Difference between revisions of "Category:Koji SAKUI"
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=== Executive Summary === | === Executive Summary === | ||
| − | Koji SAKUI is an inventor who has filed 4 patents. Their primary areas of innovation include | + | Koji SAKUI is an inventor who has filed 4 patents. Their primary areas of innovation include {Geometry or} layout of the interconnection structure {( (2 patents), to produce devices, e.g. integrated circuits, each consisting of a plurality of components (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as ADVANTEST CORPORATION (4 patents). Their most frequent collaborators include [[Category:Shinji SUGATANI|Shinji SUGATANI]] (4 collaborations), [[Category:Takayuki OHBA|Takayuki OHBA]] (4 collaborations), [[Category:Norio CHUJO|Norio CHUJO]] (4 collaborations). |
=== Patent Filing Activity === | === Patent Filing Activity === | ||
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==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
| − | * [[:Category:CPC_H01L23/528|H01L23/528]] ( | + | * [[:Category:CPC_H01L23/528|H01L23/528]] ({Geometry or} layout of the interconnection structure {(): 2 patents |
| − | * [[:Category:CPC_H01L21/823871|H01L21/823871]] ( | + | * [[:Category:CPC_H01L21/823871|H01L21/823871]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents |
| − | * [[:Category:CPC_H01L27/092|H01L27/092]] ( | + | * [[:Category:CPC_H01L27/092|H01L27/092]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L29/0673|H01L29/0673]] ( | + | * [[:Category:CPC_H01L29/0673|H01L29/0673]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L29/42392|H01L29/42392]] ( | + | * [[:Category:CPC_H01L29/42392|H01L29/42392]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L29/775|H01L29/775]] ( | + | * [[:Category:CPC_H01L29/775|H01L29/775]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L24/08|H01L24/08]] ( | + | * [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L21/76898|H01L21/76898]] ( | + | * [[:Category:CPC_H01L21/76898|H01L21/76898]] ({formed through a semiconductor substrate}): 2 patents |
| − | * [[:Category:CPC_H01L23/481|H01L23/481]] ( | + | * [[:Category:CPC_H01L23/481|H01L23/481]] (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 2 patents |
| − | * [[:Category:CPC_H01L23/5226|H01L23/5226]] ( | + | * [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L24/80|H01L24/80]] ( | + | * [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 2 patents |
| − | * [[:Category:CPC_H01L2224/08145|H01L2224/08145]] ( | + | * [[:Category:CPC_H01L2224/08145|H01L2224/08145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L2224/80895|H01L2224/80895]] ( | + | * [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L2224/80896|H01L2224/80896]] ( | + | * [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
=== Companies === | === Companies === | ||
Latest revision as of 15:54, 21 July 2024
Contents
Koji SAKUI
Executive Summary
Koji SAKUI is an inventor who has filed 4 patents. Their primary areas of innovation include {Geometry or} layout of the interconnection structure {( (2 patents), to produce devices, e.g. integrated circuits, each consisting of a plurality of components (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as ADVANTEST CORPORATION (4 patents). Their most frequent collaborators include (4 collaborations), (4 collaborations), (4 collaborations).
Patent Filing Activity
Technology Areas
List of Technology Areas
- H01L23/528 ({Geometry or} layout of the interconnection structure {(): 2 patents
- H01L21/823871 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
- H01L27/092 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L21/76898 ({formed through a semiconductor substrate}): 2 patents
- H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 2 patents
- H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 2 patents
- H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
Companies
List of Companies
- ADVANTEST CORPORATION: 4 patents
Collaborators
- Shinji SUGATANI (4 collaborations)
- Takayuki OHBA (4 collaborations)
- Norio CHUJO (4 collaborations)
- Tadashi FUKUDA (2 collaborations)
Subcategories
This category has the following 5 subcategories, out of 5 total.
