Difference between revisions of "Category:BAE-YINN HWANG"
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=== Executive Summary === | === Executive Summary === | ||
| − | BAE-YINN HWANG is an inventor who has filed 5 patents. Their primary areas of innovation include | + | BAE-YINN HWANG is an inventor who has filed 5 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (5 patents). Their most frequent collaborators include [[Category:WEI-LI WANG|WEI-LI WANG]] (5 collaborations), [[Category:WEN-FU YU|WEN-FU YU]] (5 collaborations), [[Category:CHIEN-HUNG LIN|CHIEN-HUNG LIN]] (5 collaborations). |
=== Patent Filing Activity === | === Patent Filing Activity === | ||
| Line 11: | Line 11: | ||
==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
| − | * [[:Category:CPC_H01L24/29|H01L24/29]] ( | + | * [[:Category:CPC_H01L24/29|H01L24/29]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents |
| − | * [[:Category:CPC_H01L23/3114|H01L23/3114]] ( | + | * [[:Category:CPC_H01L23/3114|H01L23/3114]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L23/3142|H01L23/3142]] ( | + | * [[:Category:CPC_H01L23/3142|H01L23/3142]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L25/0655|H01L25/0655]] ( | + | * [[:Category:CPC_H01L25/0655|H01L25/0655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L24/48|H01L24/48]] ( | + | * [[:Category:CPC_H01L24/48|H01L24/48]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L23/3121|H01L23/3121]] ( | + | * [[:Category:CPC_H01L23/3121|H01L23/3121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L21/3043|H01L21/3043]] ( | + | * [[:Category:CPC_H01L21/3043|H01L21/3043]] ({Making grooves, e.g. cutting}): 1 patents |
| − | * [[:Category:CPC_H01L24/13|H01L24/13]] ( | + | * [[:Category:CPC_H01L24/13|H01L24/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L24/81|H01L24/81]] ( | + | * [[:Category:CPC_H01L24/81|H01L24/81]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L24/83|H01L24/83]] ( | + | * [[:Category:CPC_H01L24/83|H01L24/83]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L24/85|H01L24/85]] ( | + | * [[:Category:CPC_H01L24/85|H01L24/85]] ({using a wire connector (wire bonding in general): 1 patents |
| − | * [[:Category:CPC_H01L27/14618|H01L27/14618]] ( | + | * [[:Category:CPC_H01L27/14618|H01L27/14618]] ({Containers}): 1 patents |
| − | * [[:Category:CPC_H01L24/32|H01L24/32]] ( | + | * [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L24/73|H01L24/73]] ( | + | * [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/29017|H01L2224/29017]] ( | + | * [[:Category:CPC_H01L2224/29017|H01L2224/29017]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/32225|H01L2224/32225]] ( | + | * [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/48227|H01L2224/48227]] ( | + | * [[:Category:CPC_H01L2224/48227|H01L2224/48227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/73215|H01L2224/73215]] ( | + | * [[:Category:CPC_H01L2224/73215|H01L2224/73215]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L27/14623|H01L27/14623]] ( | + | * [[:Category:CPC_H01L27/14623|H01L27/14623]] ({Optical shielding}): 1 patents |
| − | * [[:Category:CPC_H01L33/44|H01L33/44]] ( | + | * [[:Category:CPC_H01L33/44|H01L33/44]] (characterised by the coatings, e.g. passivation layer or anti-reflective coating): 1 patents |
| − | * [[:Category:CPC_H01L27/14625|H01L27/14625]] ( | + | * [[:Category:CPC_H01L27/14625|H01L27/14625]] ({Optical elements or arrangements associated with the device}): 1 patents |
| − | * [[:Category:CPC_H01L27/14685|H01L27/14685]] ( | + | * [[:Category:CPC_H01L27/14685|H01L27/14685]] ({Process for coatings or optical elements}): 1 patents |
| − | * [[:Category:CPC_H01L31/02327|H01L31/02327]] ( | + | * [[:Category:CPC_H01L31/02327|H01L31/02327]] (Optical elements or arrangements associated with the device (): 1 patents |
| − | * [[:Category:CPC_H01L2933/0058|H01L2933/0058]] ( | + | * [[:Category:CPC_H01L2933/0058|H01L2933/0058]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
=== Companies === | === Companies === | ||
Latest revision as of 01:39, 19 July 2024
Contents
BAE-YINN HWANG
Executive Summary
BAE-YINN HWANG is an inventor who has filed 5 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (5 patents). Their most frequent collaborators include (5 collaborations), (5 collaborations), (5 collaborations).
Patent Filing Activity
Technology Areas
List of Technology Areas
- H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L23/3114 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L23/3142 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L21/3043 ({Making grooves, e.g. cutting}): 1 patents
- H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/85 ({using a wire connector (wire bonding in general): 1 patents
- H01L27/14618 ({Containers}): 1 patents
- H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/29017 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/73215 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L27/14623 ({Optical shielding}): 1 patents
- H01L33/44 (characterised by the coatings, e.g. passivation layer or anti-reflective coating): 1 patents
- H01L27/14625 ({Optical elements or arrangements associated with the device}): 1 patents
- H01L27/14685 ({Process for coatings or optical elements}): 1 patents
- H01L31/02327 (Optical elements or arrangements associated with the device (): 1 patents
- H01L2933/0058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
Companies
List of Companies
- TONG HSING ELECTRONIC INDUSTRIES, LTD.: 5 patents
Collaborators
- WEI-LI WANG (5 collaborations)
- WEN-FU YU (5 collaborations)
- CHIEN-HUNG LIN (5 collaborations)
- CHIA-SHUAI CHANG (2 collaborations)
- JYUN-HUEI JIANG (1 collaborations)
Subcategories
This category has the following 6 subcategories, out of 6 total.
