Difference between revisions of "NANYA TECHNOLOGY CORPORATION patent applications published on July 25th, 2024"
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Latest revision as of 07:46, 26 July 2024
Summary of the patent applications from NANYA TECHNOLOGY CORPORATION on July 25th, 2024
1. **Summary**: NANYA TECHNOLOGY CORPORATION has recently filed patents related to semiconductor device manufacturing methods, signal receiving circuit technology, and semiconductor package structures. These patents introduce innovative features such as multiple layers, porous structures, and composite conductive features to enhance the performance and functionality of electronic devices.
2. **Key Points of Patents**:
* Formation of multiple layers and openings on a substrate for semiconductor device manufacturing. * Inclusion of supporting layers, mold layers, and conductive layers in the fabrication process. * Integration of a noise filtering method in a signal receiving circuit using operational amplifiers and voltage offset adjustment circuits. * Incorporation of a first porous layer and composite conductive features in a semiconductor device for improved conductivity and insulation properties. * Creation of a semiconductor package structure with recesses, semiconductor dies, and bonded substrates for enhanced device packaging.
3. **Notable Applications**:
* Semiconductor industry for advanced electronic devices. * High-performance computing systems. * Telecommunications industry for improved signal reception. * Healthcare sector for accurate medical devices. * Manufacturing industry for optimized industrial equipment performance.
Contents
- 1 Patent applications for NANYA TECHNOLOGY CORPORATION on July 25th, 2024
- 1.1 SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR PREPARING THE SAME (18598173)
- 1.2 METHOD OF FORMING ELECTRICAL FUSE MATRIX (18594011)
- 1.3 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME (18098803)
- 1.4 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME (18380345)
- 1.5 SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME (18598167)
- 1.6 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18624147)
- 1.7 SIGNAL RECEIVING CIRCUIT AND NOISE FILTERING METHOD THEREOF (18156388)
- 1.8 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME (18156417)
Patent applications for NANYA TECHNOLOGY CORPORATION on July 25th, 2024
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR PREPARING THE SAME (18598173)
Main Inventor
TZU-CHING TSAI
METHOD OF FORMING ELECTRICAL FUSE MATRIX (18594011)
Main Inventor
Hsih-Yang CHIU
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME (18098803)
Main Inventor
WU-DER YANG
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME (18380345)
Main Inventor
WU-DER YANG
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME (18598167)
Main Inventor
TENG-YEN HUANG
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18624147)
Main Inventor
Jhen-Yu TSAI
SIGNAL RECEIVING CIRCUIT AND NOISE FILTERING METHOD THEREOF (18156388)
Main Inventor
Shih-Ting Lin
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME (18156417)
Main Inventor
Wen-Chieh WANG