Nvidia corporation (20250003694). WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKING THE SAME

WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKING THE SAME

Organization Name

nvidia corporation

Inventor(s)

Ron Chao of San Diego CA US

Elad Mentovich of Tel Aviv IL

Harrison Sangwha Kim of Morgan Hill CA US

Mark North of Lancaster PA US

Xinwei Lu of Shenzhen CN

Tahir Cader of Spokane Valley WA US

Fei Zhang of Shenzhen CN

Yunseok Kim of Pleasanton CA US

David Haley of Beaverton OR US

Yuezhan Steven Zhu of San Jose CA US

Lei Huang of Shenzhen CN

WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKING THE SAME

This abstract first appeared for US patent application 20250003694 titled 'WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKING THE SAME

Original Abstract Submitted

a heat transfer apparatus including a housing and a wick structure is provided that is configured to dissipate heat from a heat source. the housing defines a chamber that holds working fluid. the wick structure includes a body and pores defined by the body. the heat transfer apparatus defines an evaporator section configured to evaporate the working fluid using heat from a heat source and a condenser section configured to dissipate heat carried by the evaporated working fluid through condensation of the evaporated working fluid. the wick structure has a repeatable, configurable, and controlled geometry optimized to move the working fluid from the condenser section to the evaporator section via capillary action. the body of the wick structure may have a gyroidal geometry. associated methods are also provided.