Difference between revisions of "NANYA TECHNOLOGY CORPORATION patent applications published on July 25th, 2024"

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Summary of the patent applications from NANYA TECHNOLOGY CORPORATION on July 25th, 2024

1. **Summary**: NANYA TECHNOLOGY CORPORATION has recently filed patents related to semiconductor device manufacturing methods, signal receiving circuit technology, and semiconductor package structures. These patents introduce innovative features such as multiple layers, porous structures, and composite conductive features to enhance the performance and functionality of electronic devices.

2. **Key Points of Patents**:

  * Formation of multiple layers and openings on a substrate for semiconductor device manufacturing.
  * Inclusion of supporting layers, mold layers, and conductive layers in the fabrication process.
  * Integration of a noise filtering method in a signal receiving circuit using operational amplifiers and voltage offset adjustment circuits.
  * Incorporation of a first porous layer and composite conductive features in a semiconductor device for improved conductivity and insulation properties.
  * Creation of a semiconductor package structure with recesses, semiconductor dies, and bonded substrates for enhanced device packaging.

3. **Notable Applications**:

  * Semiconductor industry for advanced electronic devices.
  * High-performance computing systems.
  * Telecommunications industry for improved signal reception.
  * Healthcare sector for accurate medical devices.
  * Manufacturing industry for optimized industrial equipment performance.



Patent applications for NANYA TECHNOLOGY CORPORATION on July 25th, 2024

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR PREPARING THE SAME (18598173)

Main Inventor

TZU-CHING TSAI


METHOD OF FORMING ELECTRICAL FUSE MATRIX (18594011)

Main Inventor

Hsih-Yang CHIU


SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME (18098803)

Main Inventor

WU-DER YANG


SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME (18380345)

Main Inventor

WU-DER YANG


SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME (18598167)

Main Inventor

TENG-YEN HUANG


SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18624147)

Main Inventor

Jhen-Yu TSAI


SIGNAL RECEIVING CIRCUIT AND NOISE FILTERING METHOD THEREOF (18156388)

Main Inventor

Shih-Ting Lin


SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME (18156417)

Main Inventor

Wen-Chieh WANG