Samsung electronics co., ltd. (20250016974). SEMICONDUCTOR DEVICE: Difference between revisions
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==Inventor(s)== | ==Inventor(s)== | ||
[[:Category:Jihoon Chang of Suwon-si | [[:Category:Jihoon Chang of Suwon-si KR|Jihoon Chang of Suwon-si KR]][[Category:Jihoon Chang of Suwon-si KR]] | ||
[[:Category:Changsik Kim of Suwon-si | [[:Category:Changsik Kim of Suwon-si KR|Changsik Kim of Suwon-si KR]][[Category:Changsik Kim of Suwon-si KR]] | ||
[[:Category:Jaejoon Song of Suwon-si | [[:Category:Jaejoon Song of Suwon-si KR|Jaejoon Song of Suwon-si KR]][[Category:Jaejoon Song of Suwon-si KR]] | ||
==SEMICONDUCTOR DEVICE== | ==SEMICONDUCTOR DEVICE== | ||
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This abstract first appeared for US patent application 20250016974 titled 'SEMICONDUCTOR DEVICE | This abstract first appeared for US patent application 20250016974 titled 'SEMICONDUCTOR DEVICE | ||
==Original Abstract Submitted== | ==Original Abstract Submitted== |
Latest revision as of 08:37, 25 March 2025
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 20250016974 titled 'SEMICONDUCTOR DEVICE
Original Abstract Submitted
a semiconductor device includes a substrate, a first transistor and a second transistor on the substrate, a bit line electrically connected to the first transistor, a channel layer on the bit line, a gate insulating layer on the channel layer, a word line on the gate insulating layer, a landing pad electrically connected to the channel layer, a connection pad electrically connected to the word line and the second transistor, and a division structure separating the landing pad from the connection pad. the division structure includes an intervening portion between the landing pad and the connection pad.