** Count: 1 patents | ||
** Example: [[20240204885. OPTICAL DRIVE FOR QUBITS simplified abstract (IQM FINLAND OY)]] | ** Example: [[20240204885. OPTICAL DRIVE FOR QUBITS simplified abstract (IQM FINLAND OY)]] | ||
| − | * [[:Category:CPC_H04B10/2575|H04B10/2575]] ( | + | * [[:Category:CPC_H04B10/2575|H04B10/2575]] (Radio-over-fibre, e.g. radio frequency signal modulated onto an optical carrier) |
** Count: 1 patents | ** Count: 1 patents | ||
** Example: [[20240204885. OPTICAL DRIVE FOR QUBITS simplified abstract (IQM FINLAND OY)]] | ** Example: [[20240204885. OPTICAL DRIVE FOR QUBITS simplified abstract (IQM FINLAND OY)]] | ||
| − | * [[:Category:CPC_H03D7/005|H03D7/005]] ( | + | * [[:Category:CPC_H03D7/005|H03D7/005]] (Transference of modulation from one carrier to another, e.g. frequency-changing () |
** Count: 1 patents | ** Count: 1 patents | ||
** Example: [[20240135225. TUNABLE DISSIPATIVE CIRCUITS FOR LOW TEMPERATURE FREQUENCY SHIFTERS, AND METHODS FOR MAKING A FREQUENCY SHIFT AT LOW TEMPERATURE simplified abstract (IQM FINLAND OY)]] | ** Example: [[20240135225. TUNABLE DISSIPATIVE CIRCUITS FOR LOW TEMPERATURE FREQUENCY SHIFTERS, AND METHODS FOR MAKING A FREQUENCY SHIFT AT LOW TEMPERATURE simplified abstract (IQM FINLAND OY)]] | ||
| Line 38: | Line 38: | ||
[[File:IQM FINLAND OY Top Emerging Technology Areas 2024 - Up to June 2024.png|border|800px|IQM FINLAND OY Top Emerging Technology Areas 2024 - Up to June 2024]] | [[File:IQM FINLAND OY Top Emerging Technology Areas 2024 - Up to June 2024.png|border|800px|IQM FINLAND OY Top Emerging Technology Areas 2024 - Up to June 2024]] | ||
| − | * [[:Category:CPC_H01L2224/8113|H01L2224/8113]] ( | + | * [[:Category:CPC_H01L2224/8113|H01L2224/8113]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS) |
** Count: 1 patents | ** Count: 1 patents | ||
** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ||
| − | * [[:Category:CPC_H01L2224/16145|H01L2224/16145]] ( | + | * [[:Category:CPC_H01L2224/16145|H01L2224/16145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS) |
** Count: 1 patents | ** Count: 1 patents | ||
** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ||
| − | * [[:Category:CPC_H01L2223/54426|H01L2223/54426]] ( | + | * [[:Category:CPC_H01L2223/54426|H01L2223/54426]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS) |
** Count: 1 patents | ** Count: 1 patents | ||
** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ||
| − | * [[:Category:CPC_H01L24/81|H01L24/81]] ( | + | * [[:Category:CPC_H01L24/81|H01L24/81]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS) |
** Count: 1 patents | ** Count: 1 patents | ||
** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ||
| − | * [[:Category:CPC_H01L24/16|H01L24/16]] ( | + | * [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS) |
** Count: 1 patents | ** Count: 1 patents | ||
** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ||
| − | * [[:Category:CPC_H01L23/481|H01L23/481]] ( | + | * [[:Category:CPC_H01L23/481|H01L23/481]] (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}) |
** Count: 1 patents | ** Count: 1 patents | ||
** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ||
| − | * [[:Category:CPC_H01L21/76898|H01L21/76898]] ( | + | * [[:Category:CPC_H01L21/76898|H01L21/76898]] ({formed through a semiconductor substrate}) |
** Count: 1 patents | ** Count: 1 patents | ||
** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ||
| − | * [[:Category:CPC_H01L23/544|H01L23/544]] ( | + | * [[:Category:CPC_H01L23/544|H01L23/544]] (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes) |
** Count: 1 patents | ** Count: 1 patents | ||
** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ** Example: [[20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)]] | ||
Latest revision as of 05:13, 20 July 2024
Contents
IQM FINLAND OY Patent Filing Activity
IQM FINLAND OY patent applications in 2024
Top 10 Technology Areas
- G06N10/40 (Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control)
- Count: 5 patents
- Example: 20240204885. OPTICAL DRIVE FOR QUBITS simplified abstract (IQM FINLAND OY)
- H10N69/00 (No explanation available)
- Count: 3 patents
- Example: 20240107899. SUPERCONDUCTING VACUUM-BRIDGED JOSEPHSON JUNCTIONS simplified abstract (IQM Finland Oy)
- H03K17/92 (PULSE TECHNIQUE (measuring pulse characteristics)
- H10N60/12 (No explanation available)
- Count: 1 patents
- Example: 20240107899. SUPERCONDUCTING VACUUM-BRIDGED JOSEPHSON JUNCTIONS simplified abstract (IQM Finland Oy)
- H10N60/0912 (No explanation available)
- Count: 1 patents
- Example: 20240107899. SUPERCONDUCTING VACUUM-BRIDGED JOSEPHSON JUNCTIONS simplified abstract (IQM Finland Oy)
- H10N60/805 (No explanation available)
- Count: 1 patents
- Example: 20240107899. SUPERCONDUCTING VACUUM-BRIDGED JOSEPHSON JUNCTIONS simplified abstract (IQM Finland Oy)
- H04B10/70 (Photonic quantum communication)
- Count: 1 patents
- Example: 20240204885. OPTICAL DRIVE FOR QUBITS simplified abstract (IQM FINLAND OY)
- H04B10/2575 (Radio-over-fibre, e.g. radio frequency signal modulated onto an optical carrier)
- Count: 1 patents
- Example: 20240204885. OPTICAL DRIVE FOR QUBITS simplified abstract (IQM FINLAND OY)
- H03D7/005 (Transference of modulation from one carrier to another, e.g. frequency-changing ()
- H10N60/10 (No explanation available)
Emerging Technology Areas
- H01L2224/8113 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)
- H01L2224/16145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)
- H01L2223/54426 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)
- H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)
- H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)
- H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor})
- Count: 1 patents
- Example: 20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)
- H01L21/76898 ({formed through a semiconductor substrate})
- Count: 1 patents
- Example: 20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)
- H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes)
- Count: 1 patents
- Example: 20240071944. CHIP FABRICATION METHOD AND PRODUCT simplified abstract (IQM FINLAND OY)
- H10N60/82 (No explanation available)
- H10N60/10 (No explanation available)
Top Inventors
- Juha HASSEL (3 patents)
- Mikko MÖTTÖNEN (2 patents)
- Jani TUORILA (2 patents)
- Johannes HEINSOO (2 patents)
- Wei Qiu (1 patent)
- Wei Liu (1 patent)
- Tianyi Li (1 patent)
- Pasi LÄHTEENMÄKI (1 patent)
- Vasilii SEVRIUK (1 patent)
- Juha Hassel (1 patent)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
- Pages with broken file links
- IQM FINLAND OY
- Companies
- CPC H10N60/12
- CPC H10N60/0912
- CPC H10N60/805
- CPC H10N69/00
- CPC H03K17/92
- CPC H04B10/70
- CPC G06N10/40
- CPC H04B10/2575
- CPC H03D7/005
- CPC H10N60/10
- CPC H10N60/82
- CPC H01L23/544
- CPC H01L21/76898
- CPC H01L23/481
- CPC H01L24/16
- CPC H01L24/81
- CPC H01L2223/54426
- CPC H01L2224/16145
- CPC H01L2224/8113
- Patent Trends by Company in 2024
